SG80291G - Process for preparing a non-conductive substrate for eletroplating - Google Patents
Process for preparing a non-conductive substrate for eletroplatingInfo
- Publication number
- SG80291G SG80291G SG80291A SG80291A SG80291G SG 80291 G SG80291 G SG 80291G SG 80291 A SG80291 A SG 80291A SG 80291 A SG80291 A SG 80291A SG 80291 G SG80291 G SG 80291G
- Authority
- SG
- Singapore
- Prior art keywords
- eletroplating
- preparing
- conductive substrate
- conductive
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72196485A | 1985-04-11 | 1985-04-11 | |
US06/802,892 US4619741A (en) | 1985-04-11 | 1985-11-29 | Process for preparing a non-conductive substrate for electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
SG80291G true SG80291G (en) | 1991-11-15 |
Family
ID=27110515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG80291A SG80291G (en) | 1985-04-11 | 1991-10-04 | Process for preparing a non-conductive substrate for eletroplating |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0665755B2 (ja) |
CA (1) | CA1294425C (ja) |
DE (1) | DE3680699D1 (ja) |
HK (1) | HK98491A (ja) |
SG (1) | SG80291G (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100034965A1 (en) * | 2008-08-06 | 2010-02-11 | Retallick Richard C | Direct Metallization Process |
CN111910231B (zh) * | 2020-07-22 | 2022-09-27 | 东莞市百镀通五金电镀实业有限公司 | 一种玻纤增强塑胶粗化处理用粗化液及粗化方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5056331A (ja) * | 1973-09-19 | 1975-05-17 | ||
JPS523986A (en) * | 1975-06-24 | 1977-01-12 | Yoshitaka Aoyama | Process for detecting position of cylinder rod and apparatus therefor |
JPS608713B2 (ja) * | 1977-08-18 | 1985-03-05 | 住友ノ−ガタック株式会社 | 部分的に金属メッキが施された樹脂製品 |
-
1986
- 1986-04-10 DE DE8686302661T patent/DE3680699D1/de not_active Expired - Lifetime
-
1990
- 1990-01-23 CA CA000615622A patent/CA1294425C/en not_active Expired - Lifetime
- 1990-05-23 JP JP2131324A patent/JPH0665755B2/ja not_active Expired - Lifetime
-
1991
- 1991-10-04 SG SG80291A patent/SG80291G/en unknown
- 1991-12-05 HK HK98491A patent/HK98491A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK98491A (en) | 1991-12-13 |
JPH03207890A (ja) | 1991-09-11 |
CA1294425C (en) | 1992-01-21 |
JPH0665755B2 (ja) | 1994-08-24 |
DE3680699D1 (de) | 1991-09-12 |
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