HK98491A - Process for preparing a non-conductive substrate for electroplating - Google Patents

Process for preparing a non-conductive substrate for electroplating

Info

Publication number
HK98491A
HK98491A HK98491A HK98491A HK98491A HK 98491 A HK98491 A HK 98491A HK 98491 A HK98491 A HK 98491A HK 98491 A HK98491 A HK 98491A HK 98491 A HK98491 A HK 98491A
Authority
HK
Hong Kong
Prior art keywords
electroplating
preparing
conductive substrate
conductive
substrate
Prior art date
Application number
HK98491A
Other languages
English (en)
Inventor
Karl Leonard Minten
Galina Pismennaya
Original Assignee
Olin Hunt Sub Iii Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/802,892 external-priority patent/US4619741A/en
Application filed by Olin Hunt Sub Iii Corp filed Critical Olin Hunt Sub Iii Corp
Publication of HK98491A publication Critical patent/HK98491A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
HK98491A 1985-04-11 1991-12-05 Process for preparing a non-conductive substrate for electroplating HK98491A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72196485A 1985-04-11 1985-04-11
US06/802,892 US4619741A (en) 1985-04-11 1985-11-29 Process for preparing a non-conductive substrate for electroplating

Publications (1)

Publication Number Publication Date
HK98491A true HK98491A (en) 1991-12-13

Family

ID=27110515

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98491A HK98491A (en) 1985-04-11 1991-12-05 Process for preparing a non-conductive substrate for electroplating

Country Status (5)

Country Link
JP (1) JPH0665755B2 (ja)
CA (1) CA1294425C (ja)
DE (1) DE3680699D1 (ja)
HK (1) HK98491A (ja)
SG (1) SG80291G (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100034965A1 (en) * 2008-08-06 2010-02-11 Retallick Richard C Direct Metallization Process
CN111910231B (zh) * 2020-07-22 2022-09-27 东莞市百镀通五金电镀实业有限公司 一种玻纤增强塑胶粗化处理用粗化液及粗化方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056331A (ja) * 1973-09-19 1975-05-17
JPS523986A (en) * 1975-06-24 1977-01-12 Yoshitaka Aoyama Process for detecting position of cylinder rod and apparatus therefor
JPS608713B2 (ja) * 1977-08-18 1985-03-05 住友ノ−ガタック株式会社 部分的に金属メッキが施された樹脂製品

Also Published As

Publication number Publication date
SG80291G (en) 1991-11-15
JPH03207890A (ja) 1991-09-11
CA1294425C (en) 1992-01-21
DE3680699D1 (de) 1991-09-12
JPH0665755B2 (ja) 1994-08-24

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20060409