DE3680699D1 - Verfahren zur vorbereitung eines leitfaehigen traegers fuer elektroplattierung. - Google Patents

Verfahren zur vorbereitung eines leitfaehigen traegers fuer elektroplattierung.

Info

Publication number
DE3680699D1
DE3680699D1 DE8686302661T DE3680699T DE3680699D1 DE 3680699 D1 DE3680699 D1 DE 3680699D1 DE 8686302661 T DE8686302661 T DE 8686302661T DE 3680699 T DE3680699 T DE 3680699T DE 3680699 D1 DE3680699 D1 DE 3680699D1
Authority
DE
Germany
Prior art keywords
electroplating
preparing
conductive carrier
conductive
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686302661T
Other languages
English (en)
Inventor
Karl Leonard Minten
Galina Pismennaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Hunt Sub III Corp
Original Assignee
Olin Hunt Sub III Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/802,892 external-priority patent/US4619741A/en
Application filed by Olin Hunt Sub III Corp filed Critical Olin Hunt Sub III Corp
Application granted granted Critical
Publication of DE3680699D1 publication Critical patent/DE3680699D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
DE8686302661T 1985-04-11 1986-04-10 Verfahren zur vorbereitung eines leitfaehigen traegers fuer elektroplattierung. Expired - Lifetime DE3680699D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72196485A 1985-04-11 1985-04-11
US06/802,892 US4619741A (en) 1985-04-11 1985-11-29 Process for preparing a non-conductive substrate for electroplating

Publications (1)

Publication Number Publication Date
DE3680699D1 true DE3680699D1 (de) 1991-09-12

Family

ID=27110515

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686302661T Expired - Lifetime DE3680699D1 (de) 1985-04-11 1986-04-10 Verfahren zur vorbereitung eines leitfaehigen traegers fuer elektroplattierung.

Country Status (5)

Country Link
JP (1) JPH0665755B2 (de)
CA (1) CA1294425C (de)
DE (1) DE3680699D1 (de)
HK (1) HK98491A (de)
SG (1) SG80291G (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100034965A1 (en) * 2008-08-06 2010-02-11 Retallick Richard C Direct Metallization Process
CN111910231B (zh) * 2020-07-22 2022-09-27 东莞市百镀通五金电镀实业有限公司 一种玻纤增强塑胶粗化处理用粗化液及粗化方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056331A (de) * 1973-09-19 1975-05-17
JPS523986A (en) * 1975-06-24 1977-01-12 Yoshitaka Aoyama Process for detecting position of cylinder rod and apparatus therefor
JPS608713B2 (ja) * 1977-08-18 1985-03-05 住友ノ−ガタック株式会社 部分的に金属メッキが施された樹脂製品

Also Published As

Publication number Publication date
HK98491A (en) 1991-12-13
JPH03207890A (ja) 1991-09-11
JPH0665755B2 (ja) 1994-08-24
CA1294425C (en) 1992-01-21
SG80291G (en) 1991-11-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition