SG77528A1 - Conductive paste for mlc termination - Google Patents

Conductive paste for mlc termination

Info

Publication number
SG77528A1
SG77528A1 SG1995002381A SG1995002381A SG77528A1 SG 77528 A1 SG77528 A1 SG 77528A1 SG 1995002381 A SG1995002381 A SG 1995002381A SG 1995002381 A SG1995002381 A SG 1995002381A SG 77528 A1 SG77528 A1 SG 77528A1
Authority
SG
Singapore
Prior art keywords
mlc
termination
conductive paste
paste
conductive
Prior art date
Application number
SG1995002381A
Other languages
English (en)
Inventor
Akira Inaba
Takayuki Oba
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of SG77528A1 publication Critical patent/SG77528A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C32/00Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0089Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with other, not previously mentioned inorganic compounds as the main non-metallic constituent, e.g. sulfides, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
SG1995002381A 1994-12-28 1995-12-28 Conductive paste for mlc termination SG77528A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6327130A JPH08186049A (ja) 1994-12-28 1994-12-28 多層コンデンサー用端子電極組成物

Publications (1)

Publication Number Publication Date
SG77528A1 true SG77528A1 (en) 2001-01-16

Family

ID=18195652

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995002381A SG77528A1 (en) 1994-12-28 1995-12-28 Conductive paste for mlc termination

Country Status (6)

Country Link
EP (1) EP0720187A1 (ko)
JP (1) JPH08186049A (ko)
KR (1) KR960027014A (ko)
CN (1) CN1130294A (ko)
SG (1) SG77528A1 (ko)
TW (1) TW331011B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0307547D0 (en) 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7749592B2 (en) 2007-02-06 2010-07-06 Tdk Corpoation Multilayer ceramic substrate
EP2307326A1 (en) * 2008-06-26 2011-04-13 E. I. du Pont de Nemours and Company Glass compositions used in conductors for photovoltaic cells
JP5351100B2 (ja) * 2010-07-02 2013-11-27 株式会社ノリタケカンパニーリミテド 太陽電池用導電性ペースト組成物
US20160276303A1 (en) 2015-03-17 2016-09-22 E I Du Pont De Nemours And Company Electronic component
US20170200556A1 (en) 2016-01-11 2017-07-13 E I Du Pont De Nemours And Company Electric component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3922387A (en) 1973-08-28 1975-11-25 Du Pont Metallizations comprising nickel oxide
JPH0423308A (ja) * 1990-05-14 1992-01-27 Mitsubishi Materials Corp セラミックコンデンサ
JPH0428110A (ja) * 1990-05-23 1992-01-30 Kyocera Corp 積層型コンデンサの端子電極形成用導電性ペースト及び積層型コンデンサ
JPH06188145A (ja) * 1992-10-22 1994-07-08 Kyocera Corp 積層型磁器コンデンサ

Also Published As

Publication number Publication date
TW331011B (en) 1998-05-01
JPH08186049A (ja) 1996-07-16
CN1130294A (zh) 1996-09-04
EP0720187A1 (en) 1996-07-03
KR960027014A (ko) 1996-07-22

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