SG74688A1 - Packing system of electronic components - Google Patents

Packing system of electronic components

Info

Publication number
SG74688A1
SG74688A1 SG1999000003A SG1999000003A SG74688A1 SG 74688 A1 SG74688 A1 SG 74688A1 SG 1999000003 A SG1999000003 A SG 1999000003A SG 1999000003 A SG1999000003 A SG 1999000003A SG 74688 A1 SG74688 A1 SG 74688A1
Authority
SG
Singapore
Prior art keywords
electronic components
packing system
packing
electronic
components
Prior art date
Application number
SG1999000003A
Other languages
English (en)
Inventor
Katsumi Nomura
Masao Ukita
Yoshio Mikami
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG74688A1 publication Critical patent/SG74688A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG1999000003A 1998-03-17 1999-01-04 Packing system of electronic components SG74688A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10066603A JPH11263387A (ja) 1998-03-17 1998-03-17 電子部品の包装装置

Publications (1)

Publication Number Publication Date
SG74688A1 true SG74688A1 (en) 2000-08-22

Family

ID=13320662

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1999000003A SG74688A1 (en) 1998-03-17 1999-01-04 Packing system of electronic components

Country Status (7)

Country Link
US (1) US6142307A (ja)
EP (1) EP0943555B1 (ja)
JP (1) JPH11263387A (ja)
KR (1) KR100449119B1 (ja)
CN (1) CN1115286C (ja)
DE (1) DE69924551T2 (ja)
SG (1) SG74688A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4460935B2 (ja) * 2004-04-02 2010-05-12 東芝モバイルディスプレイ株式会社 平面表示装置等の電子・電気製品の製造方法、及びこのための帯状収納体
CN1899929B (zh) * 2005-07-19 2010-04-21 兴亚株式会社 包装带
CN104340516A (zh) * 2013-07-31 2015-02-11 弗兰克·魏 片式电子元器件包装结构及其制造方法和使用方法
CN105966699B (zh) * 2016-06-30 2018-09-14 南通康比电子有限公司 二极管编带装包工装及其方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497058A (en) * 1967-12-18 1970-02-24 Allen Bradley Co Package for electronic components
JPS60144298U (ja) * 1984-03-05 1985-09-25 株式会社村田製作所 チツプ型電子部品連
JPS6151896A (ja) * 1984-08-21 1986-03-14 株式会社村田製作所 電子部品連
US4753003A (en) * 1987-05-21 1988-06-28 Mcdonnell Douglas Corp. Bandoleer of contact carriers for use in power crimping tool
JPH02219760A (ja) * 1989-02-20 1990-09-03 Purantetsuku:Kk 部品の包装方法
JP2855673B2 (ja) * 1989-07-14 1999-02-10 セイコーエプソン株式会社 搬送テープ
JPH0418263A (ja) * 1990-05-07 1992-01-22 Nippon Chemicon Corp 電子部品用キャリアテープ
US5265723A (en) * 1992-09-30 1993-11-30 Advantek, Inc. Microchip storage tape and cover therefor
JPH0565171A (ja) * 1991-09-10 1993-03-19 Nec Toyama Ltd チツプ型電子部品のキヤリアテーピング包装およびキヤリアテープ
JP2917621B2 (ja) * 1991-11-08 1999-07-12 松下電器産業株式会社 電解コンデンサの包装装置
JPH05213365A (ja) * 1992-01-09 1993-08-24 Nec Corp エンボスキャリアテーピングの構造
US5494168A (en) * 1994-05-12 1996-02-27 National Electronics Corp. Surface mount component dispensing system
US5447784A (en) * 1994-06-01 1995-09-05 Rexham Industries Corp. Electrostatic dissipating cover tape
US5690233A (en) * 1995-03-30 1997-11-25 Kaneko Denki Kabushiki Kaisha Carrier tape with recesses for electronic parts

Also Published As

Publication number Publication date
EP0943555A1 (en) 1999-09-22
JPH11263387A (ja) 1999-09-28
KR19990077387A (ko) 1999-10-25
US6142307A (en) 2000-11-07
CN1229047A (zh) 1999-09-22
EP0943555B1 (en) 2005-04-06
DE69924551D1 (de) 2005-05-12
CN1115286C (zh) 2003-07-23
KR100449119B1 (ko) 2004-09-16
DE69924551T2 (de) 2005-09-01

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