SG73416A1 - Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material - Google Patents
Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such materialInfo
- Publication number
- SG73416A1 SG73416A1 SG1996007706A SG1996007706A SG73416A1 SG 73416 A1 SG73416 A1 SG 73416A1 SG 1996007706 A SG1996007706 A SG 1996007706A SG 1996007706 A SG1996007706 A SG 1996007706A SG 73416 A1 SG73416 A1 SG 73416A1
- Authority
- SG
- Singapore
- Prior art keywords
- pressing
- plastic
- mould cavity
- pct
- cures
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
- B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/228—Injection plunger or ram: transfer molding type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9200127A NL9200127A (nl) | 1992-01-23 | 1992-01-23 | Werkwijze voor het in een vormholte persen van een door een reactie uithardende kunststof, een daarbij te gebruiken pilvormig pershulpmateriaal alsmede een houder uit dergelijk materiaal. |
Publications (1)
Publication Number | Publication Date |
---|---|
SG73416A1 true SG73416A1 (en) | 2000-06-20 |
Family
ID=19860342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996007706A SG73416A1 (en) | 1992-01-23 | 1993-01-22 | Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material |
Country Status (14)
Country | Link |
---|---|
US (1) | US5431854A (ko) |
EP (1) | EP0624123B1 (ko) |
JP (1) | JP3225042B2 (ko) |
KR (1) | KR100260761B1 (ko) |
AT (1) | ATE158224T1 (ko) |
AU (1) | AU3576193A (ko) |
CA (1) | CA2128228A1 (ko) |
DE (1) | DE69314009T2 (ko) |
ES (1) | ES2107656T3 (ko) |
HK (1) | HK1000488A1 (ko) |
NL (1) | NL9200127A (ko) |
RU (1) | RU2106249C1 (ko) |
SG (1) | SG73416A1 (ko) |
WO (1) | WO1993014920A1 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9302265A (nl) * | 1993-12-24 | 1995-07-17 | Asm Fico Tooling | Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets. |
EP0730937B1 (en) * | 1994-11-21 | 1998-02-18 | Apic Yamada Corporation | A resin molding machine with release film |
CA2208355A1 (en) * | 1994-12-23 | 1996-07-04 | Cookson Singapore Pte Ltd | Improved process for making preforms useful for encapsulating semiconductors |
US6531083B1 (en) * | 1995-05-02 | 2003-03-11 | Texas Instruments Incorporated | Sproutless pre-packaged molding for component encapsulation |
EP0742586A3 (en) * | 1995-05-02 | 1998-03-11 | Texas Instruments Incorporated | Improvements in or relating to integrated circuits |
EP0759349B1 (en) * | 1995-08-23 | 2002-06-05 | Apic Yamada Corporation | Automatic molding machine using release film |
US5885506A (en) * | 1996-05-02 | 1999-03-23 | Texas Instruments Incorporated | Pre-packaged molding for component encapsulation |
DE19731202A1 (de) * | 1997-07-21 | 1999-01-28 | Siemens Ag | Materialtablette sowie Verfahren zum Herstellen eines Kunststoffverbundkörpers |
US6592943B2 (en) | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6544816B1 (en) | 1999-08-20 | 2003-04-08 | Texas Instruments Incorporated | Method of encapsulating thin semiconductor chip-scale packages |
US6558600B1 (en) * | 2000-05-04 | 2003-05-06 | Micron Technology, Inc. | Method for packaging microelectronic substrates |
US20020116250A1 (en) * | 2001-02-20 | 2002-08-22 | Menachem Levanoni | Adaptive analysis techniques for enhancing retail outlets placements |
US6666997B2 (en) * | 2001-10-02 | 2003-12-23 | Micron Technology, Inc. | Method for removing cleaning compound flash from mold vents |
US7264456B2 (en) * | 2001-10-10 | 2007-09-04 | Micron Technology, Inc. | Leadframe and method for reducing mold compound adhesion problems |
US7288292B2 (en) * | 2003-03-18 | 2007-10-30 | International Business Machines Corporation | Ultra low k (ULK) SiCOH film and method |
NL1026001C2 (nl) * | 2004-04-22 | 2005-10-25 | Fico Bv | Doseereenheid met omhulmateriaal en werkwijze voor het vervaardigen van zo een doseereenheid. |
US20060261498A1 (en) * | 2005-05-17 | 2006-11-23 | Micron Technology, Inc. | Methods and apparatuses for encapsulating microelectronic devices |
US7833456B2 (en) | 2007-02-23 | 2010-11-16 | Micron Technology, Inc. | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece |
WO2010056212A2 (en) * | 2008-11-17 | 2010-05-20 | Pyxis Systems Integration Pte Ltd | Method for encapsulating semiconductor dies |
US20140124926A1 (en) * | 2012-11-07 | 2014-05-08 | Corey Reichman | Method And System For A Chaser Pellet In A Semiconductor Package Mold Process |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483287A (en) * | 1966-04-12 | 1969-12-09 | Goodrich Co B F | Transfer molding method |
DE1812217A1 (de) * | 1968-01-24 | 1969-08-14 | Dow Corning | Verfahren zum Pressspritzen von fluessigen Massen |
US3870449A (en) * | 1973-07-23 | 1975-03-11 | Gen Tire & Rubber Co | Permanent flashpad for transfer molding |
US3911075A (en) * | 1974-02-28 | 1975-10-07 | Western Electric Co | Transfer molding thermosetting polymeric material |
JPS56100429A (en) * | 1980-01-16 | 1981-08-12 | Hitachi Ltd | Resin molding method |
JPS56107559A (en) * | 1980-01-30 | 1981-08-26 | Mitsubishi Electric Corp | Manufacture of resin-sealed semiconductor device |
JPS5715427A (en) * | 1980-06-30 | 1982-01-26 | Mitsubishi Electric Corp | Method of plastic sealing for semiconductor device |
JPS59151436A (ja) * | 1983-02-17 | 1984-08-29 | Rohm Co Ltd | 半導体装置の樹脂封止方法 |
US5043199A (en) * | 1988-10-31 | 1991-08-27 | Fujitsu Limited | Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet |
JPH03157942A (ja) * | 1989-11-15 | 1991-07-05 | Nec Yamaguchi Ltd | 樹脂封止型半導体集積回路の製造方法 |
-
1992
- 1992-01-23 NL NL9200127A patent/NL9200127A/nl not_active Application Discontinuation
-
1993
- 1993-01-22 EP EP93904396A patent/EP0624123B1/en not_active Expired - Lifetime
- 1993-01-22 ES ES93904396T patent/ES2107656T3/es not_active Expired - Lifetime
- 1993-01-22 DE DE69314009T patent/DE69314009T2/de not_active Expired - Fee Related
- 1993-01-22 KR KR1019940702534A patent/KR100260761B1/ko not_active IP Right Cessation
- 1993-01-22 AU AU35761/93A patent/AU3576193A/en not_active Abandoned
- 1993-01-22 CA CA002128228A patent/CA2128228A1/en not_active Abandoned
- 1993-01-22 JP JP51310893A patent/JP3225042B2/ja not_active Expired - Fee Related
- 1993-01-22 SG SG1996007706A patent/SG73416A1/en unknown
- 1993-01-22 WO PCT/NL1993/000024 patent/WO1993014920A1/en active IP Right Grant
- 1993-01-22 RU RU94036765A patent/RU2106249C1/ru active
- 1993-01-22 US US08/256,681 patent/US5431854A/en not_active Expired - Fee Related
- 1993-01-22 AT AT93904396T patent/ATE158224T1/de not_active IP Right Cessation
-
1997
- 1997-10-24 HK HK97102019A patent/HK1000488A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0624123A1 (en) | 1994-11-17 |
DE69314009D1 (de) | 1997-10-23 |
EP0624123B1 (en) | 1997-09-17 |
RU2106249C1 (ru) | 1998-03-10 |
DE69314009T2 (de) | 1998-02-19 |
ES2107656T3 (es) | 1997-12-01 |
WO1993014920A1 (en) | 1993-08-05 |
NL9200127A (nl) | 1993-08-16 |
KR950700159A (ko) | 1995-01-16 |
JP3225042B2 (ja) | 2001-11-05 |
KR100260761B1 (ko) | 2000-07-01 |
ATE158224T1 (de) | 1997-10-15 |
AU3576193A (en) | 1993-09-01 |
US5431854A (en) | 1995-07-11 |
JPH07503418A (ja) | 1995-04-13 |
RU94036765A (ru) | 1996-05-20 |
HK1000488A1 (en) | 1998-03-27 |
CA2128228A1 (en) | 1993-08-05 |
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