ES2107656T3 - Procedimiento para prensar un plastico endurecible mediante una reaccion, dentro de una cavidad de molde, auxiliar de presion en forma de pastilla para ser utilizado en este procedimiento, y soporte compuesto de tal material. - Google Patents

Procedimiento para prensar un plastico endurecible mediante una reaccion, dentro de una cavidad de molde, auxiliar de presion en forma de pastilla para ser utilizado en este procedimiento, y soporte compuesto de tal material.

Info

Publication number
ES2107656T3
ES2107656T3 ES93904396T ES93904396T ES2107656T3 ES 2107656 T3 ES2107656 T3 ES 2107656T3 ES 93904396 T ES93904396 T ES 93904396T ES 93904396 T ES93904396 T ES 93904396T ES 2107656 T3 ES2107656 T3 ES 2107656T3
Authority
ES
Spain
Prior art keywords
procedure
pressing
plastic
reaction
pct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93904396T
Other languages
English (en)
Inventor
Ireneus Johannes Theodorus Pas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3P Licensing BV
Original Assignee
3P Licensing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing BV filed Critical 3P Licensing BV
Application granted granted Critical
Publication of ES2107656T3 publication Critical patent/ES2107656T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Abstract

UN METODO PARA PRENSAR UN PLASTICO (6), QUE ENDURECE POR MEDIO DE UNA REACCION, DESDE UNA CAMARA DE DESPLAZAMIENTO (4) A TRAVES DE AL MENOS UN CANAL DE INYECCION (3) Y UNA ABERTURA (2) EN UNA CAVIDAD DE MOLDEO (1), DICHO METODO COMPRENDE AL MENOS LAS SIGUIENTES ETAPAS: COMPRIMIR EL PLASTICO (6) CON UNA CANTIDAD DE UN AUXILIAR DE PRENSADO (7) EN LA CAMARA DE DESPLAZAMIENTO (4); PRENSAR EL PLASTICO (6) EN LA CAVIDAD DE MOLDEO (1); Y PERMITIR AL PLASTICO ENDURECER BAJO PRESION EN LA CAVIDAD DE MOLDEO, SIENDO EL AUXILIAR DE PRENSADO (7) PLASTICAMENTE DEFORMABLE BAJO LAS CONDICIONES DE PRESION Y SIENDO LA CANTIDAD DEL MISMO SUFICIENTE PARA SER PRENSADA EN LAS PROXIMIDADES DE LA ABERTURA (2) DE LA CAVIDAD DE MOLDEO (1). PREFERIBLEMENTE EL AUXILIAR DE PRESION (7) ES UN TERMOPLASTICO.
ES93904396T 1992-01-23 1993-01-22 Procedimiento para prensar un plastico endurecible mediante una reaccion, dentro de una cavidad de molde, auxiliar de presion en forma de pastilla para ser utilizado en este procedimiento, y soporte compuesto de tal material. Expired - Lifetime ES2107656T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9200127A NL9200127A (nl) 1992-01-23 1992-01-23 Werkwijze voor het in een vormholte persen van een door een reactie uithardende kunststof, een daarbij te gebruiken pilvormig pershulpmateriaal alsmede een houder uit dergelijk materiaal.

Publications (1)

Publication Number Publication Date
ES2107656T3 true ES2107656T3 (es) 1997-12-01

Family

ID=19860342

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93904396T Expired - Lifetime ES2107656T3 (es) 1992-01-23 1993-01-22 Procedimiento para prensar un plastico endurecible mediante una reaccion, dentro de una cavidad de molde, auxiliar de presion en forma de pastilla para ser utilizado en este procedimiento, y soporte compuesto de tal material.

Country Status (14)

Country Link
US (1) US5431854A (es)
EP (1) EP0624123B1 (es)
JP (1) JP3225042B2 (es)
KR (1) KR100260761B1 (es)
AT (1) ATE158224T1 (es)
AU (1) AU3576193A (es)
CA (1) CA2128228A1 (es)
DE (1) DE69314009T2 (es)
ES (1) ES2107656T3 (es)
HK (1) HK1000488A1 (es)
NL (1) NL9200127A (es)
RU (1) RU2106249C1 (es)
SG (1) SG73416A1 (es)
WO (1) WO1993014920A1 (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9302265A (nl) * 1993-12-24 1995-07-17 Asm Fico Tooling Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
DE69501632T2 (de) * 1994-11-21 1998-07-23 Apic Yamada Corp Harzformmaschine mit Trennfolie
CN1066672C (zh) * 1994-12-23 2001-06-06 库克森新加坡有限公司 用于制造包封半导体的预型件的改进方法
EP0742586A3 (en) * 1995-05-02 1998-03-11 Texas Instruments Incorporated Improvements in or relating to integrated circuits
US6531083B1 (en) * 1995-05-02 2003-03-11 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
EP0759349B1 (en) * 1995-08-23 2002-06-05 Apic Yamada Corporation Automatic molding machine using release film
US5885506A (en) * 1996-05-02 1999-03-23 Texas Instruments Incorporated Pre-packaged molding for component encapsulation
DE19731202A1 (de) * 1997-07-21 1999-01-28 Siemens Ag Materialtablette sowie Verfahren zum Herstellen eines Kunststoffverbundkörpers
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6544816B1 (en) 1999-08-20 2003-04-08 Texas Instruments Incorporated Method of encapsulating thin semiconductor chip-scale packages
US6558600B1 (en) * 2000-05-04 2003-05-06 Micron Technology, Inc. Method for packaging microelectronic substrates
US20020116250A1 (en) * 2001-02-20 2002-08-22 Menachem Levanoni Adaptive analysis techniques for enhancing retail outlets placements
US6666997B2 (en) * 2001-10-02 2003-12-23 Micron Technology, Inc. Method for removing cleaning compound flash from mold vents
US7264456B2 (en) * 2001-10-10 2007-09-04 Micron Technology, Inc. Leadframe and method for reducing mold compound adhesion problems
US7288292B2 (en) * 2003-03-18 2007-10-30 International Business Machines Corporation Ultra low k (ULK) SiCOH film and method
NL1026001C2 (nl) * 2004-04-22 2005-10-25 Fico Bv Doseereenheid met omhulmateriaal en werkwijze voor het vervaardigen van zo een doseereenheid.
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US7833456B2 (en) 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
TWI515842B (zh) * 2008-11-17 2016-01-01 先進封裝技術私人有限公司 半導體晶片封裝系統
US20140124926A1 (en) * 2012-11-07 2014-05-08 Corey Reichman Method And System For A Chaser Pellet In A Semiconductor Package Mold Process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483287A (en) * 1966-04-12 1969-12-09 Goodrich Co B F Transfer molding method
DE1812217A1 (de) * 1968-01-24 1969-08-14 Dow Corning Verfahren zum Pressspritzen von fluessigen Massen
US3870449A (en) * 1973-07-23 1975-03-11 Gen Tire & Rubber Co Permanent flashpad for transfer molding
US3911075A (en) * 1974-02-28 1975-10-07 Western Electric Co Transfer molding thermosetting polymeric material
JPS56100429A (en) * 1980-01-16 1981-08-12 Hitachi Ltd Resin molding method
JPS56107559A (en) * 1980-01-30 1981-08-26 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device
JPS5715427A (en) * 1980-06-30 1982-01-26 Mitsubishi Electric Corp Method of plastic sealing for semiconductor device
JPS59151436A (ja) * 1983-02-17 1984-08-29 Rohm Co Ltd 半導体装置の樹脂封止方法
US5043199A (en) * 1988-10-31 1991-08-27 Fujitsu Limited Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
JPH03157942A (ja) * 1989-11-15 1991-07-05 Nec Yamaguchi Ltd 樹脂封止型半導体集積回路の製造方法

Also Published As

Publication number Publication date
SG73416A1 (en) 2000-06-20
KR100260761B1 (ko) 2000-07-01
JP3225042B2 (ja) 2001-11-05
ATE158224T1 (de) 1997-10-15
JPH07503418A (ja) 1995-04-13
CA2128228A1 (en) 1993-08-05
NL9200127A (nl) 1993-08-16
RU94036765A (ru) 1996-05-20
RU2106249C1 (ru) 1998-03-10
KR950700159A (ko) 1995-01-16
HK1000488A1 (en) 1998-03-27
EP0624123B1 (en) 1997-09-17
DE69314009D1 (de) 1997-10-23
DE69314009T2 (de) 1998-02-19
EP0624123A1 (en) 1994-11-17
AU3576193A (en) 1993-09-01
US5431854A (en) 1995-07-11
WO1993014920A1 (en) 1993-08-05

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