SG73416A1 - Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material - Google Patents

Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material

Info

Publication number
SG73416A1
SG73416A1 SG1996007706A SG1996007706A SG73416A1 SG 73416 A1 SG73416 A1 SG 73416A1 SG 1996007706 A SG1996007706 A SG 1996007706A SG 1996007706 A SG1996007706 A SG 1996007706A SG 73416 A1 SG73416 A1 SG 73416A1
Authority
SG
Singapore
Prior art keywords
pressing
plastic
mould cavity
pct
cures
Prior art date
Application number
SG1996007706A
Other languages
English (en)
Inventor
Ireneus Johannes Theodorus Pas
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Publication of SG73416A1 publication Critical patent/SG73416A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B29C45/463—Injection of preformed charges of material using packaged or wrapped charges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
SG1996007706A 1992-01-23 1993-01-22 Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material SG73416A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9200127A NL9200127A (nl) 1992-01-23 1992-01-23 Werkwijze voor het in een vormholte persen van een door een reactie uithardende kunststof, een daarbij te gebruiken pilvormig pershulpmateriaal alsmede een houder uit dergelijk materiaal.

Publications (1)

Publication Number Publication Date
SG73416A1 true SG73416A1 (en) 2000-06-20

Family

ID=19860342

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996007706A SG73416A1 (en) 1992-01-23 1993-01-22 Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material

Country Status (14)

Country Link
US (1) US5431854A (de)
EP (1) EP0624123B1 (de)
JP (1) JP3225042B2 (de)
KR (1) KR100260761B1 (de)
AT (1) ATE158224T1 (de)
AU (1) AU3576193A (de)
CA (1) CA2128228A1 (de)
DE (1) DE69314009T2 (de)
ES (1) ES2107656T3 (de)
HK (1) HK1000488A1 (de)
NL (1) NL9200127A (de)
RU (1) RU2106249C1 (de)
SG (1) SG73416A1 (de)
WO (1) WO1993014920A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9302265A (nl) * 1993-12-24 1995-07-17 Asm Fico Tooling Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
EP0730937B1 (de) * 1994-11-21 1998-02-18 Apic Yamada Corporation Harzformmaschine mit Trennfolie
CN1066672C (zh) * 1994-12-23 2001-06-06 库克森新加坡有限公司 用于制造包封半导体的预型件的改进方法
EP0742586A3 (de) * 1995-05-02 1998-03-11 Texas Instruments Incorporated Verbesserungen in oder in Beziehung auf integrierte Schaltungen
US6531083B1 (en) * 1995-05-02 2003-03-11 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
EP0759349B1 (de) * 1995-08-23 2002-06-05 Apic Yamada Corporation Automatische Formmaschine mit Trennfolie
US5885506A (en) * 1996-05-02 1999-03-23 Texas Instruments Incorporated Pre-packaged molding for component encapsulation
DE19731202A1 (de) * 1997-07-21 1999-01-28 Siemens Ag Materialtablette sowie Verfahren zum Herstellen eines Kunststoffverbundkörpers
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6544816B1 (en) 1999-08-20 2003-04-08 Texas Instruments Incorporated Method of encapsulating thin semiconductor chip-scale packages
US6558600B1 (en) * 2000-05-04 2003-05-06 Micron Technology, Inc. Method for packaging microelectronic substrates
US20020116250A1 (en) * 2001-02-20 2002-08-22 Menachem Levanoni Adaptive analysis techniques for enhancing retail outlets placements
US6666997B2 (en) * 2001-10-02 2003-12-23 Micron Technology, Inc. Method for removing cleaning compound flash from mold vents
US7264456B2 (en) * 2001-10-10 2007-09-04 Micron Technology, Inc. Leadframe and method for reducing mold compound adhesion problems
US7288292B2 (en) * 2003-03-18 2007-10-30 International Business Machines Corporation Ultra low k (ULK) SiCOH film and method
NL1026001C2 (nl) * 2004-04-22 2005-10-25 Fico Bv Doseereenheid met omhulmateriaal en werkwijze voor het vervaardigen van zo een doseereenheid.
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US7833456B2 (en) 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
WO2010056211A2 (en) * 2008-11-17 2010-05-20 Advanpack Solutions Pte Ltd System for encapsulation of semiconductor dies
US20140124926A1 (en) * 2012-11-07 2014-05-08 Corey Reichman Method And System For A Chaser Pellet In A Semiconductor Package Mold Process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483287A (en) * 1966-04-12 1969-12-09 Goodrich Co B F Transfer molding method
DE1812217A1 (de) * 1968-01-24 1969-08-14 Dow Corning Verfahren zum Pressspritzen von fluessigen Massen
US3870449A (en) * 1973-07-23 1975-03-11 Gen Tire & Rubber Co Permanent flashpad for transfer molding
US3911075A (en) * 1974-02-28 1975-10-07 Western Electric Co Transfer molding thermosetting polymeric material
JPS56100429A (en) * 1980-01-16 1981-08-12 Hitachi Ltd Resin molding method
JPS56107559A (en) * 1980-01-30 1981-08-26 Mitsubishi Electric Corp Manufacture of resin-sealed semiconductor device
JPS5715427A (en) * 1980-06-30 1982-01-26 Mitsubishi Electric Corp Method of plastic sealing for semiconductor device
JPS59151436A (ja) * 1983-02-17 1984-08-29 Rohm Co Ltd 半導体装置の樹脂封止方法
US5043199A (en) * 1988-10-31 1991-08-27 Fujitsu Limited Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet
JPH03157942A (ja) * 1989-11-15 1991-07-05 Nec Yamaguchi Ltd 樹脂封止型半導体集積回路の製造方法

Also Published As

Publication number Publication date
DE69314009D1 (de) 1997-10-23
US5431854A (en) 1995-07-11
WO1993014920A1 (en) 1993-08-05
JPH07503418A (ja) 1995-04-13
RU2106249C1 (ru) 1998-03-10
HK1000488A1 (en) 1998-03-27
ATE158224T1 (de) 1997-10-15
EP0624123A1 (de) 1994-11-17
CA2128228A1 (en) 1993-08-05
DE69314009T2 (de) 1998-02-19
RU94036765A (ru) 1996-05-20
EP0624123B1 (de) 1997-09-17
NL9200127A (nl) 1993-08-16
KR100260761B1 (ko) 2000-07-01
JP3225042B2 (ja) 2001-11-05
ES2107656T3 (es) 1997-12-01
AU3576193A (en) 1993-09-01
KR950700159A (ko) 1995-01-16

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