SG64995A1 - Board rack and manufacturing method therefor - Google Patents

Board rack and manufacturing method therefor

Info

Publication number
SG64995A1
SG64995A1 SG1997002343A SG1997002343A SG64995A1 SG 64995 A1 SG64995 A1 SG 64995A1 SG 1997002343 A SG1997002343 A SG 1997002343A SG 1997002343 A SG1997002343 A SG 1997002343A SG 64995 A1 SG64995 A1 SG 64995A1
Authority
SG
Singapore
Prior art keywords
manufacturing
method therefor
board rack
rack
board
Prior art date
Application number
SG1997002343A
Inventor
Masahiko Nakamura
Masayuki Wakul
Masahiro Enomoto
Tadayoshi Kato
Jun Hasegawa
Hiroyuki Goto
Original Assignee
Ando Electric
Orion Machinery Co Ltd
Yamato Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric, Orion Machinery Co Ltd, Yamato Glass Co Ltd filed Critical Ando Electric
Publication of SG64995A1 publication Critical patent/SG64995A1/en

Links

SG1997002343A 1996-07-03 1997-07-02 Board rack and manufacturing method therefor SG64995A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08173790A JP3090618B2 (en) 1996-07-03 1996-07-03 Structure of board rack for environmental test and method of manufacturing the same

Publications (1)

Publication Number Publication Date
SG64995A1 true SG64995A1 (en) 1999-05-25

Family

ID=15967209

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997002343A SG64995A1 (en) 1996-07-03 1997-07-02 Board rack and manufacturing method therefor

Country Status (3)

Country Link
JP (1) JP3090618B2 (en)
KR (1) KR100245834B1 (en)
SG (1) SG64995A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100540165B1 (en) * 2005-10-04 2005-12-29 주식회사 정우 엠 에스 Waste water evaporation method and apparatus
CN113053847B (en) * 2019-12-26 2023-06-20 珠海格力电器股份有限公司 Chip packaging structure and preparation method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04142758A (en) * 1990-10-04 1992-05-15 Nec Corp Semiconductor substrate housing carrier

Also Published As

Publication number Publication date
KR100245834B1 (en) 2000-03-02
JP3090618B2 (en) 2000-09-25
JPH1019976A (en) 1998-01-23

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