SG64085G - Process for the preparation of flexible circuits - Google Patents
Process for the preparation of flexible circuitsInfo
- Publication number
- SG64085G SG64085G SG640/85A SG64085A SG64085G SG 64085 G SG64085 G SG 64085G SG 640/85 A SG640/85 A SG 640/85A SG 64085 A SG64085 A SG 64085A SG 64085 G SG64085 G SG 64085G
- Authority
- SG
- Singapore
- Prior art keywords
- preparation
- flexible circuits
- circuits
- flexible
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/28—Processing photosensitive materials; Apparatus therefor for obtaining powder images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0505—Double exposure of the same photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/304,107 US4411980A (en) | 1981-09-21 | 1981-09-21 | Process for the preparation of flexible circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
SG64085G true SG64085G (en) | 1986-05-02 |
Family
ID=23175078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG640/85A SG64085G (en) | 1981-09-21 | 1985-09-04 | Process for the preparation of flexible circuits |
Country Status (7)
Country | Link |
---|---|
US (1) | US4411980A (es) |
EP (1) | EP0075299A3 (es) |
JP (2) | JPS5870595A (es) |
BR (2) | BR8205457A (es) |
GB (1) | GB2106719B (es) |
MX (1) | MX159271A (es) |
SG (1) | SG64085G (es) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4523102A (en) * | 1980-03-17 | 1985-06-11 | Matsushita Electric Industrial Co., Ltd. | Solid-state color-image sensor and process for fabricating the same |
CA1172112A (en) * | 1980-12-12 | 1984-08-07 | Richard P. Plunkett | Process for making conductive coatings |
US4888450A (en) * | 1981-12-11 | 1989-12-19 | At&T Bell Laboratories | Circuit board fabrication leading to increased capacity |
US4631111A (en) * | 1984-11-27 | 1986-12-23 | E. I. Du Pont De Nemours And Company | Dichromic process for preparation of conductive circuit |
US4670351A (en) * | 1986-02-12 | 1987-06-02 | General Electric Company | Flexible printed circuits, prepared by augmentation replacement process |
US4734356A (en) * | 1986-04-30 | 1988-03-29 | E. I. Du Pont De Nemours And Company | Positive-working color proofing film and process |
US4849322A (en) * | 1986-04-30 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Positive-working color proofing film and process |
JPS6318692A (ja) * | 1986-07-11 | 1988-01-26 | 日立化成工業株式会社 | 印刷配線板の製造方法 |
US4959178A (en) * | 1987-01-27 | 1990-09-25 | Advanced Products Inc. | Actinic radiation-curable conductive polymer thick film compositions and their use thereof |
NL8701176A (nl) * | 1987-05-15 | 1988-12-01 | Stork Screens Bv | Dessineerdeklaag voor een metalen zeefdruksjabloon; zeefdruksjabloon voorzien van een dessineerdeklaag en werkwijze voor het aanbrengen van een dessineerpatroon in een deklaag welke aanwezig is op een metalen zeefdruksjabloon. |
US4999136A (en) * | 1988-08-23 | 1991-03-12 | Westinghouse Electric Corp. | Ultraviolet curable conductive resin |
US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
US5114744A (en) * | 1989-08-21 | 1992-05-19 | Hewlett-Packard Company | Method for applying a conductive trace pattern to a substrate |
JPH03152992A (ja) * | 1989-10-27 | 1991-06-28 | W R Grace & Co | 印刷回路板及びその製造方法 |
US5461202A (en) * | 1992-10-05 | 1995-10-24 | Matsushita Electric Industrial Co., Ltd. | Flexible wiring board and its fabrication method |
GB0117431D0 (en) * | 2001-07-17 | 2001-09-12 | Univ Brunel | Method for printing conducting layer onto substrate |
DE10145750A1 (de) * | 2001-09-17 | 2003-04-24 | Infineon Technologies Ag | Verfahren zur Herstellung einer Metallschicht auf einem Trägerkörper und Trägerkörper mit einer Metallschicht |
US7442408B2 (en) * | 2002-03-26 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Methods for ink-jet printing circuitry |
JP4068883B2 (ja) * | 2002-04-22 | 2008-03-26 | セイコーエプソン株式会社 | 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法 |
US20060093732A1 (en) * | 2004-10-29 | 2006-05-04 | David Schut | Ink-jet printing of coupling agents for trace or circuit deposition templating |
US20100209843A1 (en) * | 2009-02-16 | 2010-08-19 | E. I. Du Pont De Nemours And Company | Process for thick film circuit patterning |
JP5587268B2 (ja) * | 2011-09-22 | 2014-09-10 | 富士フイルム株式会社 | インクジェットヘッド及びその製造方法 |
CN111526669B (zh) * | 2020-05-07 | 2021-07-23 | 深圳市晶泓科技有限公司 | 一种透明电路板及透明led显示屏的制作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL255801A (es) * | 1959-09-11 | |||
US3347724A (en) * | 1964-08-19 | 1967-10-17 | Photocircuits Corp | Metallizing flexible substrata |
US3637385A (en) * | 1969-02-05 | 1972-01-25 | Staley Mfg Co A E | Solid deformation imaging |
JPS5197778A (en) * | 1975-02-25 | 1976-08-27 | Daiyafuramu suitsuchioyobi sonoseizohoho | |
US4066851A (en) * | 1975-10-30 | 1978-01-03 | Chomerics, Inc. | Keyboard switch assembly having foldable printed circuit board, integral spacer and preformed depression-type alignment fold |
US4081898A (en) * | 1976-04-19 | 1978-04-04 | Texas Instruments Incorporated | Method of manufacturing an electronic calculator utilizing a flexible carrier |
JPS5916436B2 (ja) * | 1976-10-18 | 1984-04-16 | セイコーインスツルメンツ株式会社 | 回路基板のパタ−ン形成方法 |
US4054479A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additive process for producing printed circuit elements using a self-supported photosensitive sheet |
US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
-
1981
- 1981-09-21 US US06/304,107 patent/US4411980A/en not_active Expired - Lifetime
-
1982
- 1982-09-17 GB GB08226507A patent/GB2106719B/en not_active Expired
- 1982-09-17 EP EP82108614A patent/EP0075299A3/en not_active Ceased
- 1982-09-17 BR BR8205457A patent/BR8205457A/pt unknown
- 1982-09-17 BR BR8205458A patent/BR8205458A/pt unknown
- 1982-09-17 MX MX194454A patent/MX159271A/es unknown
- 1982-09-20 JP JP57162452A patent/JPS5870595A/ja active Pending
-
1985
- 1985-09-04 SG SG640/85A patent/SG64085G/en unknown
-
1988
- 1988-04-27 JP JP63102824A patent/JPS63294630A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
BR8205458A (pt) | 1983-08-23 |
US4411980A (en) | 1983-10-25 |
JPS63294630A (ja) | 1988-12-01 |
GB2106719B (en) | 1985-07-03 |
BR8205457A (pt) | 1983-08-23 |
MX159271A (es) | 1989-05-11 |
GB2106719A (en) | 1983-04-13 |
EP0075299A3 (en) | 1985-09-18 |
JPS5870595A (ja) | 1983-04-27 |
EP0075299A2 (en) | 1983-03-30 |
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