BR8205457A - Processo para preparacao de hfp partino de uma carga de tfe dimero de tfe ou uma mistura dos dois - Google Patents

Processo para preparacao de hfp partino de uma carga de tfe dimero de tfe ou uma mistura dos dois

Info

Publication number
BR8205457A
BR8205457A BR8205457A BR8205457A BR8205457A BR 8205457 A BR8205457 A BR 8205457A BR 8205457 A BR8205457 A BR 8205457A BR 8205457 A BR8205457 A BR 8205457A BR 8205457 A BR8205457 A BR 8205457A
Authority
BR
Brazil
Prior art keywords
tfe
partino
dimero
hfp
load
Prior art date
Application number
BR8205457A
Other languages
English (en)
Inventor
James Lawrence Wise
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8205457A publication Critical patent/BR8205457A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/28—Processing photosensitive materials; Apparatus therefor for obtaining powder images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
BR8205457A 1981-09-21 1982-09-17 Processo para preparacao de hfp partino de uma carga de tfe dimero de tfe ou uma mistura dos dois BR8205457A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/304,107 US4411980A (en) 1981-09-21 1981-09-21 Process for the preparation of flexible circuits

Publications (1)

Publication Number Publication Date
BR8205457A true BR8205457A (pt) 1983-08-23

Family

ID=23175078

Family Applications (2)

Application Number Title Priority Date Filing Date
BR8205458A BR8205458A (pt) 1981-09-21 1982-09-17 Processo de preparacao de circuitos flexiveis
BR8205457A BR8205457A (pt) 1981-09-21 1982-09-17 Processo para preparacao de hfp partino de uma carga de tfe dimero de tfe ou uma mistura dos dois

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BR8205458A BR8205458A (pt) 1981-09-21 1982-09-17 Processo de preparacao de circuitos flexiveis

Country Status (7)

Country Link
US (1) US4411980A (pt)
EP (1) EP0075299A3 (pt)
JP (2) JPS5870595A (pt)
BR (2) BR8205458A (pt)
GB (1) GB2106719B (pt)
MX (1) MX159271A (pt)
SG (1) SG64085G (pt)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523102A (en) * 1980-03-17 1985-06-11 Matsushita Electric Industrial Co., Ltd. Solid-state color-image sensor and process for fabricating the same
CA1172112A (en) * 1980-12-12 1984-08-07 Richard P. Plunkett Process for making conductive coatings
US4888450A (en) * 1981-12-11 1989-12-19 At&T Bell Laboratories Circuit board fabrication leading to increased capacity
US4631111A (en) * 1984-11-27 1986-12-23 E. I. Du Pont De Nemours And Company Dichromic process for preparation of conductive circuit
US4670351A (en) * 1986-02-12 1987-06-02 General Electric Company Flexible printed circuits, prepared by augmentation replacement process
US4734356A (en) * 1986-04-30 1988-03-29 E. I. Du Pont De Nemours And Company Positive-working color proofing film and process
US4849322A (en) * 1986-04-30 1989-07-18 E. I. Du Pont De Nemours And Company Positive-working color proofing film and process
JPS6318692A (ja) * 1986-07-11 1988-01-26 日立化成工業株式会社 印刷配線板の製造方法
US4959178A (en) * 1987-01-27 1990-09-25 Advanced Products Inc. Actinic radiation-curable conductive polymer thick film compositions and their use thereof
NL8701176A (nl) * 1987-05-15 1988-12-01 Stork Screens Bv Dessineerdeklaag voor een metalen zeefdruksjabloon; zeefdruksjabloon voorzien van een dessineerdeklaag en werkwijze voor het aanbrengen van een dessineerpatroon in een deklaag welke aanwezig is op een metalen zeefdruksjabloon.
US4999136A (en) * 1988-08-23 1991-03-12 Westinghouse Electric Corp. Ultraviolet curable conductive resin
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
JPH03152992A (ja) * 1989-10-27 1991-06-28 W R Grace & Co 印刷回路板及びその製造方法
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
GB0117431D0 (en) * 2001-07-17 2001-09-12 Univ Brunel Method for printing conducting layer onto substrate
DE10145750A1 (de) * 2001-09-17 2003-04-24 Infineon Technologies Ag Verfahren zur Herstellung einer Metallschicht auf einem Trägerkörper und Trägerkörper mit einer Metallschicht
US7442408B2 (en) * 2002-03-26 2008-10-28 Hewlett-Packard Development Company, L.P. Methods for ink-jet printing circuitry
JP4068883B2 (ja) * 2002-04-22 2008-03-26 セイコーエプソン株式会社 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法
US20060093732A1 (en) * 2004-10-29 2006-05-04 David Schut Ink-jet printing of coupling agents for trace or circuit deposition templating
US20100209843A1 (en) * 2009-02-16 2010-08-19 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
JP5587268B2 (ja) * 2011-09-22 2014-09-10 富士フイルム株式会社 インクジェットヘッド及びその製造方法
CN111526669B (zh) * 2020-05-07 2021-07-23 深圳市晶泓科技有限公司 一种透明电路板及透明led显示屏的制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL255801A (pt) * 1959-09-11
US3347724A (en) * 1964-08-19 1967-10-17 Photocircuits Corp Metallizing flexible substrata
US3637385A (en) * 1969-02-05 1972-01-25 Staley Mfg Co A E Solid deformation imaging
JPS5197778A (en) * 1975-02-25 1976-08-27 Daiyafuramu suitsuchioyobi sonoseizohoho
US4066851A (en) * 1975-10-30 1978-01-03 Chomerics, Inc. Keyboard switch assembly having foldable printed circuit board, integral spacer and preformed depression-type alignment fold
US4081898A (en) * 1976-04-19 1978-04-04 Texas Instruments Incorporated Method of manufacturing an electronic calculator utilizing a flexible carrier
JPS5916436B2 (ja) * 1976-10-18 1984-04-16 セイコーインスツルメンツ株式会社 回路基板のパタ−ン形成方法
US4054479A (en) * 1976-12-22 1977-10-18 E. I. Du Pont De Nemours And Company Additive process for producing printed circuit elements using a self-supported photosensitive sheet
US4157407A (en) * 1978-02-13 1979-06-05 E. I. Du Pont De Nemours And Company Toning and solvent washout process for making conductive interconnections

Also Published As

Publication number Publication date
EP0075299A2 (en) 1983-03-30
GB2106719A (en) 1983-04-13
JPS5870595A (ja) 1983-04-27
MX159271A (es) 1989-05-11
US4411980A (en) 1983-10-25
BR8205458A (pt) 1983-08-23
JPS63294630A (ja) 1988-12-01
EP0075299A3 (en) 1985-09-18
GB2106719B (en) 1985-07-03
SG64085G (en) 1986-05-02

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