SG52961A1 - 1,2-n-acyl-n-methylene-ethylenediamine and electroconductive paste comprising it - Google Patents

1,2-n-acyl-n-methylene-ethylenediamine and electroconductive paste comprising it

Info

Publication number
SG52961A1
SG52961A1 SG1997001320A SG1997001320A SG52961A1 SG 52961 A1 SG52961 A1 SG 52961A1 SG 1997001320 A SG1997001320 A SG 1997001320A SG 1997001320 A SG1997001320 A SG 1997001320A SG 52961 A1 SG52961 A1 SG 52961A1
Authority
SG
Singapore
Prior art keywords
ethylenediamine
acyl
methylene
electroconductive paste
electroconductive
Prior art date
Application number
SG1997001320A
Other languages
English (en)
Inventor
Hiroaki Umeda
Tsunehiko Terada
Hisatoshi Murakami
Original Assignee
Tatsuta Densen Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Densen Kk filed Critical Tatsuta Densen Kk
Publication of SG52961A1 publication Critical patent/SG52961A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C233/00—Carboxylic acid amides
    • C07C233/01—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms
    • C07C233/34—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups
    • C07C233/35—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom
    • C07C233/36—Carboxylic acid amides having carbon atoms of carboxamide groups bound to hydrogen atoms or to acyclic carbon atoms having the nitrogen atom of at least one of the carboxamide groups bound to a carbon atom of a hydrocarbon radical substituted by amino groups with the substituted hydrocarbon radical bound to the nitrogen atom of the carboxamide group by an acyclic carbon atom having the carbon atom of the carboxamide group bound to a hydrogen atom or to a carbon atom of an acyclic saturated carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
    • C07C251/02—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups
    • C07C251/04—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton containing imino groups having carbon atoms of imino groups bound to hydrogen atoms or to acyclic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
SG1997001320A 1996-04-26 1997-04-26 1,2-n-acyl-n-methylene-ethylenediamine and electroconductive paste comprising it SG52961A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10695896 1996-04-26
JP10695796 1996-04-26
JP28629296 1996-10-29

Publications (1)

Publication Number Publication Date
SG52961A1 true SG52961A1 (en) 1998-09-28

Family

ID=27310875

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001320A SG52961A1 (en) 1996-04-26 1997-04-26 1,2-n-acyl-n-methylene-ethylenediamine and electroconductive paste comprising it

Country Status (7)

Country Link
US (1) US5779941A (ko)
EP (1) EP0803499B1 (ko)
KR (1) KR100297519B1 (ko)
CA (1) CA2203723C (ko)
DE (1) DE69701299T2 (ko)
SG (1) SG52961A1 (ko)
TW (1) TW363078B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7214419B2 (en) * 2002-05-31 2007-05-08 Tatsuta Electric Wire & Cable Co., Ltd. Conductive paste multilayered board including the conductive paste and process for producing the same
JP4677900B2 (ja) * 2003-09-26 2011-04-27 日立化成工業株式会社 混合導電粉およびその利用
EP3275572A4 (en) * 2015-03-26 2018-11-14 Mitsui Mining and Smelting Co., Ltd. Copper powder and conductive composition containing same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1311019A (en) * 1969-12-28 1973-03-21 Matsushita Electric Works Ltd Copper-clad laminate and production thereof
US4326067A (en) * 1980-12-03 1982-04-20 The Dow Chemical Company Process for making N-(2-aminoethyl)amides
US4855497A (en) * 1985-04-02 1989-08-08 Chugai Seiyaku Kabushiki Kaisha Novel diamine derivatives
EP0239901B1 (en) * 1986-03-31 1992-11-11 Tatsuta Electric Wire & Cable Co., Ltd Conductive copper paste composition
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
JPH0649272A (ja) * 1992-07-31 1994-02-22 Nippon Oil & Fats Co Ltd 導電性組成物

Also Published As

Publication number Publication date
EP0803499B1 (en) 2000-02-16
CA2203723A1 (en) 1997-10-26
DE69701299T2 (de) 2000-08-24
KR100297519B1 (ko) 2001-09-03
KR19980032087A (ko) 1998-07-25
US5779941A (en) 1998-07-14
DE69701299D1 (de) 2000-03-23
EP0803499A1 (en) 1997-10-29
CA2203723C (en) 2002-03-26
TW363078B (en) 1999-07-01

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