SG52228A1 - Chemical reducing solution for copper oxide - Google Patents

Chemical reducing solution for copper oxide

Info

Publication number
SG52228A1
SG52228A1 SG1996000825A SG1996000825A SG52228A1 SG 52228 A1 SG52228 A1 SG 52228A1 SG 1996000825 A SG1996000825 A SG 1996000825A SG 1996000825 A SG1996000825 A SG 1996000825A SG 52228 A1 SG52228 A1 SG 52228A1
Authority
SG
Singapore
Prior art keywords
copper oxide
reducing solution
chemical reducing
chemical
solution
Prior art date
Application number
SG1996000825A
Other languages
English (en)
Inventor
Akishi Nakaso
Youichi Kaneko
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG52228A1 publication Critical patent/SG52228A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0065—Leaching or slurrying
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0065—Leaching or slurrying
    • C22B15/008—Leaching or slurrying with non-acid solutions containing salts of alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
SG1996000825A 1994-02-02 1995-01-30 Chemical reducing solution for copper oxide SG52228A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01073794A JP3395854B2 (ja) 1994-02-02 1994-02-02 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
SG52228A1 true SG52228A1 (en) 1998-09-28

Family

ID=11758616

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996000825A SG52228A1 (en) 1994-02-02 1995-01-30 Chemical reducing solution for copper oxide

Country Status (8)

Country Link
US (1) US5736065A (no)
JP (1) JP3395854B2 (no)
KR (1) KR0141619B1 (no)
CN (1) CN1066479C (no)
DE (1) DE19503186C2 (no)
GB (1) GB2286197B (no)
SG (1) SG52228A1 (no)
TW (1) TW280084B (no)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
CN100395059C (zh) * 2001-12-18 2008-06-18 旭化成株式会社 金属氧化物分散体、由其得到的金属薄膜和生产该金属薄膜的方法
CA2494920C (en) * 2002-08-09 2013-01-22 Simon Fraser University Photochromic and electrochromic compounds and methods of synthesizing and using same
US8536205B2 (en) * 2005-05-25 2013-09-17 Switch Materials Inc. Photochromic and electrochromic compounds and synthesis and use thereof
KR101958606B1 (ko) 2010-07-06 2019-03-14 아토테크 도이칠란드 게엠베하 인쇄회로기판의 제조 방법
US9345149B2 (en) 2010-07-06 2016-05-17 Esionic Corp. Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
CN103890133A (zh) 2011-09-30 2014-06-25 思维奇材料公司 作为滤光片的光致变色和电致变色二芳基环戊烯衍生物
WO2020148308A1 (en) * 2019-01-15 2020-07-23 Atotech Deutschland Gmbh Method of forming copper oxide on a copper surface
CN113747683B (zh) * 2020-05-29 2023-07-07 深南电路股份有限公司 一种印制线路板及其制作方法
JP7342288B2 (ja) * 2020-12-18 2023-09-11 株式会社トクヤマ 遷移金属の半導体の処理方法、および遷移金属酸化物の還元剤含有処理液
TWI822620B (zh) * 2023-03-24 2023-11-11 景碩科技股份有限公司 銅箔基板的前處理方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2643199A (en) * 1945-12-18 1953-06-23 Hersch Paul Process of forming a layer of metallic copper on copper oxide
DE1410807A1 (no) * 1961-07-31 1968-10-17
US4295986A (en) * 1979-05-14 1981-10-20 Gordon Roy G Low temperature catalytic reduction
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS59120249A (ja) * 1982-12-27 1984-07-11 Agency Of Ind Science & Technol 貴金属触媒の製造方法
DE3473890D1 (en) * 1983-07-25 1988-10-13 Hitachi Ltd Electroless copper plating solution
US4634468A (en) * 1984-05-07 1987-01-06 Shipley Company Inc. Catalytic metal of reduced particle size
US4725314A (en) * 1984-05-07 1988-02-16 Shipley Company Inc. Catalytic metal of reduced particle size
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4770751A (en) * 1986-12-30 1988-09-13 Okuno Chemical Industry Co., Ltd. Method for forming on a nonconductor a shielding layer against electromagnetic radiation
DE3707817A1 (de) * 1987-03-09 1988-09-22 Schering Ag Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
ATA200888A (de) * 1987-08-11 1993-07-15 Schering Ag Konditionierungsmittel für gedruckte schaltungen
JPS6456479A (en) * 1987-08-27 1989-03-03 Mita Industrial Co Ltd Cleaning device
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
GB2243577A (en) * 1990-05-07 1991-11-06 Compeq Manufacturing Co Limite A method of bonding copper and resin
DE4108073A1 (de) * 1991-03-13 1992-09-17 Compeq Mfg Co Verfahren zur verbindung von kupfer und kunststoff

Also Published As

Publication number Publication date
KR0141619B1 (ko) 1998-06-01
JP3395854B2 (ja) 2003-04-14
JPH07216564A (ja) 1995-08-15
US5736065A (en) 1998-04-07
DE19503186C2 (de) 1997-08-21
KR950024971A (ko) 1995-09-15
GB2286197A (en) 1995-08-09
GB2286197B (en) 1997-06-04
CN1066479C (zh) 2001-05-30
CN1112950A (zh) 1995-12-06
TW280084B (no) 1996-07-01
GB9501749D0 (en) 1995-03-22
DE19503186A1 (de) 1995-08-10

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