SG183731A1 - Process for producing glass substrate for magnetic disks - Google Patents
Process for producing glass substrate for magnetic disks Download PDFInfo
- Publication number
- SG183731A1 SG183731A1 SG2012060422A SG2012060422A SG183731A1 SG 183731 A1 SG183731 A1 SG 183731A1 SG 2012060422 A SG2012060422 A SG 2012060422A SG 2012060422 A SG2012060422 A SG 2012060422A SG 183731 A1 SG183731 A1 SG 183731A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- glass substrate
- sulfonic acid
- magnetic disks
- producing
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 57
- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000008569 process Effects 0.000 title claims abstract description 18
- 238000005498 polishing Methods 0.000 claims abstract description 139
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000012530 fluid Substances 0.000 claims abstract description 51
- 239000008119 colloidal silica Substances 0.000 claims abstract description 28
- 125000000542 sulfonic acid group Chemical group 0.000 claims abstract description 19
- 229910021485 fumed silica Inorganic materials 0.000 claims abstract description 17
- 229920003169 water-soluble polymer Polymers 0.000 claims abstract description 16
- 230000002378 acidificating effect Effects 0.000 claims abstract description 15
- 239000004094 surface-active agent Substances 0.000 claims abstract description 15
- 125000002843 carboxylic acid group Chemical group 0.000 claims abstract description 10
- 150000007942 carboxylates Chemical group 0.000 claims abstract description 7
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 claims abstract description 7
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 17
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 5
- 239000011164 primary particle Substances 0.000 claims description 5
- -1 alkyl sulfonic acid Chemical compound 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 19
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- 238000004140 cleaning Methods 0.000 description 12
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- 230000000694 effects Effects 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 9
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- 239000000178 monomer Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 239000003513 alkali Substances 0.000 description 7
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 229910000420 cerium oxide Inorganic materials 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
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- 241000282320 Panthera leo Species 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
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- 238000011156 evaluation Methods 0.000 description 3
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
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- 238000006124 Pilkington process Methods 0.000 description 2
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- 125000001624 naphthyl group Chemical group 0.000 description 2
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- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- VPGSXIKVUASQIY-UHFFFAOYSA-N 1,2-dibutylnaphthalene Chemical compound C1=CC=CC2=C(CCCC)C(CCCC)=CC=C21 VPGSXIKVUASQIY-UHFFFAOYSA-N 0.000 description 1
- DZSVIVLGBJKQAP-UHFFFAOYSA-N 1-(2-methyl-5-propan-2-ylcyclohex-2-en-1-yl)propan-1-one Chemical compound CCC(=O)C1CC(C(C)C)CC=C1C DZSVIVLGBJKQAP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XEEYSDHEOQHCDA-UHFFFAOYSA-N 2-methylprop-2-ene-1-sulfonic acid Chemical compound CC(=C)CS(O)(=O)=O XEEYSDHEOQHCDA-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
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- 101100510617 Caenorhabditis elegans sel-8 gene Proteins 0.000 description 1
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- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
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- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 240000008415 Lactuca sativa Species 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 241000275475 Praia Species 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
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- 229920001218 Pullulan Polymers 0.000 description 1
- 244000097202 Rathbunia alamosensis Species 0.000 description 1
- 235000009776 Rathbunia alamosensis Nutrition 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- HDTRYLNUVZCQOY-WSWWMNSNSA-N Trehalose Natural products O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 HDTRYLNUVZCQOY-WSWWMNSNSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
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- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- HDTRYLNUVZCQOY-LIZSDCNHSA-N alpha,alpha-trehalose Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 HDTRYLNUVZCQOY-LIZSDCNHSA-N 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229920006318 anionic polymer Polymers 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000001720 carbohydrates Chemical class 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 238000003426 chemical strengthening reaction Methods 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 239000000314 lubricant Substances 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 235000019423 pullulan Nutrition 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 235000012045 salad Nutrition 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
- C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Abstract
PROCESS FOR PRODUCING GLASS SUBSTRATE FOR MAGNETIC DISKSIn the production of a glass substrate for magnetic disks, in a step of polishing a main surface of a circular glass plate, roll-off is reduced without reducing the polishing rate.The process comprises a step of polishing a main surface of a circular glass plate by using an acidic polishing fluid containing colloidal silica or fumed silica, and a water-soluble polymer having at least one member selected from a group consisting of a carboxylic acid group, a carboxylate group, a sulfonic acid group and a sulfonate group, bonded to its main chain, or an acidic polishing fluid containing 100 parts by mass of colloidal silica or fumed silica, and from 0.02 to 0.1 part by mass of a surfactant having a sulfonic acid group.Fig. 1
Description
PROCESS FOR PRODUCING GLASS SUBSTRATE FOR MAGNETIC DISKS
5s TECHNICAL FIELD
The present invention relates to a process for producing a glass substrate for magnetic disks and particularly relates to a method of polishing a main surface of a glass circular disk.
There has been a strong demand for higher recording density of a magnetic disk to be mounted on an information-processing device such as a hard disk drive, and under such a circumstance, a glass substrate has started to be widely used instead of a conventional aluminum substrate.
For example, a glass substrate for magnetic disks is produced in such a manner that forming a circular hole in the center of a circular glass plate, chamfering, lapping the main surface and mirror polishing the edge surface are sequentially carried out, and the main surface of the circular glass plate is polished.
In order to increase the recording capacity of a magnetic disk, it is necessary to expand the recording area, go that the main surface of the glass substrate for magnetic disks is desirably flat as far as possible towards the outer circumference. Fig. 1 is a cross- sectional view schematically illustrating the vicinity of the edge surface of a glass substrate for magnetic disks after its main surface is polished. In the Figure, a is a chamfered surface, b is an outer circumferential edge surface, c is an outer peripheral portion of the main surface, and d is a boundary between the chamfered surface a and the outer peripheral portion ¢ of the main surface. However, roll-off (sagging of edge surface) is formed continuously from the outer peripheral portion c of the main surface to the chamfered surface a, whereby the recording area is reduced.
Further, in Fig. 1, the straight line shown by a dot-line is a reference line g to define the degree of roll-off. Such a reference line g is set as a straight line to overlap a portion f£ which is a portion of the outer peripheral portion c¢ of the main surface corresponding to from 2.5 mm to 5 mm towards the center of the main surface from the boundary d; or it is set as a straight line closest to such a portion £. A portion of the outer peripheral portion ¢ of the main surface corresponding to from 0.25 mm to 5 mm towards the center of the main surface from the boundary d, is a roll-off measuring region e. Further, the degree of the roll-off is a difference between the highest and lowest heights from the reference line g of the outer peripheral portion ¢ of the main surface in the roll-off measuring region e.
Accordingly, in order to increase the recording capacity, reduction of the roll-off ig essential, and heretofore it has been attempted not only to improve the polishing apparatus, but also to improve the polishing s fluid. For example, there has been known a polishing fluid containing water, abrasive grains such as silica powder, a surfactant made of a polyoxyethylene polyoxypropylene alkyl ether or polyoxyethylene polyoxypropylene copolymer, and an inorganic acid or organic acid (Patent Document 1); or a polishing fluid containing water, silica powder, an acid and a surfactant made of sulfonic acid or its salt, and having a pH of from 0 to 4 (Patent Document 2).
Patent Document 1: JP-A-2002-167575 is Patent Document 2: JP-A-2007-63372
When an acidic polishing fluid is used, a glass surface is softened, and polishing with abrasive grains is efficiently carried out, whereby the polishing rate will be improved. Further, it has an advantage such that there is less weak point. However, the surfactant added in the polishing fluid described in Patent Document 1 lowers dispersibility of silica in an acidic region, thereby to cause agglomeration.
On the other hand, the polishing fluid described in
Patent Document 2 contains a surfactant containing an aromatic ring, whereby even though it has an effect of reducing roll-off, the polishing rate is low, and it is not preferred from the viewpoint of production efficiency.
Therefore, the present invention has an object to reduce the roll-off without lowering the polishing rate in a polishing step of a main surface of a circular glass plate when producing a glass substrate for magnetic disks.
MEANS TO SOLVE THE PROBLEMS
In order to solve the above problems, the present invention provides a process for producing a glass substrate for magnetic disks, which comprises a step of polishing a main surface of a circular glass plate by using an acidic polishing fluid containing colloidal silica or fumed silica, and a water-soluble polymer having at least one member selected from a group consisting of a carboxylic acid group, a carboxylate group, a sulfonic acid group and a sulfonate group, bonded to its main chain; and a process for producing a glass substrate for magnetic disks, which comprises a step of polishing a main surface of a circular glass plate by using an acidic polishing fluid containing 100 parts by mass of colloidal silica or fumed silica, and from 0.02 to 0.1 part by mass of a surfactant having a sulfonic acid group.
By the polishing fluid to be used in the present 5 invention, it is possible to efficiently produce a glass substrate for magnetic disks having little roll-off, i.e. having a large recording area, whereby a higher recording capacity has been made available.
Fig. 1 is a schematic view illustrating the vicinity of the outer peripheral portion of a circular glass substrate after its main surface is polished.
MEANINGS OF SYMBOLS a: Chamfered surface b: Outer circumferential edge surface c: Outer peripheral portion of the main surface d: Boundary between the chamfered surface a and the outer peripheral portion c¢ of the main surface e: Roll-off measuring region g: Reference line to determine the degree of roll- off
Now, the present invention will be described in further detail.
In the process for producing a glass substrate for magnetic disks of the present invention, a circular glass plate is treated by known steps until the polishing of the main surface.
For example, from silicate glass formed by a float process, a circular glass plate is cut out, and a circular hole is formed in its center, followed sequentially by chamfering, lapping of the main surface and mirror polishing of the edge surface.
Further, it is possible to divide the step of lapping the main surface into a step of rough lapping and a step of refined lapping and between them, provide a step of shape-processing (forming a hole in the center of the circular glass plate, chamfering and edge surface polishing). After the step of polishing the main surface, it is possible to provide a step of chemical strengthening. Further, in a case of producing a glass substrate having no circular hole in the center, obviously, it is unnecessary to form a hole in the center of the circular glass plate.
Then, polishing of the main surface is carried out.
Ag the polishing fluid, the present invention uses an acidic first polishing fluid containing colloidal silica or fumed gilica, and a water-soluble polymer having at least one member selected from a group consisting of a carboxylic acid group, a carboxylate group, a sulfonic acid group and a sulfonate group, bonded to its main chain, or an acidic second polishing fluid containing 100 parts by mass of colloidal gilica or fumed silica, and from 0.02 to 0.1 part by mass of a surfactant having a sulfonic acid group.
FIRST POLISHING FLUID
A water-soluble polymer having at least one member selected from a group consisting of a carboxylic acid group, a carboxylate group, a sulfonic acid group and a sulfonate group, bonded to its main chain, is a homopolymer or copolymer containing at least one type of polymerized units derived from a monomer having a carboxylic acid group or a sulfonic acid group, as a monomer component (monomer). A water-soluble polymer having a carboxylate group or a sulfonate group bonded to its main chain is obtained by neutralizing a water- soluble polymer having a carboxylic acid group or a sulfonic acid group bonded to its main chain, with an alkali, and it is one having a proton (H') of the carboxylic acid group or a proton of the sulfonic acid group substituted by another positive ion (counter ion).
The counter ion which forms a carboxylate group or a sulfonate group may, for example, be an alkali ion such as Na ion or K ion, ammonium ion or an alkyl ammonium ion. Further, a carboxylic acid group or a sulfonic acid group, or their salts may be bonded to terminals of the main chain.
The monomer having a carboxylic acid group may, for example, be acrylic acid, maleic acid, itaconic acid or methacrylic acid. The monomer having a sulfonic acid group may, for example, be 2-acrylamide-2-methylpropane sulfonic acid, isoprene sulfonic acid, methacryl sulfonic acid, vinyl sulfonic acid, styrene sulfonic acid or allyl sulfonic acid. Further, the sulfonic acid group may be bonded to the main chain via a group A such as a carbon chain (e.g. (6) in the following SULFONIC ACID TYPE
POLYMERS) .
The water-soluble polymer may be a copolymer further containing polymerized units derived from other monomers.
Such other monomers may, for example, be an acrylate, maleate, itaconate, methacrylate, acrylamide, acrylonitrile, styrene, acetylene, butadiene, isobutylene, propylene, vinyl alcohol, vinyl chloride, ethylene, allyl alcohol or vinyl acetate.
As the water-soluble polymer, it is possible to suitably exemplify carboxylic acid type polymers and sulfonic acid type polymers made of the following polymerized units derived from monomers.
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The water-soluble polymer preferably has a linear main chain. The linear polymer surrounds the colloidal silica or fumed silica and is adsorbed on its surface thus providing an effect to prevent agglomeration,
Further, it is present as being spread over the glass surface as an object to be polished thereby to protect the glass surface and to function so that convex portions are selectively polished, or to function like a lubricant whereby it is expected to provide an effect to reduce the frictional resistance of a polishing pad, glass or a carrier. Further, it is expected that it penetrates into a polishing pad (usually a urethane pad) to be used at the time of polishing to provide an effect like a plasticizer, and it is possible to adjust the viscosity of the polishing fluid or to impart thixotropic properties. Each of such functions will substantially contribute to reduction of the roll-off. Further, effects to suppress formation of scratches and to reduce deposits (contaminants) on the surface due to improvement of the cleaning properties, can be expected. Whereas, one having a crosslinked main chain is likely to be insolubilized and precipitated in the form of blocks under an acidic condition, thus providing little such effects.
From the viewpoint of the polishing rate, the water- soluble polymer is further preferably one which does not contain a sterically bulky structure such as a benzene ring ((3) or (4) in the above SULFONIC ACID TYPE
POLYMERS), a naphthalene ring ((5) in the above SULFONIC
ACID TYPE POLYMERS), a glucose or a cellulose in the linear main chain.
Further, the above effects due to the linear polymer tend to appear more distinctly as the molecular weight is larger. Accordingly, the weight average molecular weight is preferably at least 5,300, more preferably at least 6,000. The upper limit of the weight average molecular weight is not particularly limited, but in view of the production efficiency, the upper limit is suitably 1,000,000.
The content of the water-soluble polymer in the polishing fluid is preferably from 0.001 to 10 parts by mass, more preferably from 0.01 to 5 parts by mass, per 100 parts by mass of the colloidal silica or fumed silica.
The colloidal silica may be obtained by a water glass method wherein an alkali metal silicate such as sodium silicate is used as a starting material, and it is subjected to a condensation reaction in an aqueous solution to grow particles, or an alkoxysilane method wherein an alkoxysilane such as tetraethoxysilane is used as a starting material, and it is subjected to a condensation reaction in water containing a water-soluble organic solvent such as an alcohol to grow particles.
The fumed silica may be obtained by a gas phase method wherein a volatile silicon compound such as silicon tetrachloride is used as a starting material, and it is subjected to hydrolysis at a high temperature of at least 1,000°C by means of an oxygen-hydrogen burner to grow particles.
Further, it is also possible to employ one having such silica surface-modified or reformed with functional groups, Or one composite-particulated with surfactant or other particles.
Among them, colloidal silica is preferred with a view to reducing scratches and surface roughness on the substrate surface. Such silicas may be used alone or in combination as a mixture of two or more of them.
The average particle size of primary particles of such silica, typically colloidal silica or fumed silica 16 is preferably from 1 to 100 nm. The average particle size is more preferably from 1 to 80 nm, further preferably from 3 to 60 nm, particularly preferably from 5 to 40 nm, with a view to reducing scratches and with a view to reducing surface roughness (center line surface 1s roughness: Ra).
Further, the content of the colloidal silica or fumed silica in the polishing fluid is typically from 5 to 40 mass%.
The polishing fluid is adjusted to be acidic by adding an acid. The acidity is not particularly limited.
However, if the acidity is too high, the urethane pad tends to be deteriorated, and if the acidity is low, the glass surface tends to be hardly softened, and the polishing rate tends to be low.
Accordingly, the pH is preferably adjusted to be from 1 to 6, more preferably from 1 to 4. As the acid to be used, an inorganic acid such as nitric acid,
hydrochloric acid or sulfuric acid, or an organic acid may be used.
Further, to the polishing fluid, other components may be added, as the case requires. As such other components, those which are electrostatically non- chargeable (nonionic type) or electrostatically negatively chargeable (anionic type} are preferred from the viewpoint of cleaning properties. For example, an anionic polymer or a polyhydric alcohol (such as ethylene glycol, glycerol, sorbitol, mannitol or diglycerol) to prevent drying, an organic acid (such as gluconic acid, citric acid, malic acid, succinic acid, tartaric acid or acetic acid), a saccharide (such as trehalose, Finetose or pullulan}) or a cellulose type polymer (such as hydroxyethyl cellulose, hydroxypropyl cellulose or carboxymethyl cellulose) for selective polishing by covering and protecting the glass surface, a phenyl group- or naphthalene group-containing polymer (such as a polystyrene sulfonic acid, a phenol sulfonic acid/formaline condensate or naphthalene sulfonic acid/formaline condensate), or an anionic surfactant (such as an alkyl sulfonic acid, an alkylbenzene sulfonic acid, an alkylnaphthalene sulfonic acid, an alkyldiphenylether disulfonic acid, an arylphenol sulfonic acid/formaldehyde condensate, or dibutylnaphthalene sulfonic acid) may, for example, be added in a suitable amount.
SECOND POLISHING FLUID
As the surfactant having a sulfonic acid group, the following may be exemplified. In these formulae, R is a
Ciz.24 alkyl group. @ so; H © R
R—s0, H' . & } {805 ut i \_/
The content of the surfactant having a sulfonic acid group is from 0.02 to 0.1 part by mass, preferably from 0.03 to 0.1 part by mass, per 100 parts by mass of the colloidal silica or fumed silica. If the content is less than 0.02 part by mass, the effects to reduce the roll- off and to maintain the polishing rate tend to be inadequate, and if it exceeds 0.1 part by mass, the polishing rate tends to be substantially low.
The colloidal silica, fumed silica, other components and the acidity of the polishing fluid, as well as their preferred embodiments or typical embodiments, are the game as in the case of the first polishing fluid.
The method for polishing the main surface may be carried out in the same manner as a conventional one.
For example, the circular glass plate is sandwiched between a pair of polishing pads, and polishing is carried out by rotating the polishing pads while supplying the above described polishing fluid to the interface between the polishing pads and the circular glass plate.
The polishing pads are typically those made of a urethane foam resin having a shore D hardness of from 45 to 75, a compressibility of from 0.1 to 10% and a density of from 0.5 to 1.5 g/cm? a urethane foam resin having a s shore A hardness of from 30 to 99, a compressibility of from 0.5 to 10% and a density of from 0.2 to 0.9 g/cm’ or a urethane foam resin having a shore A hardness of from 5 to 65, a compressibility of from 0.1 to 60% and a density of from 0.05 to 0.4 g/cm’. Here, the shore A hardness of the polishing pads is preferably at least 26. If it is less than 20, the polishing rate tends to be low.
Here, the shore D hardness and the shore A hardness are measured by methods for measuring durometer A hardness and D hardness of plastics as stipulated in JIS
K7215, respectively. Further, the compressibility unit: %) is measured as follows. Namely, with respect to a test specimen cut out from a polishing pad in a proper size, the thickness t, of the material when pressed under a load with a stress of 10 kPa for 30 seconds from a non-loaded state by means of a shopper type thickness meter, is obtained, then the thickness t; of the material when pressed under a load with a stress of 110 kPa for 5 minutes immediately from the state where the thickness is ty, is obtained, and from the values of to and ti, (te-t1)x100/t, is calculated, and the obtained value is taken as the compressibility.
The polishing pressure is preferably at least 4 kPa.
If it is less than 4 kPa, the stability of the glass substrate during the polishing tends to be low, the substrate tends to flip-flop, and as a result, waving of the main surface is likely to increase.
The polishing degree of the main surface is properly from 0.3 to 1.5 pm and is adjusted by the supply amount of the polishing fluid, the polishing time, the silica concentration in the polishing fluid, the polishing pressure, the rotational speed, etc.
Further, prior to the above polishing of the main surface, the main surface may preliminarily be polished.
Such preliminary polishing of the main surface may be carried out, for example, by sandwiching the circular glass plate between polishing pads and rotating the polishing pads while supplying a cerium oxide abrasive grain slurry.
And, after the above polishing of the main surface, cleaning and drying are carried out to obtain a glass plate for magnetic disks. The cleaning and drying are carried out by known methods. For example, immersion in an acidic cleanser solution, immersion in an alkaline cleanser solution, scrub cleaning with Bellclean and an alkali cleanser, immersion in an alkaline cleanser golution, scrub cleaning with Bellclean and an alkali cleanser, ultrasonic cleaning in a state as immersed in an alkali cleanser solution, ultrasonic cleaning in a state as immersed in pure water, and ultrasonic cleaning in a state as immersed in pure water, are sequentially carried out, followed by drying by a method such as spin drying or isopropyl alcohol vapor drying.
Now, the present invention will be described in further detail with reference to Examples and Comparative
Examples, but it should be understood that the present invention is by no means thereby restricted.
TEST 1: With respect to first polishing fluid
PREPARATION OF TEST SPECIMEN
A silicate glass plate formed by a float process was processed into a doughnut-shaped circular glass plate (a circular glass plate having a circular hole in the center) so that a glass substrate having an outer diameter of 65 mm, an inner diameter of 20 mm and a thickness of 0.635 mm can thereby be obtainable. Here, grinding processing of the inner circumference surface and the outer circumference surface was carried out by means of a diamond grind stone, and lapping of the upper and lower surfaces of the glass plate was carried out by means of aluminum oxide abrasive grains.
Then, the inner and outer circumference edge surfaces were chamfered with a width of chamfer of 0.15 mm and an angle of chamfer of 45°. After such inner and outer circumferential processing, the edge surfaces were mirror-finished by brush polishing by using a cerium oxide slurry as a polishing agent and a brush as a polishing tool. The processed degree was 30 um by the degree of removal in radial direction.
Then, polishing processing of the upper and lower main surfaces was carried out by means of a both side polishing apparatus by using a cerium oxide slurry {average particle size of cerium oxide: about 1.1 um) as a polishing agent and urethane pads as a polishing tool.
The processed degree wag a total of 35 um in thickness direction of the upper and lower main surfaces.
Further, polishing processing of the upper and lower main surfaces was carried out by means of a both side polishing apparatus by using cerium oxide {average particle size: about 0.2 um) having a smaller average particle size than the above cerium oxide, as a polishing agent, and urethane pads as a polishing tool. The processed degree was a total of 1.6 um in thickness direction of the upper and lower surfaces. Further, the main surfaces of the circular glass plate thus prepared were measured by using AFM manufactured by Veeco, whereby the surface roughness Ra was 0.48 nm.
PREPARATION OF POLISHING FLUIDS
The compositions of polishing fluids are shown in
Table 1. For each Example, a polishing fluid is prepared which comprises a colloidal silica slurry (average particle size of primary particles: 20 to 30 nm, silica particle concentration: 48 mass%), the identified additive (sulfonic acid type polymer or carboxylic acid type polymer), nitric acid and pure water. The colloidal silica concentration was 15 mass%, and the amount of sulfonic acid type polymer or carboxylic type polymer was identified by an amount to the amount of colloidal silica. Further, the pH of the polishing fluid was 2.
In the Table, sulfonic acid type copolymer “A-6021” is manufactured by Toagosei Co., Ltd. and has a weight average molecular weight of 100,000, and sulfonic acid type copolymer “A-6020” is manufactured by Toagosei Co.,
Ltd. and has a weight average molecular weight of 10,000.
Further, ammonium salt of carboxylic acid type copolymer “poise 2100“ is manufactured by Kao Corporation and has a weight average molecular weight of 35,000, and ammonium salt of carboxylic acid type copolymer “A-30L" is manufactured by Toagosei Co., Ltd. and has a weight average molecular weight of 6,000, and carboxylic acid type copolymer “A-10LS” is manufactured by Toagosel Co.,
Ltd. and has a weight average molecular weight of 6,000.
Further, for each Comparative Example, a polishing fluid was prepared which comprises a colloidal silica slurry (average particle size of primary particles: 20 to 30 nm, silica particle concentration: 48 mass%), the identified additive, nitric acid and pure water. Here, the colloidal silica concentration, the definition of the amount of the additive and the pH are the same as in the case of the polishing fluid for each Example. Further,
with respect to Comparative Examples 1 and 2, no additive was added, i.e. the polishing fluid was one comprising a colloidal silica slurry, nitric acid and pure water. In the Table, sulfonic acid type copolymer “A-6016A" is manufactured by Toagosei Co., Ltd. and has a weight average molecular weight of 2,000. Further, naphthalene sulfonic acid/formaldehyde condensate is a synthetic product with a condensation degree of 2 to 3.
With respect to each polishing fluid, the slurry viscosity was measured at 25°C by means of TOKI RESOL manufactured by TOKI SANGYO CO. LTD. Further, the surface tension was measured at room temperature by means of CBVP-Z manufactured by Kyowa Interface Science Co.,
Ltd.
POLISHING OF MAIN SURFACES
The main surfaces of the above test specimen were polished by using the above polishing fluid and polishing pads for finishing, made of a urethane foam resin, as a polishing tool. As the polishing machine, 9B model both side polishing machine manufactured by Speedfam Co., Ltd. was used, and polishing was carried out for 25 minutes under a polishing pressure of 8 kPa at a carrier circumferential velocity of 40 m/min at a polishing fluid-supplying rate of 40 ml/min (Examples 1 to 8,
Comparative Examples 1 and 3 to 14), or for 15 minutes under a polishing pressure of 12 kPa at a carrier circumferential velocity of 40 m/min at a polishing fluid-supplying rate of 60 ml/min (Example 9 and
Comparative Example 2). Then, the test specimen after polishing was subjected to immersion in an acidic cleanser sclution, immersion in an alkaline cleanser solution, scrub cleaning with Bellclean and an alkali cleanser, immersion in an alkaline cleanser solution, scrub cleaning with Bellelean and an alkali cleanser, ultrasonic wave cleaning in a state as immersed in an alkaline cleanser solution, ultrasonic wave cleaning in a state as immersed in pure water and ultrasonic wave cleaning in a state as immersed in pure water sequentially, followed by spin drying. Here, every time when the polishing fluid was changed, the polishing pads were subjected to brush cleaning for 3 minutes while supplying pure water.
And, the following evaluation of properties was carried out. The measured results are also shown in
Table 1. With respect to Examples 1 to 8 and Comparative
Examples 3 to 14, the results are shown by relative values to Comparative Example 1, and with respect to
Example 9, the results are shown by relative values to
Comparative Example 2.
With respect to Examples 1 to 8 and Comparative
Examples 3 to 14, prior to the measurements, the reference values were obtained by measuring the property values by using the polishing fluid of Comparative
Example 1, and with respect to Example 9, the reference values were cbtained by measuring the property values by using the polishing fluid of Comparative Example 2, and the respective measured values were compared with the preliminarily obtained reference values.
EVALUATION OF PROPERTIES
(1) Polishing rate
The polishing rate was obtained from the weight change as between before and after the polishing, and the polishing area of 30.02 (cm®) and the specific gravity of the polishing substrate of 2.77 (g/cm®). The polishing rate of Comparative Example 1 was from 0.020 to 0.030 {um/min) , and the polishing rate of Comparative Example 2 was from 0.035 to 0.045 (um/min). The results are shown in Table 1, wherein the numerical value being larger than 1 means that the polishing rate is higher than
Comparative Example 1 or 2, and the numerical value being smaller than 1 means that the polishing rate is lower than Comparative Example 1 or 2. Such a relative polishing rate being at least 0.7 is a practically acceptable level. (2) Roll-off
The roll-off value was measured by using NV5000 manufactured by Zygo. The measurements were carried out in such a manner that the measurement of the substrate edge surface (the roll-off measurement) was carried out at the same portion before and after the polishing to measure the roll-off change (the sagging degree of the edge surface) as between before and after the polishing.
The results are shown in Table 1, wherein the smaller the numerical value, the smaller the edge surface sagging and the better. Such a relative roll-off being less than 0.9 1s an acceptable level. {3) Surface roughness
The surface roughness Ra was measured by using AFM manufactured by Veeco. The results are shown in Table 1, wherein the numerical value being larger than 1 means that the surface roughness is deteriorated as compared with Comparative Example 1 or 2, and the numerical value being smaller than 1 means that the surface roughness is improved as compared with Comparative Example 1 or 2, and the smaller the numerical value, the less the surface roughness, such being desirable. (4) Dispersibility
A polishing fluid before the polishing and the polishing fluid after the polishing were recovered, and the D50 value and the distribution width sd were measured by using a particle size distribution measuring machine (MICROTRAC) manufactured by NIKKISO CO., LTD. A case where they are lower than the measured values of D50 and distribution width sd of Comparative Example 1 or 2 was rated to be *O”, a case where they were substantially the same as such the measured value was rated to be *(07, and a case where they were higher, was rated to be “X7,
The smaller the DS0 value and the distribution width sd of the slurry recovered after the polishing, the less the agglomeration of the slurry during the polishing, and the higher the effect to suppress agglomeration of the slurry (the effects to stabilize the slurry) of the additive.
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Ie, 0 nm Elo rel @ pli el 0 fine — 0 Uln|d T= o 0 2 TU 3 ufl—~[@ 2 ar | -~ ~l Ol >™| gram go — @ co n| mA E ~ ON |g| Uggla 0 -— | AB Ca Gl], N N OO; Of wf-A | Ui dU 1D ole U Hw) g|-H oA] SH fg MH 2 el oO 0 MH Dr g 210g doe BA oO - a Sy 0 Uo ad oH V Uv QL | gl ai o i — ml HY HH EE on eed A OW Hi 00 gl 2 E 98 ~|—]o LiLlalo O Ml nf oly |g8[0(U ~| gq — gl 3-Adln bs Slglg|— ALO dU s]® dO — a clo HA elolg|leftta| gle ~|L af O|H| | gl] Sd fr] of O15 BIg SER Baliga yd BIE 3a 45231428 4 0 = HHH BO dH Ul ElJ|E Al” T| Al 3|H415]0|0|3 ® a || D U|A HP |gE |= | ~~ aA | gi xu oe 1 0 a 0 2 mM
H fu <q A ml x x n
~ « , 0 x Slo
Hl o wn| |o|ot > N © © . tt o Lo o — _ a SIR 5 A m « ; 0 c Slaw : SIS alee | 515 slol 57] S ] 1 - ~N \0 o a|afo ~ od] — 8 5 7 oN fi oy 118 wu 51 = HI ay
E
0 0 — & .
Ln od ~ ~ Meo AH} = : o = oN
E
0
L g 2 5 © o LU =H o; mn © -— > H > - ula 0 U uD rl — of [3 0 dl |o gE 2 zl |olg |g In ui |W A 4 3 Ml—~|. 4H |= E ® u|0|o a, 0 0 miaeej | ug sleet] 0 ~la| gl 3 ba dl —— nlf 0 ° |g stul 58 | |ofE oloi@ 0 0 Ol © lr Hoo | BH aU
TR ol El gl ~ Heald gl Bll w| [Qe |B ~=| Slo to dls hlolo eu — a wo |-H 0 ol uo ~— o|H{=|0 D © 0 0 E|®| gl -H Hin al @ ® ol — 0 IGT T 3ql gE oO Hi 0 io) = p|—| © oy Uf-~ © Sina 818 8 oo a | fH gE —~ Dl |g| © uo HD | plo u -— oA wu or WH. N N Oz wid aloo per
D cil a 0 -A MUIR EE EEE EI E RIE.
Jo dB E|—~ U ol wn ne = ddl ~ 0 U 0 0 H ola P| Oy J ula oO ~ a] 0 vo old © @ QQ > | gg c = mi HH NH EE ol [HAR efa|gi-dlu a 0 gl BE olg ~~ Lipo U HH UH 800 ~~] yg - ala 3 Hw Si lalgldl= [He dl elalplurd ol I
S00 ME GOS O00) S| aL ~|L ul gw Ql gw A Po £3 wi BiH Hd BED Bd Qe | HOB HA a) BQ g]etid H 5) [iu] | HH ©] 0 mA 5 OQ El 4 ® H|@ Of .A Sa |5]0|013 ©
E [AO vj HBB Eg] ga praia | glee Hy .- 0 Td oO —
Bi Ay <L Ay a *
0 o (wl [wn B Ml <r a . @ Jef fxg ~ HINIC, al © : 2 ln
E
0
U
E~ z wn ~ wl [un] [a o~ "lee © oc . oN * . ~ lt al 0, © —
E
0 oO 0 ¥ ln
M o |u| [wlio ~ “ole wn } + [oy * 15] ™ iM o a, a © 0
U 0 o 9 @ a . 0 i " . 1 mM tn
Ln + ~ oN Q
MN] . . } ™ * Me ol HIN, o T a g 2 £ 5 3
U ~
Tg o 2 —_ E a 4 o O w 0 - om nln 0 -r > wi > - vlA 0 U ol fA ~ —~ U oH Q 103 J ke)
Q, 2 |olg |g Ly al | w xz 0, nl © 0 ~ o —| o wo 3 Hal [AE @® o|olw o 5 | slalsls 38 z\o dg |g sla Sle (8 |oE (|B8)e 3
Q 0 Ulm ~~ gl WHF c
Q -H O|E| gl ™H S52 E ni A 0 uw jor HY I~] go DD G|lu|lo Ww —_ c mod Q ml @ noo oH] ela — o ao {i El ©} of A Hl ny a= @ = @ - i! 0 Uly{o T lal g 0 Pa wn l=] ® By u|-A ® O|~|glo|molg a Hl mH E —~ oO —|g| Og Dali o “ | AL 0 a @(-~ 5] N N Off] @f-r | Qo; o
Ih alla Ud Hy Al GY Old [| HH 2 QO o ol—tw Ej gf tow wy Ofldig| |~|0C ~~ 0
UO Ov gi | 0 UL > Hal HH oO -= of Mw MHA EE ol ed Ug aed 0 a dl SE Blo ~—i—| gp vilalo O Hid Olu 318010 ~| 7d - Along Aw 5 {884 |= 2 dl sjelG|nl|c ol 50 fm] wl OH HIS SEL 5 gad EIR 2 Bla)8|d|5iE «© = 3 Al HH 810 wl NO Elg|8 &|0 TA 2a 0l0i3 ©
Oia HEE RCSA Cla | Salads ela a a 0 a 0 b> $n
Bu Ay a af cal * x wy
Be wl fo 0 No aq 9 u N * N —|[
ON
Mm , Mm — 2 Ln _ w Mm @ ©
G ~ oN =| — —
Uy 0 e Lf r- wn a Mle a g ™ x ~ alte I
OM fx] , ~ 2 2 al [5] «| 2 w |7e HE ' ™~ 3 u i Hl =
Lo a, Ln o| © £ Ln tn «© ~ S| . .
Qu ™ a | Hl 0
[5] a” mM =H |o g © 1 — ln. - 0 M = © ~ _— A
Um _ QU
E ga lg dl [ih 0 0 ~ oN —
Im jo] — oH =H ® Ww 0
Sz | EEE BeHe lg — - uo go |g 5 |u a |BB|olEl (Blo |w 0 |0E 0 | HoH glalx| |ale [wim
QO SE Ia QO E H Hgid| Ed ol m ml [& |B = = Bp EN lo jo —_ oO 0 HE 0 0 0 Di~— ol H >la 3 0 wn ~~ £ uy -A A Of in ai~ Hl ~~
O Al |= | © 0 ¢ |d ong 0 Llu oly = |= © oa o - A 3 0 >| glo SIE 0] > a aim ED DO |g plo 0 LB Alb plo ~~ Ll - |i Om Hla gl N N 35 al Lu Ul Bm
U gla a UH MH 0s qd HA hl gH [wlh HID WH g|l—|o — QQ — ul" u- df=] Gdn ~1Q OU ~~
FS) 0 - oO OY of > Oly mw 4 21.0 m HO capoo 0 oo 8 gd d DIT S00 Dy Hig gw Plo go — ol HE Hd dE mult El wn Bl ojalgld WOH qa
SBE OS Ng 2 PEA glo su Oh glg ~~ 0/0 V's 0g _- Al 3 sin A = SE Ela pH" T gl 8|Ujp|l2 Om oa Sg [x wl BIH Bid SEL 8 3% sli oH a| Mlu| sd L3H Om omag i AH slo SAG No 0|Ely gle w|o Oa] 3H ]5l0 ®lal3 4 —~ Toe ve es i {M0 ola bie|gle|lE BED gla ala vB aloigla |e] a 0 o Q gq > wr~w
EH [oF PH ono = x Kk x
Ln
As shown in Table 1, by using an acidic polishing fluid having a carboxylic acid type polymer or a sulfonic acid type polymer added in accordance with the present invention, it is pogsible to reduce the roll-off while suppressing a decrease of the polishing rate. Further, the surface state is good, and the dispersibility of colloidal silica is excellent.
TEST 2: WITH RESPECT SECOND POLISHING FLUID
PREPARATION OF POLISHING FLUIDS
As shown in Table 2, a polishing fluid was prepared which comprises a colloidal silica slurry (average particle size of primary particles: 20 to 30 nm, silica particle concentration: 48 mass%), the identified additive (sulfonic acid type surfactant), nitric acid and pure water. The colloidal silica concentration was 15 mass%, and the amount of the sulfonic acid type surfactant was identified by an amount to the amount of the colloidal silica. Further, the pH of the polishing fluid was 2. In the Table, alkylsulfonie acid “LATEMUL
P88” is manufactured by Kao Corporation, alkylbenzene sulfonic acid “LH200" is manufactured by Lion
Corporation, alkylbenzene sulfonic acid “LH250” is manufactured by Lion Corporation, and alkylbenzene sulfonic acid “LH900” is manufactured by Lion
Corporation.
POLISHING OF MAIN SURFACES AND EVALUATICN OF PROPERTIES
In the same manner as in Test 1, the main surfaces were polished, and the same evaluation of properties was carried out.
The results are also shown in Table 2, and they are shown by relative values to Comparative Example o —— © . Oo oN 4 in 2S Cle alg nf} } SN ~ls Pll TR ET o|lo a o — 0 * in
La] 1 wi | ow [i LN} | ’ “17 ele Nn i Nore ~ | wo eo o a, £ 0 u o » o | own |o™ . “1% =e =~
V + + | * |g 0 wr || o
Fl o — in o mn! |ojo “ “Noo = e fr]
Ww o a a Oo o| jw = - nln |O Al |B 2d ot nla w U bP - = rl — fo o ju] ER] =o 2 ole |g n ul | wo Em 0, nlo |0 —~ oy lr 4 4 3 ~l.glm |AE ® g|oju u 0 u dol fo ue Sal yg ~ i ul gl 2 3 ~— —_ ml p|~ g 9 | ula 1a [ol El [oles TO
Q 0 Gd Ho 5 AHAB H| © rd ov |-A El gH MSDE | [2 Od w| | | ~lale |& Bix qlo|o T co nd ol @ wo plH| =| 0 w 0 0 ©) =| Hin ol [Hu 0 ~H |= lo O|p|T |T 2la|g po] (Blo = 9 ol=le [a = @| o| >| glo|slg = alma [BE —~ —Hlglo |og AD | gle|A|e ou oll 108 Alan IN Of oo wl d| OD “HN al¥lg 10 w'5lA real go fH] SS 4g ol—| © El ~ =| ju wil o|=|g| |~|D J 0 0 O o~|g 0 3 La ol | n.Q vo gd LB O jo a> [Hig ew IN of H[H M|=2 E[E ik AeA Bon |gldwlo — fl BE ofa —|—|g| |Llalo |v aldiv|alalglolo ~~ ~ al 3 Ha S| gla | 0] 8islo| Sle of Ad o|uio HA vlog of 3 EL =e ul Siw glA|Alw Al dO
Mm EE EE EEE EH FE PE EE EERE EE ie alsln slo ofAl5 Elgl® 8|d OT]. 3d |3| 003 © . 0 T 0 on
E+ iat FL Ay a * * wn o —
Oo :
A in Tio Cl oe [De o| + o~ =H 0 » . . . . oO ol 0 a9 = & > — 0 * 0 —— i o ] n oN is 0 Se Ne ||? ~~ © ; a ~l a he 0 |-H2 of ~ a oO
E — 0 * = 53] o~ ~ Nin on @
AEC el SS ale] . Hi oO " o a | CIN ©
M o
I~ x eo — is oO . o oN i © Jnl [EN lw |g oN — . oN (—lo oo [HT o — : job oO g 3
U * 2 - 5 0 ib or nw dd -ri > o > olA i] U +o a! +r —~ pr] o ™ J 0 oy ol 8 a un - wn ul oh wn © 0 —~ o —|H 5 = ~lg| [|= E ® ul o|o u 0 u oe || 4d FR lA MH pat @lgl2 [2 T=| |wjr|el g ° |g nlslQ |A | olE plo ® 0 0 0 dl ol Ho~{ ol~ Re RUIRYIN 4 a |-A El g|™ HED 3 ol ~ in nl | ||P —| gle |v lx al 0] © 2 go no | gla tn o{D~— | HP® u
To 0 0 ©) afd -~ | Tn al—|A|® @ Al |= 0 OI'p|T |T Bala of |e] o a 5 nlm 0, -A @o|~glo|sld a a Hl @-r gE — m0 Ug Hid | gl BHD u - olaule 0&8 Ag N | N Opa afr slot N jt alle jo-d o|GlA AAR gl | SS] 5 o gl~o Ef~ Sl |mel=|ol4]|g| |—]|0 ao 0 oO H mig Ofiy 3 lq of |& A 0 | a8 lH iu] o © al > Hg Gi iy = mf Hw ula Ele ol—= |= AR] ola |Bldjw|e > gl 2 E 08 —ji~|o ul ato O HIF OINLAGI0{0 ~ ~ 1 al wl 3 Hie 5 lal HL FiBoglu iis of alulo spa olelble 3a =p ul §lwia|glAlalw A] < = w| BIH Hig RIEL 2ull ElN gia Hlalgjdidiy
A | Hid © 0 w@f-Ai Elq|® Sj T.d Jid15]/0o|0|3 © .
Pa Oo o 0 > — = Ay «4 o mM *
As shown in Table 2, by using a polishing fluid containing a surfactant having a sulfonic acid group in a specific amount, it is possible to reduce the roll-off while suppressing a decrease in the polishing rate.
Further, the surface state is good, and the dispersibility of colloidal silica is excellent.
The process for producing a glass substrate for magnetic disks of the present invention, is useful since it is thereby possible to efficiently produce a glass substrate for magnetic disks having a wide recording area to make a high recording capacity possible.
The entire disclosure of Japanese Patent Application
No. 2007-216839 filed on August 23, 2007 including specification, claims, drawings and summary is incorporated herein by reference in its entirety.
Claims (9)
1. A process for producing a glass substrate for magnetic disks, which comprises a step of polishing a main surface of a circular glass plate by using an acidic polishing fluid containing colleidal silica or fumed silica, and a water-soluble polymer having at least one member selected from a group consisting of a carboxylic acid group, a carboxylate group, a sulfonic acid group and a sulfonate group, bonded to its main chain.
2. The process for producing a glass substrate for magnetic disks according to Claim 1, wherein in the water-soluble polymer, its main chain is linear.
3. The process for producing a glass substrate for magnetic disks according to Claim 1 or 2, wherein the weight average molecular weight of the water-soluble polymer is at least 5,300.
4. The process for producing a glass substrate for magnetic disks according to any one of Claims 1 to 3, wherein the weight average molecular weight of the water- soluble polymer is at least 6,000.
5. The process for producing a glass substrate for magnetic disks according to any one of Claims 1 to 4, wherein the content of the water-soluble polymer in the polishing fluid is from 0.001 to 10 parts by mass per 100 parts by mass of the colloidal silica or fumed silica.
6. A process for producing a glass substrate for magnetic disks, which comprises a step of polishing a main surface of a circular glass plate by using an acidic polishing fluid containing 100 parts by mass of colloidal silica or fumed silica, and from 0.02 to 0.1 part by mass of a surfactant having a sulfonic acid group.
7. The process for producing a glass substrate for magnetic disks according to Claim 6, wherein the surfactant having a sulfonic acid group is an alkyl sulfonic acid, an alkylbenzene sulfonic acid or an alkylnaphthalene sulfonic acid.
8. The process for producing a glass substrate for magnetic disks according to any one of Claims 1 to 7, wherein the content of colloidal silica or fumed silica in the above polishing fluid is from 5 to 40 mass%.
9. The process for producing a glass substrate for magnetic disks according to any one of Claims 1 to 8, wherein the average particle size of primary particles of the colloidal silica or fumed silica is from 1 to 100 nm.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007216839A JP2009050920A (en) | 2007-08-23 | 2007-08-23 | Manufacturing method of glass substrate for magnetic disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG183731A1 true SG183731A1 (en) | 2012-09-27 |
Family
ID=40378161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012060422A SG183731A1 (en) | 2007-08-23 | 2008-08-18 | Process for producing glass substrate for magnetic disks |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090239450A1 (en) |
| JP (1) | JP2009050920A (en) |
| CN (1) | CN101588895B (en) |
| SG (1) | SG183731A1 (en) |
| WO (1) | WO2009025259A1 (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5233621B2 (en) * | 2008-12-02 | 2013-07-10 | 旭硝子株式会社 | Glass substrate for magnetic disk and method for producing the same. |
| JP5326638B2 (en) * | 2009-02-18 | 2013-10-30 | 富士電機株式会社 | Method of manufacturing glass substrate for magnetic recording medium, glass substrate for magnetic recording medium in which it is used, and perpendicular magnetic recording medium |
| WO2011021478A1 (en) * | 2009-08-17 | 2011-02-24 | コニカミノルタオプト株式会社 | Method for manufacturing glass substrate, glass substrate, method for manufacturing magnetic recording medium, and magnetic recording medium |
| JP2011110637A (en) * | 2009-11-25 | 2011-06-09 | Asahi Glass Co Ltd | Method for manufacturing glass substrate for magnetic disk |
| JP4858622B2 (en) * | 2010-02-26 | 2012-01-18 | 旭硝子株式会社 | Method for manufacturing glass substrate for magnetic recording medium |
| US9053736B2 (en) | 2010-04-20 | 2015-06-09 | Kao Corporation | Method for manufacturing an aluminosilicate glass substrate for hard disks |
| JP5499324B2 (en) * | 2010-04-28 | 2014-05-21 | 旭硝子株式会社 | Glass substrate for information recording medium, polishing colloidal silica slurry for manufacturing the same, and information recording medium |
| JP5940270B2 (en) * | 2010-12-09 | 2016-06-29 | 花王株式会社 | Polishing liquid composition |
| JP5768554B2 (en) * | 2011-07-21 | 2015-08-26 | 旭硝子株式会社 | Manufacturing method of glass substrate for magnetic recording medium and glass substrate for magnetic recording medium |
| JP2014041978A (en) | 2012-08-23 | 2014-03-06 | Fujimi Inc | Polishing composition, manufacturing method of polishing composition, and manufacturing method of polishing composition undiluted solution |
| JP6110681B2 (en) * | 2013-02-13 | 2017-04-05 | 株式会社フジミインコーポレーテッド | Polishing composition, polishing composition manufacturing method and polishing product manufacturing method |
| MY182263A (en) * | 2014-01-31 | 2021-01-18 | Hoya Corp | Method for manufacturing magnetic-disk substrate and method for manufacturing magnetic disk |
| CN106271959A (en) * | 2016-08-15 | 2017-01-04 | 安徽省银锐玻璃机械有限公司 | The method of glass craft edging |
| JP6734146B2 (en) * | 2016-08-23 | 2020-08-05 | 山口精研工業株式会社 | Abrasive composition for magnetic disk substrate |
| JP7122097B2 (en) * | 2017-10-24 | 2022-08-19 | 山口精研工業株式会社 | Abrasive composition for magnetic disk substrate |
| JP7083680B2 (en) * | 2018-04-05 | 2022-06-13 | 花王株式会社 | Abrasive liquid composition |
| US10479911B1 (en) | 2018-06-05 | 2019-11-19 | Cabot Microelectronics Corporation | Composition and method for polishing memory hard disks exhibiting reduced edge roll off |
| WO2021053732A1 (en) | 2019-09-17 | 2021-03-25 | Ａｇｃ株式会社 | Abrasive agent, method for grinding glass, and method for producing glass |
| CN111421399A (en) * | 2020-04-26 | 2020-07-17 | 东莞南玻工程玻璃有限公司 | Polishing method for removing mildew on glass surface |
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| US5738800A (en) * | 1996-09-27 | 1998-04-14 | Rodel, Inc. | Composition and method for polishing a composite of silica and silicon nitride |
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| JP4372237B2 (en) * | 1997-12-24 | 2009-11-25 | 花王株式会社 | Polishing method for magnetic recording medium substrate |
| JP4092011B2 (en) | 1998-04-10 | 2008-05-28 | 花王株式会社 | Polishing liquid composition |
| JP2000087010A (en) | 1998-09-14 | 2000-03-28 | Denki Kagaku Kogyo Kk | Polishing composition |
| JP4171859B2 (en) | 1999-06-23 | 2008-10-29 | Ｊｓｒ株式会社 | Polishing composition and polishing method |
| JP4171858B2 (en) | 1999-06-23 | 2008-10-29 | Ｊｓｒ株式会社 | Polishing composition and polishing method |
| US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
| US6409781B1 (en) * | 2000-05-01 | 2002-06-25 | Advanced Technology Materials, Inc. | Polishing slurries for copper and associated materials |
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| US20060205219A1 (en) * | 2005-03-08 | 2006-09-14 | Baker Arthur R Iii | Compositions and methods for chemical mechanical polishing interlevel dielectric layers |
| JP4390757B2 (en) * | 2005-08-30 | 2009-12-24 | 花王株式会社 | Polishing liquid composition |
| CN102863943B (en) * | 2005-08-30 | 2015-03-25 | 花王株式会社 | Polishing composition for hard disk substrate, polishing method and manufacture method of substrate |
| GB2433516B (en) * | 2005-12-22 | 2010-11-03 | Kao Corp | Polishing composition for glass substrate |
| JP5283247B2 (en) * | 2005-12-22 | 2013-09-04 | 花王株式会社 | Polishing liquid composition for glass substrate |
| WO2010038706A1 (en) * | 2008-10-01 | 2010-04-08 | 旭硝子株式会社 | Polishing liquid and polishing method |
| JP5499324B2 (en) * | 2010-04-28 | 2014-05-21 | 旭硝子株式会社 | Glass substrate for information recording medium, polishing colloidal silica slurry for manufacturing the same, and information recording medium |
-
2007
- 2007-08-23 JP JP2007216839A patent/JP2009050920A/en active Pending
-
2008
- 2008-08-18 WO PCT/JP2008/064711 patent/WO2009025259A1/en active Application Filing
- 2008-08-18 CN CN200880001536.8A patent/CN101588895B/en not_active Expired - Fee Related
- 2008-08-18 SG SG2012060422A patent/SG183731A1/en unknown
-
2009
- 2009-06-03 US US12/477,197 patent/US20090239450A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN101588895B (en) | 2011-10-26 |
| JP2009050920A (en) | 2009-03-12 |
| US20090239450A1 (en) | 2009-09-24 |
| WO2009025259A1 (en) | 2009-02-26 |
| CN101588895A (en) | 2009-11-25 |
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