SG175022A1 - Substrate cool down control - Google Patents
Substrate cool down control Download PDFInfo
- Publication number
- SG175022A1 SG175022A1 SG2011071701A SG2011071701A SG175022A1 SG 175022 A1 SG175022 A1 SG 175022A1 SG 2011071701 A SG2011071701 A SG 2011071701A SG 2011071701 A SG2011071701 A SG 2011071701A SG 175022 A1 SG175022 A1 SG 175022A1
- Authority
- SG
- Singapore
- Prior art keywords
- cool down
- down control
- substrate cool
- substrate
- control
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
- G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0255—Sample holders for pyrometry; Cleaning of sample
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance
- G01K11/18—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance of materials which change translucency
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17112809P | 2009-04-21 | 2009-04-21 | |
US12/758,206 US20100265988A1 (en) | 2009-04-21 | 2010-04-12 | Substrate cool down control |
PCT/US2010/030741 WO2010123711A2 (en) | 2009-04-21 | 2010-04-12 | Substrate cool down control |
Publications (1)
Publication Number | Publication Date |
---|---|
SG175022A1 true SG175022A1 (en) | 2011-11-28 |
Family
ID=42980946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2011071701A SG175022A1 (en) | 2009-04-21 | 2010-04-12 | Substrate cool down control |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100265988A1 (en) |
JP (1) | JP2012525002A (en) |
CN (1) | CN102405510A (en) |
SG (1) | SG175022A1 (en) |
TW (1) | TW201039400A (en) |
WO (1) | WO2010123711A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006043324A1 (en) * | 2006-09-15 | 2008-03-27 | Robert Bosch Gmbh | Plug-in sensor for combined pressure and temperature measurement |
US10557190B2 (en) * | 2013-01-24 | 2020-02-11 | Tokyo Electron Limited | Substrate processing apparatus and susceptor |
KR102452722B1 (en) * | 2015-08-27 | 2022-10-06 | 삼성전자주식회사 | Substrate Processing Apparatus |
US10571337B2 (en) * | 2017-05-26 | 2020-02-25 | Applied Materials, Inc. | Thermal cooling member with low temperature control |
CN107511589B (en) * | 2017-10-17 | 2024-06-21 | 深圳华创兆业科技股份有限公司 | Multi-axis laser slot milling machine |
CN115315794A (en) * | 2020-03-10 | 2022-11-08 | 东京毅力科创株式会社 | Long wave infrared thermal sensor for integration into a tracking system |
TWI815519B (en) * | 2022-06-24 | 2023-09-11 | 樂華科技股份有限公司 | Smart wafer transfer equipment and method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH658516A5 (en) * | 1982-08-20 | 1986-11-14 | Mettler Instrumente Ag | SCALE WITH ELECTROMAGNETIC POWER COMPENSATION. |
JP2824003B2 (en) * | 1993-02-16 | 1998-11-11 | 大日本スクリーン製造株式会社 | Substrate temperature measurement device |
JPH06295915A (en) * | 1993-04-09 | 1994-10-21 | F T L:Kk | Manufacturing device for semiconductor device and manufacture of semiconductor device |
US6602348B1 (en) * | 1996-09-17 | 2003-08-05 | Applied Materials, Inc. | Substrate cooldown chamber |
JP3966490B2 (en) * | 1999-02-16 | 2007-08-29 | 株式会社小松製作所 | Substrate temperature estimation apparatus and method, and substrate temperature control apparatus using the same |
US6193811B1 (en) * | 1999-03-03 | 2001-02-27 | Applied Materials, Inc. | Method for improved chamber bake-out and cool-down |
CN101324470B (en) * | 2001-12-26 | 2011-03-30 | 加拿大马特森技术有限公司 | Temperature measurement and heat-treating methods and systems |
KR100479988B1 (en) * | 2002-07-24 | 2005-03-30 | 미래산업 주식회사 | Method for compensating temperature in semiconductor test handler |
US6976782B1 (en) * | 2003-11-24 | 2005-12-20 | Lam Research Corporation | Methods and apparatus for in situ substrate temperature monitoring |
US20060286807A1 (en) * | 2005-06-16 | 2006-12-21 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
US8029186B2 (en) * | 2004-11-05 | 2011-10-04 | International Business Machines Corporation | Method for thermal characterization under non-uniform heat load |
US7642205B2 (en) * | 2005-04-08 | 2010-01-05 | Mattson Technology, Inc. | Rapid thermal processing using energy transfer layers |
KR20070053476A (en) * | 2005-11-21 | 2007-05-25 | 삼성전자주식회사 | Cooling apparatus for semiconductor manufacturing equipment |
US7398693B2 (en) * | 2006-03-30 | 2008-07-15 | Applied Materials, Inc. | Adaptive control method for rapid thermal processing of a substrate |
US7412346B2 (en) * | 2006-10-27 | 2008-08-12 | Intel Corporation | Real-time temperture detection during test |
JP2008117956A (en) * | 2006-11-06 | 2008-05-22 | Daikin Ind Ltd | Substrate cooling apparatus |
US20090034582A1 (en) * | 2007-08-02 | 2009-02-05 | Tokyo Electron Limited Tbs Broadcast Center | Apparatus for hot plate substrate monitoring and control |
-
2010
- 2010-04-12 US US12/758,206 patent/US20100265988A1/en not_active Abandoned
- 2010-04-12 CN CN2010800181420A patent/CN102405510A/en active Pending
- 2010-04-12 SG SG2011071701A patent/SG175022A1/en unknown
- 2010-04-12 JP JP2012507252A patent/JP2012525002A/en not_active Withdrawn
- 2010-04-12 WO PCT/US2010/030741 patent/WO2010123711A2/en active Application Filing
- 2010-04-20 TW TW099112388A patent/TW201039400A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2010123711A3 (en) | 2011-01-20 |
WO2010123711A2 (en) | 2010-10-28 |
TW201039400A (en) | 2010-11-01 |
JP2012525002A (en) | 2012-10-18 |
CN102405510A (en) | 2012-04-04 |
US20100265988A1 (en) | 2010-10-21 |
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