TWI815519B - Smart wafer transfer equipment and method - Google Patents

Abstract

The invention relates to a smart wafer transfer equipment and method. The main structure includes a device carrier internally defining a receiving space, a wafer transfer component movably disposed in the receiving space, and a gas control device disposed in the receiving space. , an air purification device connected to the storage space, and is provided with a plurality of first vibration sensors and a first temperature sensor for the wafer transfer component, and is provided with a flow sensor and a pressure sensor corresponding to the gas control device, Corresponding to the air purification device, a second vibration sensor and a pressure difference sensor are provided, and a monitoring device is used to collect data from each sensor during the transportation process of the wafer transfer equipment to determine the wafer transfer component, gas control device, air Check whether purification devices, etc. are operating abnormally, and monitor their lifespan for preventive repair or maintenance.

Description

Smart wafer transfer equipment and method thereof

The present invention provides a smart wafer transfer equipment and method that uses a large number of sensors to monitor the operating status of each component to determine whether the operating status, setting status and life status are normal.

According to, in the semiconductor device manufacturing process, wafers are required to be transported in a particle-free and chemical-free environment, and sealed storage containers (Front-Opening Unified Pod, FOUP) are required to be transported between wafers and processing equipment. A transfer room (Equipment Front End Module, EFEM) where wafers are received and received. In the transfer room, the fan filter unit (Fun Filter Unit, FFU) installed at the upper part is usually used to suck external clean air into the clean room, so that downflow gas is generated inside and discharged from the ground to the outside, so that the inside of the transfer room can be Stably obtain a certain clean atmosphere.

In addition, before the wafer is cut into wafers, a probe machine (Probe) is usually used to test the wafers on the wafer carrier ring, and the wafers are classified according to the electrical, optical properties, appearance and other characteristics of each wafer, and then the wafers are classified into wafers. The sorter (Chip Mapping-Sorter) uses the position information of the wafers provided by the pin tester to neatly select and arrange wafers of the same type onto the adhesive film of another wafer carrier ring to facilitate subsequent operations of the process equipment.

However, when the above-mentioned transport room (EFEM) and wafer sorter (SORTER) are used, there are the following problems and deficiencies that need to be improved:

First, protection and protection are generally only provided for the wafers they process, but not for EFEM and SORTER themselves.

Second, EFEM and SORTER generally do not have monitoring equipment that can ensure their own mechanical action frequency behavior, component temperature, air flow pressure, and static electricity to prevent the wafers being processed from being affected by them and reducing the quality.

Therefore, how to solve the above conventional problems and deficiencies is the direction that the inventor of the present invention and related manufacturers engaged in this industry are eager to research and improve.

Therefore, in view of the above shortcomings, the inventor of the present invention collected relevant information, evaluated and considered many aspects, and used his many years of experience in this industry, and through continuous trials and modifications, he designed this kind of monitoring system that uses a large number of sensors. The inventor of the smart wafer transfer equipment and its method to determine whether the operating status, setting status and life status of each component are normal.

The main purpose of this invention is to detect whether the air pressure and airflow inside the machine and the frequency of mechanical action are normal during the wafer transportation process, so as to ensure the quality of the machine's working environment and perform preventive maintenance, thereby extending the machine's life. Taiwan life.

In order to achieve the above object, the main structure of the present invention includes: a device carrier, a receiving space, a wafer transfer component, a gas control device, an air purification device, a plurality of first vibration sensors, a first temperature sensor, A flow sensor, a pressure sensor, a second vibration sensor, a pressure difference sensor and a monitoring device, wherein the receiving space is defined in the device carrier, and the wafer transfer component is movably arranged in the receiving space , the gas control device is located in the receiving space, the air purification device is located on one side of the device carrier and connected to the receiving space, the first vibration sensors are located on the wafer transfer component, the first temperature sensor The device is provided in the wafer transfer assembly, the flow sensor is provided on the gas control device, the pressure sensor is provided on the gas control device, the second vibration sensor is provided on the air purification device, and the pressure sensor is provided on the gas control device. The difference sensor is disposed between the air purification device and the device carrier, and the monitoring device information links the first vibration sensors, the first temperature sensor, the flow sensor, the pressure sensor, and the second Vibration sensor, and the pressure difference sensor.

By arranging various targeted sensors on the wafer transfer components, gas control devices, and air purification devices of the device carrier to detect the mechanical conditions and temperature rise conditions of the wafer transfer components, and the air flow of the gas control devices Air pressure conditions, temperature rise conditions, as well as the performance and static elimination capabilities of the air purification device, thereby ensuring the quality and safety of the wafer transportation process of the device carrier, so as to monitor the device carrier while ensuring that the wafer quality is not affected. Carry out preventive repairs and maintenance according to the condition.

Through the above technology, the problem of conventional wafer sorters (SORTER) and transport rooms (EFEM) that do not have monitoring equipment that can ensure their own mechanical action frequency behavior, component temperature, air flow pressure, and static electricity can be addressed. Breakthrough to achieve the practical and progressive nature of the above advantages.

1:Device carrier

11: Containment space

12: Translation mechanism

2: Wafer transfer components

21:Lifting mechanism

22:Robotic arm

23: End effector

3: Gas control device

4: Air purification device

51:The first vibration sensor

52: First temperature sensor

53:Flow sensor

54: Pressure sensor

55: Second vibration sensor

56: Pressure difference sensor

57:Electrostatic sensor

58: Second temperature sensor

6:Monitoring device

61:Alarm module

The first figure is a three-dimensional perspective view of a preferred embodiment of the present invention.

The second figure is a structural block diagram of a preferred embodiment of the present invention.

The third figure is a block flow diagram of a preferred embodiment of the present invention.

The fourth figure is a schematic diagram of the induction of the wafer transfer component according to the preferred embodiment of the present invention.

The fifth figure is a schematic diagram of the induction of the gas control device according to the preferred embodiment of the present invention.

Figure 6 is a schematic diagram of the induction of the air purification device according to the preferred embodiment of the present invention.

Figure 7 is a schematic diagram of vibration monitoring according to the preferred embodiment of the present invention.

Figure 8 is a schematic diagram of temperature monitoring according to the preferred embodiment of the present invention.

Figure 9 is a schematic diagram of differential pressure monitoring according to the preferred embodiment of the present invention.

Figure 10 is a schematic diagram of pressure and flow monitoring according to the preferred embodiment of the present invention.

Figure 11 is a schematic diagram of electrostatic induction according to another preferred embodiment of the present invention.

Figure 12 is a schematic diagram of static electricity monitoring according to another preferred embodiment of the present invention.

Figure 13 is a three-dimensional perspective view of another preferred embodiment of the present invention.

Figure 14 is a perspective view of another preferred embodiment of the present invention.

In order to achieve the above-mentioned objects and effects, the technical means and structures adopted by the present invention are described in detail below with respect to the preferred embodiments of the present invention, so as to facilitate a complete understanding.

Please refer to the first to third figures, which are three-dimensional perspective views to block flow diagrams of preferred embodiments of the present invention. It can be clearly seen from the figures that the wafer transfer equipment of the present invention is a wafer sorter. (Chip Mapping-Sorter) or transfer room (Equipment Front End Module, EFEM). This embodiment takes the transfer room as an example, and the present invention includes:

A device carrier 1, and a receiving space 11 is defined in the device carrier 1. The device carrier 1 in this embodiment takes the frame and shell of the transfer chamber as an example;

A wafer transfer component 2 is movably installed in the receiving space 11. The wafer transfer component 2 has a lifting mechanism 21, a robotic arm 22 pivoted on the lifting mechanism 21, and a robotic arm 22. The end effector 23 on one side of 22;

A gas control device 3 is located in the receiving space 11;

An air purification device 4 is installed on one side of the device carrier 1 and connected to the receiving space 11. This embodiment takes a fan filter unit (Fun Filter Unit, FFU) as an example;

A plurality of first vibration sensors 51 are provided on the lifting mechanism 21 and the end effector 23 of the wafer transfer assembly 2;

A first temperature sensor 52 is provided on one side of the lifting mechanism 21 of the wafer transfer assembly 2;

A flow sensor 53 is provided on the gas control device 3;

A pressure sensor 54 is provided on the gas control device 3;

A second vibration sensor 55 is provided on the air purification device 4;

A pressure difference sensor 56 is provided between the air purification device 4 and the device carrier 1; and

A monitoring device 6 is information-linked to the first vibration sensors 51, the first temperature sensor 52, the flow sensor 53, the pressure sensor 54, the second vibration sensor 55, and the pressure difference sensor. 56 , this embodiment takes the human-machine interface provided on the device carrier 1 as an example.

The main steps of the monitoring method of smart wafer transfer equipment of the present invention include:

(a) Various sensors are provided on the device carrier: a plurality of first vibration sensors 51, a first temperature sensor 52, a flow sensor 53, and a pressure sensor are provided on the device carrier 1 of a wafer transfer equipment. 54. A second vibration sensor 55 and a pressure difference sensor 56;

(b) Connect each sensor with a monitoring device: connect the information of a monitoring device 6 to the first vibration sensors 51, the first temperature sensor 52, the flow sensor 53, the pressure sensor 54, and the third two vibration sensors 55 and the pressure difference sensor 56;

(c) Sensing the vibration frequency and temperature rise of the wafer transfer component: During the operation of the wafer transfer equipment, the first vibration sensors 51 are used to detect the vibration frequency of a wafer transfer component 2 and determine its Whether the operation is normal, and using the first temperature sensor 52 to detect whether the temperature rise of the wafer transfer component 2 is abnormal;

(d) Sensing the gas flow and gas pressure in the accommodation space: During the operation of the wafer transfer equipment, the flow sensor 53 is used to detect the gas flow in the accommodation space 11 of the device carrier 1, and the pressure sensor is used 54 detects the gas pressure of the containing space 11;

(e) Sensing the vibration frequency of the air purification device and the pressure difference inside and outside the containment space: During the operation of the wafer transfer equipment, the second vibration sensor 55 is used to detect whether the vibration frequency of an air purification device 4 is normal, and the pressure difference sensor 56 is used to detect the pressure difference inside and outside the receiving space 11; and

(f) The monitoring device determines whether the operating status, setting status, and life status of the wafer transfer equipment are normal: the monitoring device 6 collects the first vibration sensors 51 , the first temperature sensor 52 , and the flow sensor 53, the pressure sensor 54, the second vibration sensor 55, and the pressure difference sensor 56 to determine whether the operating status, setting status, and life status of the wafer transfer component 2 and the air purification device 4 are normal.

Through the above description, we can understand the structure of this technology, and based on the corresponding cooperation of this structure, a large number of sensors can be used to monitor the operating status of each component to determine whether the operating status, setting status and life status are normal. In detail The explanation will be explained below.

Please also refer to Figures 1 to 10, which are three-dimensional perspective views to pressure and flow monitoring schematic diagrams of the preferred embodiment of the present invention. The first vibration sensor 51 and the second vibration sensor 55 of this embodiment Taking the relative electric sensor as an example, it is mainly a single free oscillation system composed of springs, dampers and inertial mass blocks. Its main function is to monitor the vibration of rotating machinery. Each device has its own vibration standard. , exceeding the vibration value indicates an abnormality in the machine; the first temperature sensor 52 of this embodiment is a resistive contact thermometer as an example, which can achieve thermal balance through conduction or convection, so that its displayed value can directly represent the measured object Within a certain temperature measurement range, the thermometer can also measure the temperature distribution inside the object, so it has high measurement accuracy. However, it will produce large measurement errors for moving objects, small targets or objects with small heat capacity. ; The flow sensor 53 of this embodiment is a vortex flowmeter as an example, which measures flow based on the principle of fluid oscillation. When the fluid passes through the flow sensor 53 in the pipeline, it will flow on one side of the vortex generator in the form of a triangular prism. , generating two vortices that alternate up and down and are proportional to the flow rate. The release frequency is related to the average velocity of the fluid and the width of the vortex generator. From this, the average velocity of the fluid is calculated, and then multiplied by the cross-sectional area to obtain the flow rate; this embodiment The pressure sensor 54 is an air pressure sensor as an example. Its main sensing element is a membrane that is sensitive to air pressure and a thimble switch, and a flexible resistor is connected to the circuit. When the pressure of the measured gas decreases or increases, the film deforms to drive the ejector pin, and at the same time the resistance value of the flexible resistor will change, and the gas pressure is calculated through the change in resistance value; the pressure difference sensor 56 of this embodiment is composed of The aluminum alloy shell, threaded interface, cock and tower head structure are taken as an example. The working principle is that the measured pressure acts directly on the diaphragm, causing the diaphragm to produce micro-displacements proportional to the water pressure, thereby causing the capacitance value to change. changes, and uses a circuit to detect this change to output a standard measurement signal corresponding to the pressure.

In actual use, various sensors are provided on the device carrier 1 to detect the wafer transfer component 2, the gas control device 3, and the air purification device 4 when the wafer transfer equipment is operating. Specifically, the number of the first vibration sensors 51 in this embodiment is two, and they are respectively installed on the lifting mechanism 21 and the end effector 23 of the wafer transfer assembly 2, so as to detect the vibration frequency behavior of the two. Change, whether the monitoring components are installed or set abnormally (the frequency stably exceeds the standard), whether parts are aging (the frequency gradually exceeds the standard), whether there is an external force collision (the frequency instantaneously exceeds the standard), as shown in Figure 7 (A). , (B) abnormal life, and (C) abnormal external force. Similarly, the second vibration sensor 55 is provided on the air purification device 4 to monitor whether the component is installed or set abnormally, whether there is an external force collision, whether Aging of parts occurs, thereby ensuring that the air purification device 4 can inhale clean air and discharge internal air. The first temperature sensor 52 is also provided on the lifting mechanism 21. By detecting its temperature rise in real time, it can determine whether the overheating is caused by an environmental abnormality (temperature abnormality for a moment) or an overload abnormality (temperature continues to be abnormal after a certain point in time). (As shown in the eighth figure), in order to prevent the accelerated deterioration of lubricating oil quality caused by excessive temperature and the accuracy variation caused by thermal expansion, thereby preventing the robot arm 22 from moving unsmoothly or positioning inaccurately. The pressure difference sensor 56 is used to detect the pressure difference between the accommodation space 11 in the device carrier 1 and the external space, thereby detecting whether normal positive pressure is maintained inside the device carrier 1 (as shown in Figure 9) to prevent dust from flowing in. Inside the machine. The flow sensor 53 and the pressure sensor 54 are installed on the gas control device 3 to detect the gas flow and gas pressure in the storage space 11, as shown in Figure 10, to determine whether the supply is too high (continuously exceeding the standard). ), supply is too low (continuously below the standard), or lifespan is abnormal (abnormality continues after a certain point in time), thereby avoiding problems such as insufficient execution of the air purifier 4 or reduced static elimination capability.

Finally, the monitoring device 6 is used to collect and record all sensing data to ensure the quality and safety of the wafer transportation process of the device carrier 1, and to monitor the status of the device carrier 1 while ensuring that the wafer quality is not affected. Preventive repair and maintenance.

Please refer to Figures 11 and 12 at the same time, which are electrostatic induction schematic diagrams and electrostatic monitoring schematic diagrams of yet another preferred embodiment of the present invention. It can be clearly seen from the figures that this embodiment and the above-mentioned embodiment are They are similar, except that an electrostatic sensor 57 is provided on the device carrier 1. The electrostatic sensor 57 in this embodiment is a charge detector with a varistor as an example. It uses the resistance value of the varistor to change with the external environment. The characteristic of voltage change is that the induced external charge causes the voltage to change the resistance of the component, and the current will take a path with less resistance. Therefore, the electrostatic charge of the object under test can determine whether the red light or green light is turned on. And determine whether the electrostatic discharge value (ESD) exceeds the standard. In the same way, according to the time change curve of the resistance value recorded by the electrostatic sensor 57, it can also be determined whether there is a configuration abnormality (continuous exceedance) or life abnormality (continuous abnormality after a certain time point). At the same time, the electrostatic intensity can be monitored to prevent the product from occurring. The phenomenon of electrostatic breakdown and the detection result of the electrostatic sensor 57 will also be recorded in the monitoring device 6 .

Please also refer to Figure 13, which is a three-dimensional perspective view of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment, except that the device carrier 1 A translation mechanism 12 is provided inside, which is connected to the wafer transfer assembly 2 , and the translation mechanism 12 is provided with a second temperature sensor 58 . The translation mechanism 12 takes a sliding platform as an example, and is used to drive the wafer transfer assembly 2 to move horizontally, and the translation mechanism 12 can also be provided with a first vibration sensor 51 and a second temperature sensor 58 to detect Changes in vibration frequency behavior, monitoring components for installation or setting abnormalities, external force collisions, and parts aging.

Please also refer to Figure 14, which is a perspective view of another preferred embodiment of the present invention. It can be clearly seen from the figure that this embodiment is similar to the above-mentioned embodiment, except that the monitoring device 6 has a Alarm module 61. The alarm module 61 in this embodiment takes the three-color warning light provided on the device carrier 1 as an example. The alarm module 61 cooperates with the sensing data collected by the monitoring device 6 to instantly determine whether there is An abnormality occurs, and the alarm module 61 is activated when the abnormality occurs, so that the user can check the abnormal problem at the first time.

However, the above descriptions are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be treated in the same way. It is included in the patent scope of the present invention and is hereby stated.

To sum up, the smart wafer transfer equipment and method of the present invention can indeed achieve its effect and purpose when used. Therefore, the present invention is an invention with excellent practicality and meets the application requirements for an invention patent. The application is filed in accordance with the law, and we hope that the review committee will approve the invention as soon as possible to protect the inventor's hard work. If the review committee of the Jun Bureau has any doubts, please feel free to write a letter for instructions. The inventor will try his best to cooperate, which will be greatly appreciated.

1:Device carrier

11: Containment space

2: Wafer transfer components

21:Lifting mechanism

22:Robotic arm

23: End effector

3: Gas control device

4: Air purification device

51:The first vibration sensor

52: First temperature sensor

53:Flow sensor

54: Pressure sensor

55: Second vibration sensor

56: Pressure difference sensor

6:Monitoring device

Claims (10)

A smart wafer transfer equipment, which mainly includes: a device carrier, and a storage space is defined in the device carrier; a wafer transfer component is movably installed in the storage space; a gas control device is installed in the storage space In the space; an air purification device is located on one side of the device carrier and connected to the receiving space; a plurality of first vibration sensors are located on the wafer transfer component; a first temperature sensor is located on the In the wafer transfer component; a flow sensor is located on the gas control device; a pressure sensor is located on the gas control device; a second vibration sensor is located on the air purification device; A pressure difference sensor is provided between the air purification device and the device carrier; and a monitoring device is information-linked to the first vibration sensors, the first temperature sensor, the flow sensor, and the pressure sensor, the second vibration sensor, and the pressure difference sensor. The smart wafer transfer equipment described in Item 1 of the patent application, wherein the wafer transfer component has a lifting mechanism, a robotic arm pivoted on the lifting mechanism, and an end provided on one side of the robotic arm actuator, and the first vibration sensors are provided on the lifting mechanism and the end effector, and the first temperature sensor is provided on one side of the lifting mechanism. For the smart wafer transfer equipment described in item 1 of the patent application, an electrostatic sensor is provided on the device carrier. For the smart wafer transfer equipment described in Item 1 of the patent application, a translation mechanism is provided in the device carrier, which is connected to the wafer transfer component, and a second temperature sensor is provided on the translation mechanism. For the smart wafer transfer equipment described in Item 1 of the patent application, the monitoring device has an alarm module. A method for monitoring smart wafer transfer equipment. The main steps include: (a) setting a plurality of first vibration sensors, a first temperature sensor, a flow sensor, and a pressure sensor on a device carrier of a wafer transfer equipment device, a second vibration sensor, and a pressure difference sensor; (b) Link a monitoring device information to the first vibration sensor, the first temperature sensor, the flow sensor, the pressure sensor, the second vibration sensor, and the pressure difference sensor; (c) ) During the operation of the wafer transfer equipment, use the first vibration sensors to detect the vibration frequency of a wafer transfer component to determine whether its operation is normal, and use the first temperature sensor to detect the wafer Whether the temperature rise of the transfer component is abnormal; (d) During the operation of the wafer transfer equipment, use the flow sensor to detect the gas flow in the receiving space of the device carrier, and use the pressure sensor to detect the receiving space gas pressure; (e) During the operation of the wafer transfer equipment, use the second vibration sensor to detect whether the vibration frequency of an air purification device is normal, and use the pressure difference sensor to detect whether the vibration frequency inside and outside the storage space is normal. pressure difference; and (f) collecting the first vibration sensors, the first temperature sensor, the flow sensor, the pressure sensor, the second vibration sensor, and the pressure difference sensor by the monitoring device , to determine whether the operation status, setting status, and life status of the wafer transfer component and the air purification device are normal. For the monitoring method of smart wafer transfer equipment described in item 6 of the patent application, the wafer transfer component has a lifting mechanism, a robotic arm pivoted on the lifting mechanism, and a robot arm mounted on the robotic arm. The end effector on the side, and the first vibration sensors are provided on the lifting mechanism and the end effector, and the first temperature sensor is provided on one side of the lifting mechanism. For example, in the monitoring method of smart wafer transfer equipment described in Item 6 of the patent application scope, before step (e) is executed, step (d1) is executed, and the electrostatic sensor on the device carrier is used to detect whether there is anything on the device carrier. static electricity. For the monitoring method of smart wafer transfer equipment described in item 6 of the patent application, a translation mechanism is provided in the device carrier to connect the wafer transfer component. For the monitoring method of smart wafer transmission equipment described in Item 6 of the patent application, the monitoring device is provided with an alarm module.

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