SG173518A1 - Led leadframe package, led package using the same, and method of manufacturing the led package - Google Patents
Led leadframe package, led package using the same, and method of manufacturing the led package Download PDFInfo
- Publication number
- SG173518A1 SG173518A1 SG2011055852A SG2011055852A SG173518A1 SG 173518 A1 SG173518 A1 SG 173518A1 SG 2011055852 A SG2011055852 A SG 2011055852A SG 2011055852 A SG2011055852 A SG 2011055852A SG 173518 A1 SG173518 A1 SG 173518A1
- Authority
- SG
- Singapore
- Prior art keywords
- led
- layer
- ring
- sealing layer
- package
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 98
- 239000000463 material Substances 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 97
- 230000017525 heat dissipation Effects 0.000 claims description 52
- 230000003287 optical effect Effects 0.000 claims description 32
- 238000009413 insulation Methods 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000004954 Polyphthalamide Substances 0.000 claims description 5
- 229920006375 polyphtalamide Polymers 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 4
- -1 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 238000001721 transfer moulding Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/381,408 US8058667B2 (en) | 2009-03-10 | 2009-03-10 | Leadframe package for light emitting diode device |
US12/381,409 US8039862B2 (en) | 2009-03-10 | 2009-03-10 | White light emitting diode package having enhanced white lighting efficiency and method of making the same |
PCT/KR2010/001134 WO2010104276A2 (en) | 2009-03-10 | 2010-02-24 | Led leadframe package, led package using the same, and method of manufacturing the led package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG173518A1 true SG173518A1 (en) | 2011-09-29 |
Family
ID=42728911
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2011055852A SG173518A1 (en) | 2009-03-10 | 2010-02-24 | Led leadframe package, led package using the same, and method of manufacturing the led package |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP2406835A4 (de) |
JP (1) | JP2012520565A (de) |
KR (1) | KR101111256B1 (de) |
CN (1) | CN102318091A (de) |
AU (1) | AU2010221920A1 (de) |
RU (1) | RU2488195C2 (de) |
SG (1) | SG173518A1 (de) |
TW (1) | TW201044646A (de) |
WO (1) | WO2010104276A2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130236A (zh) * | 2010-12-31 | 2011-07-20 | 北京大学深圳研究生院 | 一种led芯片的封装方法及封装器件 |
TW201238086A (en) * | 2011-03-03 | 2012-09-16 | Lextar Electronics Corp | Chip package structure |
CN102185042A (zh) * | 2011-03-28 | 2011-09-14 | 北京大学深圳研究生院 | Led封装方法、封装器件、光调节方法及系统 |
US9159886B2 (en) | 2011-04-19 | 2015-10-13 | Intellectual Discovery Co., Ltd. | Lighting apparatus with a carrier layer |
US8721097B2 (en) * | 2011-05-19 | 2014-05-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | LED lamp with improved light output |
TWI418742B (zh) * | 2011-06-30 | 2013-12-11 | Lextar Electronics Corp | 發光元件的封裝結構 |
KR101148780B1 (ko) * | 2011-11-16 | 2012-05-24 | 김종율 | 엘이디 패키지 및 이의 제조방법 |
KR101287484B1 (ko) * | 2012-03-07 | 2013-07-19 | 삼성전자주식회사 | 발광 소자 패키지 |
KR20130103080A (ko) * | 2012-03-09 | 2013-09-23 | 서울반도체 주식회사 | Led 조명장치 |
KR20130110997A (ko) * | 2012-03-30 | 2013-10-10 | 서울반도체 주식회사 | Led용 렌즈 및 그 제조방법 |
TWI489657B (zh) * | 2012-04-12 | 2015-06-21 | Lextar Electronics Corp | 發光二極體封裝件 |
TWI474517B (zh) * | 2012-05-28 | 2015-02-21 | Lextar Electronics Corp | 發光裝置及其製造方法 |
KR101321101B1 (ko) * | 2012-06-01 | 2013-10-23 | 주식회사 코스텍시스 | 기판 및 이를 이용한 소자 패키지 |
CN103515517B (zh) * | 2012-06-20 | 2016-03-23 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
CN103515502A (zh) * | 2012-06-29 | 2014-01-15 | 展晶科技(深圳)有限公司 | 发光二极管装置 |
KR101504309B1 (ko) * | 2013-08-27 | 2015-03-20 | 주식회사 루멘스 | 발광 소자 패키지 및 이를 갖는 백라이트 유닛 |
US9608177B2 (en) | 2013-08-27 | 2017-03-28 | Lumens Co., Ltd. | Light emitting device package and backlight unit having the same |
KR102188500B1 (ko) | 2014-07-28 | 2020-12-09 | 삼성전자주식회사 | 발광다이오드 패키지 및 이를 이용한 조명장치 |
JP6730017B2 (ja) | 2014-11-10 | 2020-07-29 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ、及びこれを含む照明システム |
KR20160149363A (ko) | 2015-06-17 | 2016-12-28 | 삼성전자주식회사 | 반도체 발광소자 |
CN106784260A (zh) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | 一种直下式led背光源的制作方法 |
KR102261288B1 (ko) * | 2017-03-14 | 2021-06-04 | 현대자동차 주식회사 | 자동차 외장용 발광다이오드 패키지 |
CN109585632B (zh) * | 2019-02-14 | 2019-07-30 | 旭宇光电(深圳)股份有限公司 | 大功率远程荧光粉型白光led散热封装 |
JP7445120B2 (ja) | 2020-02-21 | 2024-03-07 | 日亜化学工業株式会社 | 発光装置 |
CN112467010B (zh) * | 2020-11-13 | 2022-03-22 | 中山市聚明星电子有限公司 | 二极管封装工艺及封装二极管 |
KR102338707B1 (ko) * | 2021-06-14 | 2021-12-13 | 주식회사 소룩스 | 광원 및 조명장치 |
KR102634521B1 (ko) | 2023-10-31 | 2024-02-07 | 장연식 | 통증 완화 약물 주입시스템 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2231951C2 (ru) * | 2001-10-31 | 2004-07-10 | Салдаев Александр Макарович | Система капельного орошения |
JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
JP4174823B2 (ja) * | 2003-03-27 | 2008-11-05 | サンケン電気株式会社 | 半導体発光装置 |
US7994526B2 (en) * | 2003-05-28 | 2011-08-09 | Seoul Semiconductor Co., Ltd. | Light emitting diode package and light emitting diode system having at least two heat sinks |
RU2267188C2 (ru) * | 2003-06-23 | 2005-12-27 | Федорова Галина Владимировна | Светодиодное полупроводниковое устройство в корпусе для поверхностного монтажа |
JP2005026400A (ja) * | 2003-07-01 | 2005-01-27 | Matsushita Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
US7279346B2 (en) * | 2004-03-31 | 2007-10-09 | Cree, Inc. | Method for packaging a light emitting device by one dispense then cure step followed by another |
US20060012298A1 (en) * | 2004-07-14 | 2006-01-19 | Taiwan Oasis Technology Co., Ltd. | LED chip capping construction |
KR100709890B1 (ko) * | 2004-09-10 | 2007-04-20 | 서울반도체 주식회사 | 다중 몰딩수지를 갖는 발광다이오드 패키지 |
KR100579397B1 (ko) * | 2004-12-16 | 2006-05-12 | 서울반도체 주식회사 | 리드프레임과 직접 연결된 히트싱크를 채택하는 발광다이오드 패키지 |
WO2006065007A1 (en) * | 2004-12-16 | 2006-06-22 | Seoul Semiconductor Co., Ltd. | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
RU2355068C1 (ru) * | 2004-12-16 | 2009-05-10 | Сеул Семикондактор Ко., Лтд. | Рамка с выводами, имеющая поддерживающее теплоотвод кольцо, способ изготовления корпуса светоизлучающего диода с ее использованием и корпус светоизлучающего диода, изготовленный этим способом |
EP1840977A4 (de) * | 2004-12-24 | 2009-07-29 | Kyocera Corp | Lichtquelle und beleuchtungseinrichtung |
KR101161384B1 (ko) * | 2005-03-29 | 2012-07-02 | 서울반도체 주식회사 | 직렬접속된 발광셀 어레이를 갖는 발광다이오드 칩을탑재한 발광다이오드 패키지 |
EP2280430B1 (de) * | 2005-03-11 | 2020-01-01 | Seoul Semiconductor Co., Ltd. | LED-Kapselung mit einer Gruppe in Reihe geschalteter Leuchtzellen |
CN100435361C (zh) * | 2005-05-31 | 2008-11-19 | 新灯源科技有限公司 | 半导体发光元件封装结构 |
US20070001182A1 (en) * | 2005-06-30 | 2007-01-04 | 3M Innovative Properties Company | Structured phosphor tape article |
US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
MY152857A (en) | 2005-09-01 | 2014-11-28 | Dominant Opto Tech Sdn Bhd | Surface mount optoelectronic component with lens |
US8044418B2 (en) * | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
US20080029775A1 (en) * | 2006-08-02 | 2008-02-07 | Lustrous Technology Ltd. | Light emitting diode package with positioning groove |
WO2008105527A1 (ja) * | 2007-03-01 | 2008-09-04 | Nec Lighting, Ltd. | Led装置及び照明装置 |
JP4689637B2 (ja) * | 2007-03-23 | 2011-05-25 | シャープ株式会社 | 半導体発光装置 |
-
2010
- 2010-02-24 KR KR1020107005556A patent/KR101111256B1/ko not_active IP Right Cessation
- 2010-02-24 SG SG2011055852A patent/SG173518A1/en unknown
- 2010-02-24 CN CN2010800077963A patent/CN102318091A/zh active Pending
- 2010-02-24 JP JP2011553937A patent/JP2012520565A/ja active Pending
- 2010-02-24 EP EP10750967.1A patent/EP2406835A4/de not_active Withdrawn
- 2010-02-24 AU AU2010221920A patent/AU2010221920A1/en not_active Abandoned
- 2010-02-24 WO PCT/KR2010/001134 patent/WO2010104276A2/en active Application Filing
- 2010-02-24 RU RU2011134604/28A patent/RU2488195C2/ru not_active IP Right Cessation
- 2010-03-04 TW TW99106287A patent/TW201044646A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2012520565A (ja) | 2012-09-06 |
EP2406835A2 (de) | 2012-01-18 |
RU2488195C2 (ru) | 2013-07-20 |
AU2010221920A1 (en) | 2011-09-29 |
TW201044646A (en) | 2010-12-16 |
WO2010104276A2 (en) | 2010-09-16 |
EP2406835A4 (de) | 2013-09-18 |
CN102318091A (zh) | 2012-01-11 |
KR101111256B1 (ko) | 2012-02-22 |
KR20100106297A (ko) | 2010-10-01 |
RU2011134604A (ru) | 2013-04-20 |
WO2010104276A3 (en) | 2010-11-25 |
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