SG160200A1 - Wafer level packaging - Google Patents

Wafer level packaging

Info

Publication number
SG160200A1
SG160200A1 SG200608700-1A SG2006087001A SG160200A1 SG 160200 A1 SG160200 A1 SG 160200A1 SG 2006087001 A SG2006087001 A SG 2006087001A SG 160200 A1 SG160200 A1 SG 160200A1
Authority
SG
Singapore
Prior art keywords
substrate
traces
vias
back side
trench
Prior art date
Application number
SG200608700-1A
Inventor
Chua Swee Kwang
Low Siu Waf
Chan Min Yu
Suan Jeung Boon
Chia Yong Poo
Neo Yong Loo
Ser Bok Leng
Eng Meow Koon
Huang Shuang Wu
Zhou Wei
Ho Kwok Seng
So Chee Chung
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200608700-1A priority Critical patent/SG160200A1/en
Publication of SG160200A1 publication Critical patent/SG160200A1/en

Links

Abstract

Through vias in a substrate are formed by creating a trench in a top side of the substrate and at least one trench in the back side of the substrate. The sum of the depths of the trenches at least equals the height of the substrate. The trenches cross at intersections, which accordingly form the through vias from the top side to the back side. The through vias are filled with a conductor to form contacts on both sides and the edge of the substrate. Contacts on the backside are formed at each of the trench. The through vias from the edge contacts. Traces connect bond pads to the conductor in the through via. Some traces are parallel to the back side traces. Some traces are skew to the back side traces. The substrate is diced to form individual die.
SG200608700-1A 2002-06-14 2002-06-14 Wafer level packaging SG160200A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200608700-1A SG160200A1 (en) 2002-06-14 2002-06-14 Wafer level packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200608700-1A SG160200A1 (en) 2002-06-14 2002-06-14 Wafer level packaging

Publications (1)

Publication Number Publication Date
SG160200A1 true SG160200A1 (en) 2010-04-29

Family

ID=42269902

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200608700-1A SG160200A1 (en) 2002-06-14 2002-06-14 Wafer level packaging

Country Status (1)

Country Link
SG (1) SG160200A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164176A (en) * 1984-09-05 1986-04-02 Sanyo Electric Co Ltd Dividing method of light-emitting diode
EP0802416A2 (en) * 1996-04-19 1997-10-22 Seiko Instruments R&D Center Inc. Manufacturing method of semiconductor acceleration sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164176A (en) * 1984-09-05 1986-04-02 Sanyo Electric Co Ltd Dividing method of light-emitting diode
EP0802416A2 (en) * 1996-04-19 1997-10-22 Seiko Instruments R&D Center Inc. Manufacturing method of semiconductor acceleration sensor

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