US4691363A
(en)
*
|
1985-12-11 |
1987-09-01 |
American Telephone & Telegraph Company, At&T Information Systems Inc. |
Transducer device
|
US4817164A
(en)
*
|
1987-03-20 |
1989-03-28 |
Northern Telecom Limited |
Electrostatic discharge protector for an electret microphone
|
DE3807251A1
(de)
*
|
1988-03-05 |
1989-09-14 |
Sennheiser Electronic |
Kapazitiver schallwandler
|
FR2695787B1
(fr)
*
|
1992-09-11 |
1994-11-10 |
Suisse Electro Microtech Centr |
Transducteur capacitif intégré.
|
US5401914A
(en)
*
|
1993-02-03 |
1995-03-28 |
The Curran Company |
Vent for shielded enclosures
|
US5627901A
(en)
*
|
1993-06-23 |
1997-05-06 |
Apple Computer, Inc. |
Directional microphone for computer visual display monitor and method for construction
|
US5682075A
(en)
*
|
1993-07-14 |
1997-10-28 |
The University Of British Columbia |
Porous gas reservoir electrostatic transducer
|
US5619476A
(en)
*
|
1994-10-21 |
1997-04-08 |
The Board Of Trustees Of The Leland Stanford Jr. Univ. |
Electrostatic ultrasonic transducer
|
US5894452A
(en)
*
|
1994-10-21 |
1999-04-13 |
The Board Of Trustees Of The Leland Stanford Junior University |
Microfabricated ultrasonic immersion transducer
|
US5949895A
(en)
*
|
1995-09-07 |
1999-09-07 |
Symphonix Devices, Inc. |
Disposable audio processor for use with implanted hearing devices
|
US5982905A
(en)
*
|
1996-01-22 |
1999-11-09 |
Grodinsky; Robert M. |
Distortion reduction in signal processors
|
US5970159A
(en)
*
|
1996-11-08 |
1999-10-19 |
Telex Communications, Inc. |
Video monitor with shielded microphone
|
FI970409A
(fi)
|
1997-01-31 |
1998-08-01 |
Nokia Mobile Phones Ltd |
Menetelmä mikrofonin suojaamiseksi ulkoisilta häiriötekijäiltä ja mikrofonin häiriösuojus
|
US5982709A
(en)
*
|
1998-03-31 |
1999-11-09 |
The Board Of Trustees Of The Leland Stanford Junior University |
Acoustic transducers and method of microfabrication
|
US7003127B1
(en)
*
|
1999-01-07 |
2006-02-21 |
Sarnoff Corporation |
Hearing aid with large diaphragm microphone element including a printed circuit board
|
EP1142442A2
(de)
*
|
1999-01-07 |
2001-10-10 |
Sarnoff Corporation |
Hörhilfegerät mit grossmembran-mikrofonelement einschliesslich leiterplatte
|
US6522762B1
(en)
*
|
1999-09-07 |
2003-02-18 |
Microtronic A/S |
Silicon-based sensor system
|
ATE242587T1
(de)
*
|
1999-09-06 |
2003-06-15 |
Sonionmems As |
Silikon basierte sensor-systeme
|
JP3611779B2
(ja)
*
|
1999-12-09 |
2005-01-19 |
シャープ株式会社 |
電気信号−音響信号変換器及びその製造方法並びに電気信号−音響変換装置
|
US6782109B2
(en)
*
|
2000-04-04 |
2004-08-24 |
University Of Florida |
Electromechanical acoustic liner
|
US7277166B2
(en)
*
|
2000-08-02 |
2007-10-02 |
Honeywell International Inc. |
Cytometer analysis cartridge optical configuration
|
US6842964B1
(en)
|
2000-09-29 |
2005-01-18 |
Tucker Davis Technologies, Inc. |
Process of manufacturing of electrostatic speakers
|
US7434305B2
(en)
|
2000-11-28 |
2008-10-14 |
Knowles Electronics, Llc. |
Method of manufacturing a microphone
|
US7166910B2
(en)
|
2000-11-28 |
2007-01-23 |
Knowles Electronics Llc |
Miniature silicon condenser microphone
|
US8629005B1
(en)
|
2000-11-28 |
2014-01-14 |
Knowles Electronics, Llc |
Methods of manufacture of bottom port surface mount silicon condenser microphone packages
|
EP1821570B1
(de)
*
|
2000-11-28 |
2017-02-08 |
Knowles Electronics, LLC |
Miniatursiliciumkondensatormikrofon und Herstellungsverfahren dafür
|
US7439616B2
(en)
*
|
2000-11-28 |
2008-10-21 |
Knowles Electronics, Llc |
Miniature silicon condenser microphone
|
US6847090B2
(en)
*
|
2001-01-24 |
2005-01-25 |
Knowles Electronics, Llc |
Silicon capacitive microphone
|
US6671379B2
(en)
|
2001-03-30 |
2003-12-30 |
Think-A-Move, Ltd. |
Ear microphone apparatus and method
|
US6647368B2
(en)
|
2001-03-30 |
2003-11-11 |
Think-A-Move, Ltd. |
Sensor pair for detecting changes within a human ear and producing a signal corresponding to thought, movement, biological function and/or speech
|
US7065224B2
(en)
*
|
2001-09-28 |
2006-06-20 |
Sonionmicrotronic Nederland B.V. |
Microphone for a hearing aid or listening device with improved internal damping and foreign material protection
|
AU2002342150A1
(en)
|
2001-10-30 |
2003-05-12 |
George S. Lesinski |
Implantation method for a hearing aid microactuator implanted into the cochlea
|
US6677176B2
(en)
|
2002-01-18 |
2004-01-13 |
The Hong Kong University Of Science And Technology |
Method of manufacturing an integrated electronic microphone having a floating gate electrode
|
US8463334B2
(en)
*
|
2002-03-13 |
2013-06-11 |
Qualcomm Incorporated |
Apparatus and system for providing wideband voice quality in a wireless telephone
|
KR100966756B1
(ko)
*
|
2002-04-05 |
2010-06-29 |
파나소닉 주식회사 |
콘덴서 센서
|
US6781231B2
(en)
*
|
2002-09-10 |
2004-08-24 |
Knowles Electronics Llc |
Microelectromechanical system package with environmental and interference shield
|
KR100556684B1
(ko)
*
|
2004-01-20 |
2006-03-10 |
주식회사 비에스이 |
메인 pcb에 실장하기 적합한 콘덴서 마이크로폰
|
US7929714B2
(en)
*
|
2004-08-11 |
2011-04-19 |
Qualcomm Incorporated |
Integrated audio codec with silicon audio transducer
|
US7415121B2
(en)
*
|
2004-10-29 |
2008-08-19 |
Sonion Nederland B.V. |
Microphone with internal damping
|
US7795695B2
(en)
|
2005-01-27 |
2010-09-14 |
Analog Devices, Inc. |
Integrated microphone
|
DE102005008511B4
(de)
|
2005-02-24 |
2019-09-12 |
Tdk Corporation |
MEMS-Mikrofon
|
DE102005008512B4
(de)
|
2005-02-24 |
2016-06-23 |
Epcos Ag |
Elektrisches Modul mit einem MEMS-Mikrofon
|
US20060274476A1
(en)
*
|
2005-04-13 |
2006-12-07 |
Andrew Cervin-Lawry |
Low loss thin film capacitor and methods of manufacturing the same
|
US7885423B2
(en)
*
|
2005-04-25 |
2011-02-08 |
Analog Devices, Inc. |
Support apparatus for microphone diaphragm
|
US7449356B2
(en)
*
|
2005-04-25 |
2008-11-11 |
Analog Devices, Inc. |
Process of forming a microphone using support member
|
US7825484B2
(en)
*
|
2005-04-25 |
2010-11-02 |
Analog Devices, Inc. |
Micromachined microphone and multisensor and method for producing same
|
US20070071268A1
(en)
*
|
2005-08-16 |
2007-03-29 |
Analog Devices, Inc. |
Packaged microphone with electrically coupled lid
|
US7317234B2
(en)
*
|
2005-07-20 |
2008-01-08 |
Douglas G Marsh |
Means of integrating a microphone in a standard integrated circuit process
|
US20070040231A1
(en)
*
|
2005-08-16 |
2007-02-22 |
Harney Kieran P |
Partially etched leadframe packages having different top and bottom topologies
|
US8351632B2
(en)
*
|
2005-08-23 |
2013-01-08 |
Analog Devices, Inc. |
Noise mitigating microphone system and method
|
US7961897B2
(en)
*
|
2005-08-23 |
2011-06-14 |
Analog Devices, Inc. |
Microphone with irregular diaphragm
|
US8130979B2
(en)
*
|
2005-08-23 |
2012-03-06 |
Analog Devices, Inc. |
Noise mitigating microphone system and method
|
WO2007024909A1
(en)
*
|
2005-08-23 |
2007-03-01 |
Analog Devices, Inc. |
Multi-microphone system
|
US20070063777A1
(en)
*
|
2005-08-26 |
2007-03-22 |
Mircea Capanu |
Electrostrictive devices
|
EP1945561B1
(de)
*
|
2005-10-14 |
2018-10-24 |
STMicroelectronics Srl |
Substratscheibenmontage für ein integriertes bauelement, herstellungsverfahren dafür und verwandtes integriertes bauelement
|
US7983433B2
(en)
|
2005-11-08 |
2011-07-19 |
Think-A-Move, Ltd. |
Earset assembly
|
DE102005053767B4
(de)
|
2005-11-10 |
2014-10-30 |
Epcos Ag |
MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
|
DE102005053765B4
(de)
|
2005-11-10 |
2016-04-14 |
Epcos Ag |
MEMS-Package und Verfahren zur Herstellung
|
DE102005056759A1
(de)
*
|
2005-11-29 |
2007-05-31 |
Robert Bosch Gmbh |
Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
|
US7502484B2
(en)
|
2006-06-14 |
2009-03-10 |
Think-A-Move, Ltd. |
Ear sensor assembly for speech processing
|
WO2008003051A2
(en)
*
|
2006-06-29 |
2008-01-03 |
Analog Devices, Inc. |
Stress mitigation in packaged microchips
|
JP4951067B2
(ja)
*
|
2006-07-25 |
2012-06-13 |
アナログ デバイシス, インコーポレイテッド |
複数のマイクロホンシステム
|
US20080042223A1
(en)
*
|
2006-08-17 |
2008-02-21 |
Lu-Lee Liao |
Microelectromechanical system package and method for making the same
|
US20080075308A1
(en)
*
|
2006-08-30 |
2008-03-27 |
Wen-Chieh Wei |
Silicon condenser microphone
|
US20080083957A1
(en)
*
|
2006-10-05 |
2008-04-10 |
Wen-Chieh Wei |
Micro-electromechanical system package
|
US7894622B2
(en)
|
2006-10-13 |
2011-02-22 |
Merry Electronics Co., Ltd. |
Microphone
|
US20080175425A1
(en)
*
|
2006-11-30 |
2008-07-24 |
Analog Devices, Inc. |
Microphone System with Silicon Microphone Secured to Package Lid
|
US20080217709A1
(en)
*
|
2007-03-07 |
2008-09-11 |
Knowles Electronics, Llc |
Mems package having at least one port and manufacturing method thereof
|
US11683643B2
(en)
|
2007-05-04 |
2023-06-20 |
Staton Techiya Llc |
Method and device for in ear canal echo suppression
|
US11856375B2
(en)
|
2007-05-04 |
2023-12-26 |
Staton Techiya Llc |
Method and device for in-ear echo suppression
|
US8767983B2
(en)
*
|
2007-06-01 |
2014-07-01 |
Infineon Technologies Ag |
Module including a micro-electro-mechanical microphone
|
US7694610B2
(en)
*
|
2007-06-27 |
2010-04-13 |
Siemens Medical Solutions Usa, Inc. |
Photo-multiplier tube removal tool
|
SG158758A1
(en)
*
|
2008-07-14 |
2010-02-26 |
Sensfab Pte Ltd |
Extended sensor back volume
|
TWI404428B
(zh)
*
|
2009-11-25 |
2013-08-01 |
Ind Tech Res Inst |
聲學感測器
|
CN102104817B
(zh)
*
|
2009-12-21 |
2013-10-02 |
财团法人工业技术研究院 |
声学感测器
|
EP2774390A4
(de)
|
2011-11-04 |
2015-07-22 |
Knowles Electronics Llc |
Eingebettetes dielektrikum als barriere bei einer akustischen vorrichtung und herstellungsverfahren
|
WO2013074270A1
(en)
|
2011-11-17 |
2013-05-23 |
Analog Devices, Inc. |
Microphone module with sound pipe
|
US9738515B2
(en)
|
2012-06-27 |
2017-08-22 |
Invensense, Inc. |
Transducer with enlarged back volume
|
US9078063B2
(en)
|
2012-08-10 |
2015-07-07 |
Knowles Electronics, Llc |
Microphone assembly with barrier to prevent contaminant infiltration
|
US8841738B2
(en)
|
2012-10-01 |
2014-09-23 |
Invensense, Inc. |
MEMS microphone system for harsh environments
|
US9676614B2
(en)
|
2013-02-01 |
2017-06-13 |
Analog Devices, Inc. |
MEMS device with stress relief structures
|
US8692340B1
(en)
|
2013-03-13 |
2014-04-08 |
Invensense, Inc. |
MEMS acoustic sensor with integrated back cavity
|
US9809448B2
(en)
|
2013-03-13 |
2017-11-07 |
Invensense, Inc. |
Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same
|
US9338559B2
(en)
|
2013-04-16 |
2016-05-10 |
Invensense, Inc. |
Microphone system with a stop member
|
DE102013106353B4
(de)
*
|
2013-06-18 |
2018-06-28 |
Tdk Corporation |
Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
|
US10167189B2
(en)
|
2014-09-30 |
2019-01-01 |
Analog Devices, Inc. |
Stress isolation platform for MEMS devices
|
US9794661B2
(en)
|
2015-08-07 |
2017-10-17 |
Knowles Electronics, Llc |
Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
|
US10131538B2
(en)
|
2015-09-14 |
2018-11-20 |
Analog Devices, Inc. |
Mechanically isolated MEMS device
|
US20180160226A1
(en)
*
|
2016-12-05 |
2018-06-07 |
Semiconductor Components Industries, Llc |
Reducing or eliminating transducer reverberation
|
IT201700103489A1
(it)
|
2017-09-15 |
2019-03-15 |
St Microelectronics Srl |
Metodo di fabbricazione di una membrana filtrante sottile, dispositivo trasduttore acustico includente la membrana filtrante, metodo di assemblaggio del dispositivo trasduttore acustico e sistema elettronico
|
GB201904005D0
(en)
*
|
2019-03-22 |
2019-05-08 |
Sensibel As |
Microphone housing
|
US11442155B2
(en)
|
2019-10-02 |
2022-09-13 |
Semiconductor Components Industries, Llc |
Devices, systems and processes for detecting saturation of received echo signals
|
US11759822B2
(en)
|
2020-01-21 |
2023-09-19 |
Semiconductor Components Industries, Llc |
Devices, systems and processes for improving frequency measurements during reverberation periods for ultra-sonic transducers
|
US11520027B2
(en)
|
2020-02-14 |
2022-12-06 |
Semiconductor Components Industries, Llc |
Devices, systems and processes for ultra-short range detection of obstacles
|
US11417611B2
(en)
|
2020-02-25 |
2022-08-16 |
Analog Devices International Unlimited Company |
Devices and methods for reducing stress on circuit components
|
US11981560B2
(en)
|
2020-06-09 |
2024-05-14 |
Analog Devices, Inc. |
Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
|
CN114374920A
(zh)
*
|
2021-12-29 |
2022-04-19 |
瑞声声学科技(深圳)有限公司 |
骨传导麦克风
|