SG155061A1 - Photoresist composition for deep ultraviolet lithography - Google Patents

Photoresist composition for deep ultraviolet lithography

Info

Publication number
SG155061A1
SG155061A1 SG200705091-7A SG2007050917A SG155061A1 SG 155061 A1 SG155061 A1 SG 155061A1 SG 2007050917 A SG2007050917 A SG 2007050917A SG 155061 A1 SG155061 A1 SG 155061A1
Authority
SG
Singapore
Prior art keywords
photoresist composition
deep ultraviolet
ultraviolet lithography
lithography
deep
Prior art date
Application number
SG200705091-7A
Other languages
English (en)
Inventor
Ralph R Dammel
Raj Sakamuri
Francis M Houlihan
Original Assignee
Az Electronic Materials Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Materials Japan filed Critical Az Electronic Materials Japan
Priority claimed from PCT/EP2004/001194 external-priority patent/WO2004074928A2/en
Publication of SG155061A1 publication Critical patent/SG155061A1/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/108Polyolefin or halogen containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/111Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
SG200705091-7A 2003-02-21 2004-02-10 Photoresist composition for deep ultraviolet lithography SG155061A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/371,262 US20040166434A1 (en) 2003-02-21 2003-02-21 Photoresist composition for deep ultraviolet lithography
US10/658,840 US7211366B2 (en) 2003-02-21 2003-12-17 Photoresist composition for deep ultraviolet lithography
PCT/EP2004/001194 WO2004074928A2 (en) 2003-02-21 2004-02-10 Photoresist composition for deep ultraviolet lithography

Publications (1)

Publication Number Publication Date
SG155061A1 true SG155061A1 (en) 2009-09-30

Family

ID=32868306

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705091-7A SG155061A1 (en) 2003-02-21 2004-02-10 Photoresist composition for deep ultraviolet lithography

Country Status (3)

Country Link
US (2) US20040166434A1 (zh)
CN (1) CN1809789A (zh)
SG (1) SG155061A1 (zh)

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US8053159B2 (en) * 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
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US7473749B2 (en) * 2005-06-23 2009-01-06 International Business Machines Corporation Preparation of topcoat compositions and methods of use thereof
US8642246B2 (en) 2007-02-26 2014-02-04 Honeywell International Inc. Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
JP2010085921A (ja) * 2008-10-02 2010-04-15 Panasonic Corp レジスト材料及びそれを用いたパターン形成方法
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
US10377692B2 (en) * 2009-09-09 2019-08-13 Sumitomo Chemical Company, Limited Photoresist composition
US8541523B2 (en) * 2010-04-05 2013-09-24 Promerus, Llc Norbornene-type polymers, compositions thereof and lithographic process using such compositions
KR101305111B1 (ko) * 2010-06-30 2013-09-05 주식회사 동진쎄미켐 레지스트 보호막 형성용 중합체, 레지스트 보호막 형성용 조성물 및 이를 이용한 반도체 소자의 패턴 형성방법
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
US20130108956A1 (en) 2011-11-01 2013-05-02 Az Electronic Materials Usa Corp. Nanocomposite positive photosensitive composition and use thereof
TWI617629B (zh) * 2013-05-01 2018-03-11 Jsr股份有限公司 具有凹圖案的基材的製造方法、組成物、導電膜的形成方法、電子電路及電子元件
US10544329B2 (en) 2015-04-13 2020-01-28 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
CN114874384A (zh) * 2022-01-21 2022-08-09 南通林格橡塑制品有限公司 一种193nm光刻胶成膜树脂及其制备方法和正型光刻胶组合物

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Also Published As

Publication number Publication date
CN1809789A (zh) 2006-07-26
US20040166433A1 (en) 2004-08-26
US7211366B2 (en) 2007-05-01
US20040166434A1 (en) 2004-08-26

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