SG143111A1 - Method and apparatus for automation of ptf measurement in sputter targets - Google Patents

Method and apparatus for automation of ptf measurement in sputter targets

Info

Publication number
SG143111A1
SG143111A1 SG200702855-8A SG2007028558A SG143111A1 SG 143111 A1 SG143111 A1 SG 143111A1 SG 2007028558 A SG2007028558 A SG 2007028558A SG 143111 A1 SG143111 A1 SG 143111A1
Authority
SG
Singapore
Prior art keywords
sputter target
magnetic field
automation
ptf
sputter
Prior art date
Application number
SG200702855-8A
Other languages
English (en)
Inventor
Raymond D Rogers
Original Assignee
Heraeus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Inc filed Critical Heraeus Inc
Publication of SG143111A1 publication Critical patent/SG143111A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/10—Plotting field distribution ; Measuring field distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Measuring Magnetic Variables (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
SG200702855-8A 2006-11-20 2007-04-19 Method and apparatus for automation of ptf measurement in sputter targets SG143111A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/601,791 US20080116887A1 (en) 2006-11-20 2006-11-20 Method and apparatus for automation of PTF measurement in sputter targets

Publications (1)

Publication Number Publication Date
SG143111A1 true SG143111A1 (en) 2008-06-27

Family

ID=38805726

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200702855-8A SG143111A1 (en) 2006-11-20 2007-04-19 Method and apparatus for automation of ptf measurement in sputter targets

Country Status (7)

Country Link
US (1) US20080116887A1 (zh)
EP (1) EP1923482A1 (zh)
JP (1) JP2008129005A (zh)
KR (1) KR20080045592A (zh)
CN (1) CN101187648A (zh)
SG (1) SG143111A1 (zh)
TW (1) TW200823481A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101009642B1 (ko) 2008-07-09 2011-01-19 삼성모바일디스플레이주식회사 자화 방지용 마그네트론 부 이송 장치 및 이를 갖는마그네트론 스퍼터링 설비
US8759084B2 (en) 2010-01-22 2014-06-24 Michael J. Nichols Self-sterilizing automated incubator
CN208736987U (zh) * 2018-08-10 2019-04-12 米亚索乐装备集成（福建）有限公司 一种扫描装置
JP6717477B1 (ja) * 2019-09-13 2020-07-01 株式会社スワローインキュベート 画像処理方法、画像処理装置、及び画像処理プログラム
CN114774877A (zh) * 2022-05-10 2022-07-22 苏州迈为科技股份有限公司 一种提高旋转靶材利用率的溅射方法及溅射设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59108970A (ja) * 1982-12-13 1984-06-23 Nippon Steel Corp 鋼材の磁気特性測定方法
US6454911B1 (en) * 2000-06-01 2002-09-24 Honeywell International Inc. Method and apparatus for determining the pass through flux of magnetic materials

Also Published As

Publication number Publication date
JP2008129005A (ja) 2008-06-05
TW200823481A (en) 2008-06-01
KR20080045592A (ko) 2008-05-23
US20080116887A1 (en) 2008-05-22
CN101187648A (zh) 2008-05-28
EP1923482A1 (en) 2008-05-21

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