SG136963A1 - Compliant electrical contact assembly background of the invention - Google Patents

Compliant electrical contact assembly background of the invention

Info

Publication number
SG136963A1
SG136963A1 SG200717215-8A SG2007172158A SG136963A1 SG 136963 A1 SG136963 A1 SG 136963A1 SG 2007172158 A SG2007172158 A SG 2007172158A SG 136963 A1 SG136963 A1 SG 136963A1
Authority
SG
Singapore
Prior art keywords
contact
aperture
compliant
electrical contact
assembly
Prior art date
Application number
SG200717215-8A
Other languages
English (en)
Inventor
Gordon A Vinther
Original Assignee
Ardent Concepts Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ardent Concepts Inc filed Critical Ardent Concepts Inc
Publication of SG136963A1 publication Critical patent/SG136963A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/20Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
SG200717215-8A 2004-04-29 2005-04-28 Compliant electrical contact assembly background of the invention SG136963A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/834,727 US6909056B2 (en) 2002-01-17 2004-04-29 Compliant electrical contact assembly

Publications (1)

Publication Number Publication Date
SG136963A1 true SG136963A1 (en) 2007-11-29

Family

ID=35320456

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200717215-8A SG136963A1 (en) 2004-04-29 2005-04-28 Compliant electrical contact assembly background of the invention

Country Status (9)

Country Link
US (1) US6909056B2 (zh)
EP (1) EP1741111A4 (zh)
JP (1) JP2007535795A (zh)
KR (1) KR20070007934A (zh)
CN (1) CN1977344A (zh)
CA (1) CA2564191A1 (zh)
IL (1) IL178355A0 (zh)
SG (1) SG136963A1 (zh)
WO (1) WO2005109450A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7140884B2 (en) * 2005-01-26 2006-11-28 International Business Machines Corporation Contact assembly and method of making thereof
TWI261672B (en) * 2005-03-15 2006-09-11 Mjc Probe Inc Elastic micro probe and method of making same
US7402051B1 (en) * 2005-11-10 2008-07-22 Antares Advanced Test Technologies, Inc. Interconnect assembly for testing integrated circuit packages
TWI332086B (en) * 2006-10-24 2010-10-21 Ind Tech Res Inst Multi-layer electric probe and fabricating method
US7520753B1 (en) 2008-03-31 2009-04-21 International Business Machines Corporation Method of using coil contact as electrical interconnect
JP5686009B2 (ja) * 2011-03-18 2015-03-18 富士通株式会社 基板ユニット、及び、基板ユニットの製造方法
DE202011005271U1 (de) * 2011-04-14 2011-07-26 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Steckverbinder mit einem Kontaktelement
JP5718203B2 (ja) * 2011-10-05 2015-05-13 富士通コンポーネント株式会社 ソケット用モジュール及びソケット
USRE46958E1 (en) 2011-10-24 2018-07-17 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
USRE47459E1 (en) 2011-10-24 2019-06-25 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
WO2013063093A1 (en) * 2011-10-24 2013-05-02 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US8764458B1 (en) * 2012-09-10 2014-07-01 Amazon Technologies, Inc. Spring connector and corresponding guide element
WO2016072986A1 (en) * 2014-11-06 2016-05-12 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US10931040B1 (en) * 2018-08-02 2021-02-23 Ardent Concepts, Inc. Controlled-impedance circuit board connector assembly
KR102153299B1 (ko) * 2019-05-31 2020-09-21 주식회사 이노글로벌 양방향 도전성 핀, 이를 이용한 양방향 도전성 모듈 및 그 제조방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029375A (en) 1976-06-14 1977-06-14 Electronic Engineering Company Of California Miniature electrical connector
DE69022605T2 (de) 1989-02-28 1996-03-21 Fujitsu Ltd Elektrische Verbindungsvorrichtung.
US4998886A (en) 1989-07-07 1991-03-12 Teledyne Kinetics High density stacking connector
EP0462706A1 (en) 1990-06-11 1991-12-27 ITT INDUSTRIES, INC. (a Delaware corporation) Contact assembly
JP3090470B2 (ja) 1990-10-29 2000-09-18 ゼネラル・データコム・インコーポレーテッド テーパー付きばね接点要素を備えた電気コネクタ
US5101553A (en) 1991-04-29 1992-04-07 Microelectronics And Computer Technology Corporation Method of making a metal-on-elastomer pressure contact connector
US5167512A (en) * 1991-07-05 1992-12-01 Walkup William B Multi-chip module connector element and system
US5230632A (en) 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
GB2273830B (en) 1992-12-24 1997-04-16 Whitaker Corp Electrical contact elements for interposer structures
EP0616394A1 (en) 1993-03-16 1994-09-21 Hewlett-Packard Company Method and system for producing electrically interconnected circuits
US5495667A (en) 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
US5667410A (en) 1995-11-21 1997-09-16 Everett Charles Technologies, Inc. One-piece compliant probe
CN1255686C (zh) * 1996-04-12 2006-05-10 日本发条株式会社 导电接触单元系统
JP3414593B2 (ja) * 1996-06-28 2003-06-09 日本発条株式会社 導電性接触子
JP3096430B2 (ja) * 1996-09-17 2000-10-10 日本航空電子工業株式会社 コネクタ
JP3076977B2 (ja) * 1997-07-22 2000-08-14 日本航空電子工業株式会社 電気接続部材
JP4060919B2 (ja) 1997-11-28 2008-03-12 富士通株式会社 電気的接続装置、接触子製造方法、及び半導体試験方法
US6114240A (en) 1997-12-18 2000-09-05 Micron Technology, Inc. Method for fabricating semiconductor components using focused laser beam
US6341962B1 (en) * 1999-10-29 2002-01-29 Aries Electronics, Inc. Solderless grid array connector
EP1474822B1 (en) * 2002-01-17 2016-12-07 Ardent Concepts, Inc. Compliant electrical contact
US6846184B2 (en) * 2003-01-24 2005-01-25 High Connection Density Inc. Low inductance electrical contacts and LGA connector system

Also Published As

Publication number Publication date
EP1741111A1 (en) 2007-01-10
IL178355A0 (en) 2007-02-11
CN1977344A (zh) 2007-06-06
JP2007535795A (ja) 2007-12-06
US20040200633A1 (en) 2004-10-14
KR20070007934A (ko) 2007-01-16
CA2564191A1 (en) 2005-11-17
EP1741111A4 (en) 2008-05-28
WO2005109450A1 (en) 2005-11-17
US6909056B2 (en) 2005-06-21

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