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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to SG200602643-9ApriorityCriticalpatent/SG136823A1/en
Publication of SG136823A1publicationCriticalpatent/SG136823A1/en
A post-CMP wafer is loaded into a buffer unit of a cleaning apparatus and is kept moist by adding a chemical. The post-CMP wafer is then loaded into a cleaning unit of the cleaning apparatus for performing the following cleaning process. The chemical added in the buffer unit is used to reduce the adhesion of benzotriazole (BTA) for improving the cleanliness of the post-CMP wafer.
SG200602643-9A2006-04-192006-04-19Method of cleaning post-cmp wafer
SG136823A1
(en)
Methods for characterizing defects on silicon surfaces, etching composition for silicon surfaces and process of treating silicon surfaces with the etching composition
Chromium-free etching solution for si-substrates and sige-substrates, method for revealing defects using the etching solution and process for treating si-substrates and sige-substrates using the etching solution