SG136823A1 - Method of cleaning post-cmp wafer - Google Patents

Method of cleaning post-cmp wafer

Info

Publication number
SG136823A1
SG136823A1 SG200602643-9A SG2006026439A SG136823A1 SG 136823 A1 SG136823 A1 SG 136823A1 SG 2006026439 A SG2006026439 A SG 2006026439A SG 136823 A1 SG136823 A1 SG 136823A1
Authority
SG
Singapore
Prior art keywords
cmp wafer
post
cleaning post
cleaning
cmp
Prior art date
Application number
SG200602643-9A
Inventor
Teng Ching-Wen
Lin Chin Kun
Tseng Yu-Hsiang
Neo Boon Tiong
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to SG200602643-9A priority Critical patent/SG136823A1/en
Publication of SG136823A1 publication Critical patent/SG136823A1/en

Links

Abstract

A post-CMP wafer is loaded into a buffer unit of a cleaning apparatus and is kept moist by adding a chemical. The post-CMP wafer is then loaded into a cleaning unit of the cleaning apparatus for performing the following cleaning process. The chemical added in the buffer unit is used to reduce the adhesion of benzotriazole (BTA) for improving the cleanliness of the post-CMP wafer.
SG200602643-9A 2006-04-19 2006-04-19 Method of cleaning post-cmp wafer SG136823A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200602643-9A SG136823A1 (en) 2006-04-19 2006-04-19 Method of cleaning post-cmp wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200602643-9A SG136823A1 (en) 2006-04-19 2006-04-19 Method of cleaning post-cmp wafer

Publications (1)

Publication Number Publication Date
SG136823A1 true SG136823A1 (en) 2007-11-29

Family

ID=38805556

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200602643-9A SG136823A1 (en) 2006-04-19 2006-04-19 Method of cleaning post-cmp wafer

Country Status (1)

Country Link
SG (1) SG136823A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010011515A1 (en) * 2000-01-25 2001-08-09 Nec Corporation Anticorrosive agent
US20020016272A1 (en) * 2000-07-05 2002-02-07 Wako Pure Chemical Industries, Ltd. Cleaning agent for a semi-conductor substrate
US20040142564A1 (en) * 1998-09-28 2004-07-22 Mullee William H. Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040142564A1 (en) * 1998-09-28 2004-07-22 Mullee William H. Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process
US20010011515A1 (en) * 2000-01-25 2001-08-09 Nec Corporation Anticorrosive agent
US20020016272A1 (en) * 2000-07-05 2002-02-07 Wako Pure Chemical Industries, Ltd. Cleaning agent for a semi-conductor substrate

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