SG136066A1 - A securing device for a sputtering source - Google Patents

A securing device for a sputtering source

Info

Publication number
SG136066A1
SG136066A1 SG200701782-5A SG2007017825A SG136066A1 SG 136066 A1 SG136066 A1 SG 136066A1 SG 2007017825 A SG2007017825 A SG 2007017825A SG 136066 A1 SG136066 A1 SG 136066A1
Authority
SG
Singapore
Prior art keywords
securing device
sputtering
sputtering source
transmitting means
current transmitting
Prior art date
Application number
SG200701782-5A
Other languages
English (en)
Inventor
Gerald Eschendorff
Original Assignee
Sulzer Metco Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer Metco Ag filed Critical Sulzer Metco Ag
Publication of SG136066A1 publication Critical patent/SG136066A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497Temperature of target
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Nozzles (AREA)
  • Coating By Spraying Or Casting (AREA)
SG200701782-5A 2006-03-16 2007-03-09 A securing device for a sputtering source SG136066A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06405118A EP1835524A1 (fr) 2006-03-16 2006-03-16 Dispositif de fixation pour une source de pulvérisation cathodique

Publications (1)

Publication Number Publication Date
SG136066A1 true SG136066A1 (en) 2007-10-29

Family

ID=36569129

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200701782-5A SG136066A1 (en) 2006-03-16 2007-03-09 A securing device for a sputtering source

Country Status (6)

Country Link
US (1) US20090120783A1 (fr)
EP (2) EP1835524A1 (fr)
JP (1) JP2007247065A (fr)
CA (1) CA2579934A1 (fr)
RU (1) RU2007109513A (fr)
SG (1) SG136066A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI359872B (en) * 2007-11-15 2012-03-11 Wintek Corp Magnetron sputter cathode mechanism
WO2015031319A1 (fr) * 2013-08-26 2015-03-05 George David L Structures de barres de sécurité mécaniques stratifiées
TR202006755A2 (tr) * 2020-04-30 2021-11-22 Izmir Yueksek Teknoloji Enstituesue Rektoerluegue Bataryalar i̇çi̇n bağlanti (tab) noktasindan taşinim temelli̇ soğutma yöntemleri̇

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758321A (fr) * 1969-11-03 1971-04-01 Rca Corp Procede de metallisation de dispositifs a semi-conducteurs
JPS62223056A (ja) * 1986-03-24 1987-10-01 日東電工株式会社 セラミツクスグリ−ンシ−ト
JPS63192866A (ja) * 1987-02-05 1988-08-10 Fujitsu Ltd 真空装置
US5333726A (en) * 1993-01-15 1994-08-02 Regents Of The University Of California Magnetron sputtering source
US5441614A (en) * 1994-11-30 1995-08-15 At&T Corp. Method and apparatus for planar magnetron sputtering
DE10126985A1 (de) * 2001-06-05 2002-12-12 Gabriel Herbert M Anordnung zur Stromzuführung für eine Kathode einer Lichtbogen-Verdampfungsvorrichtung
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation

Also Published As

Publication number Publication date
RU2007109513A (ru) 2008-09-20
EP1835526A1 (fr) 2007-09-19
EP1835524A1 (fr) 2007-09-19
CA2579934A1 (fr) 2007-09-16
JP2007247065A (ja) 2007-09-27
US20090120783A1 (en) 2009-05-14

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