SG134286A1 - Sheet for regenerating a mold - Google Patents

Sheet for regenerating a mold

Info

Publication number
SG134286A1
SG134286A1 SG200700588-7A SG2007005887A SG134286A1 SG 134286 A1 SG134286 A1 SG 134286A1 SG 2007005887 A SG2007005887 A SG 2007005887A SG 134286 A1 SG134286 A1 SG 134286A1
Authority
SG
Singapore
Prior art keywords
sheet
mold
regenerating
substrate
substrate sheet
Prior art date
Application number
SG200700588-7A
Other languages
English (en)
Inventor
Kouichi Takashima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006019638A external-priority patent/JP5245039B2/ja
Priority claimed from JP2006019639A external-priority patent/JP5245040B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG134286A1 publication Critical patent/SG134286A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0082—Dust eliminating means; Mould or press ram cleaning means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG200700588-7A 2006-01-27 2007-01-25 Sheet for regenerating a mold SG134286A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006019638A JP5245039B2 (ja) 2006-01-27 2006-01-27 金型再生用シート
JP2006019639A JP5245040B2 (ja) 2006-01-27 2006-01-27 金型再生用シート
JP2006287717 2006-10-23

Publications (1)

Publication Number Publication Date
SG134286A1 true SG134286A1 (en) 2007-08-29

Family

ID=37909861

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200700588-7A SG134286A1 (en) 2006-01-27 2007-01-25 Sheet for regenerating a mold
SG201100527-9A SG169347A1 (en) 2006-01-27 2007-01-25 Sheet for regenerating a mold

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG201100527-9A SG169347A1 (en) 2006-01-27 2007-01-25 Sheet for regenerating a mold

Country Status (6)

Country Link
EP (1) EP1813406B1 (de)
KR (1) KR101296981B1 (de)
AT (1) ATE513667T1 (de)
MY (1) MY147568A (de)
SG (2) SG134286A1 (de)
TW (1) TWI414410B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5768588B2 (ja) * 2011-08-18 2015-08-26 日立化成株式会社 金型再生用シート
JP5741398B2 (ja) * 2011-11-21 2015-07-01 日立化成株式会社 金型クリーニングシート

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0271107B1 (de) * 1986-12-11 1993-06-02 Nitto Denko Corporation Zusammensetzung von Reinigungsmitteln für Hohlformen, Blatt zum Reinigen von Hohlformen und Verfahren zum Reinigen von Hohlformen mit diesem Reinigungsblatt
IT214620Z2 (it) * 1988-05-12 1990-05-09 Fiat Auto Spa Lastra detergente
JPH03202327A (ja) * 1989-12-28 1991-09-04 Toowa Kk 樹脂成形用金型面のクリーニング方法とこの方法に用いられるクリーニング用シート部材及び連続自動樹脂成形方法
JPH07304044A (ja) * 1994-05-11 1995-11-21 Toshiba Chem Corp 金型のクリーニング材およびクリーニング方法
JPH09129659A (ja) * 1995-11-02 1997-05-16 Toshiba Chem Corp 半導体封止用シート状樹脂
JPH1067021A (ja) * 1997-05-20 1998-03-10 Nitto Denko Corp 金型再生用シート
JP3578262B2 (ja) * 1999-04-06 2004-10-20 日東電工株式会社 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム
AU8006200A (en) * 1999-10-08 2001-04-23 Procter & Gamble Company, The Applicator having a temperature changing element for distributing a product ontoa target surface

Also Published As

Publication number Publication date
TW200738425A (en) 2007-10-16
KR101296981B1 (ko) 2013-08-14
EP1813406B1 (de) 2011-06-22
SG169347A1 (en) 2011-03-30
MY147568A (en) 2012-12-31
TWI414410B (zh) 2013-11-11
KR20070078696A (ko) 2007-08-01
ATE513667T1 (de) 2011-07-15
EP1813406A1 (de) 2007-08-01

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