SG132608A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG132608A1
SG132608A1 SG200607729-1A SG2006077291A SG132608A1 SG 132608 A1 SG132608 A1 SG 132608A1 SG 2006077291 A SG2006077291 A SG 2006077291A SG 132608 A1 SG132608 A1 SG 132608A1
Authority
SG
Singapore
Prior art keywords
article
support
radiation beam
patterned radiation
lithographic apparatus
Prior art date
Application number
SG200607729-1A
Other languages
English (en)
Inventor
Joost Jeroen Ottens
Marcus Emile Joannes Boonman
Thomas Josephus M Castenmiller
Andre Bernardus Jeunink
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG132608A1 publication Critical patent/SG132608A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200607729-1A 2005-11-08 2006-11-07 Lithographic apparatus and device manufacturing method SG132608A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/268,777 US7564536B2 (en) 2005-11-08 2005-11-08 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
SG132608A1 true SG132608A1 (en) 2007-06-28

Family

ID=37775343

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200607729-1A SG132608A1 (en) 2005-11-08 2006-11-07 Lithographic apparatus and device manufacturing method

Country Status (7)

Country Link
US (1) US7564536B2 (zh)
EP (1) EP1783555A3 (zh)
JP (1) JP4455568B2 (zh)
KR (1) KR100840749B1 (zh)
CN (1) CN1971430A (zh)
SG (1) SG132608A1 (zh)
TW (1) TW200725162A (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7940511B2 (en) * 2007-09-21 2011-05-10 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
US8149387B2 (en) * 2007-10-10 2012-04-03 Asml Netherlands B.V. Method of placing a substrate, method of transferring a substrate, support system and lithographic projection apparatus
TWI424516B (zh) * 2007-10-10 2014-01-21 Asml Netherlands Bv 放置基板之方法、傳送基板之方法、支撐系統及微影投影裝置
NL1036033A1 (nl) * 2007-10-10 2009-04-15 Asml Netherlands Bv Method of transferring a substrate, transfer system and lithographic projection apparatus.
US8154709B2 (en) * 2007-10-10 2012-04-10 Asml Netherlands B.V. Method of placing a substrate, method of transferring a substrate, support system and lithographic projection apparatus
NL1036735A1 (nl) * 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.
FR2945638B1 (fr) * 2009-05-14 2012-01-06 Commissariat Energie Atomique Dispositif de maintien avec precision d'un composant, notamment optique, et montage comprenant au moins un tel dispositif
TW201135372A (en) * 2009-10-20 2011-10-16 Nikon Corp Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method
NL2007452A (en) 2010-12-08 2012-06-11 Asml Holding Nv Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp.
DE102011114875B4 (de) * 2011-09-30 2016-02-11 Carl Zeiss Smt Gmbh Substrathalter
EP3683627A1 (en) * 2012-02-03 2020-07-22 ASML Netherlands B.V. Substrate holder and lithographic apparatus
GB2524327A (en) * 2014-03-21 2015-09-23 Nokia Technologies Oy Flexible electronics apparatus and associated methods
EP2991460B1 (en) 2014-08-29 2018-11-21 Nokia Technologies OY An apparatus and associated methods for deformable electronics
EP3009822B1 (en) 2014-10-16 2017-06-21 Nokia Technologies OY A deformable apparatus and method
EP3010315A1 (en) 2014-10-16 2016-04-20 Nokia Technologies OY A deformable apparatus and method
EP3210080B1 (en) 2014-10-23 2020-12-09 ASML Netherlands B.V. Support table for a lithographic apparatus, method of loading a substrate, lithographic apparatus and device manufacturing method
JP2018533763A (ja) * 2015-10-29 2018-11-15 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置用基板テーブル、および基板の装填方法
DE102016107001A1 (de) * 2016-04-15 2017-10-19 Ist Metz Gmbh Vorrichtung zur Belichtung eines Substrats
US10451981B2 (en) * 2016-10-28 2019-10-22 Asml Netherlands B.V. Measurement substrate, a measurement method and a measurement system
EP3667696A1 (en) * 2018-12-14 2020-06-17 ASML Netherlands B.V. Stage apparatus suitable for electron beam inspection apparatus
EP3882700A1 (en) * 2020-03-16 2021-09-22 ASML Netherlands B.V. Object holder, tool and method of manufacturing an object holder
US20210342659A1 (en) * 2020-05-01 2021-11-04 X-Celeprint Limited Hybrid documents with electronic indicia

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094536A (en) 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
US5601957A (en) 1994-06-16 1997-02-11 Nikon Corporation Micro devices manufacturing method comprising the use of a second pattern overlying an alignment mark to reduce flattening
US5923408A (en) 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6325351B1 (en) * 2000-01-05 2001-12-04 The Regents Of The University Of California Highly damped kinematic coupling for precision instruments
DE10003639C2 (de) 2000-01-28 2003-06-18 Steag Rtp Systems Gmbh Vorrichtung zum thermischen Behandeln von Substraten
US6628406B1 (en) * 2000-04-20 2003-09-30 Justin L. Kreuzer Self referencing mark independent alignment sensor
JP4041649B2 (ja) 2000-10-26 2008-01-30 松下電器産業株式会社 電子部品の実装方法及び電子部品実装体
KR100468929B1 (ko) * 2000-06-16 2005-01-29 마츠시타 덴끼 산교 가부시키가이샤 전자부품의 실장 방법 및 전자부품 실장체
US6717159B2 (en) 2000-10-18 2004-04-06 Nikon Corporation Low distortion kinematic reticle support
KR100422444B1 (ko) 2001-05-29 2004-03-12 삼성전자주식회사 정전 척에 설치되는 웨이퍼 공간 지지장치 및 그 제조방법
TWI254841B (en) 2002-12-23 2006-05-11 Asml Netherlands Bv Lithographic apparatus
JP4363401B2 (ja) 2003-03-26 2009-11-11 信越半導体株式会社 熱処理用ウェーハ支持具及び熱処理装置
EP1486828B1 (en) 2003-06-09 2013-10-09 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) * 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100697299B1 (ko) * 2003-07-23 2007-03-20 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치, 디바이스 제조방법 및 그에 따라 제조된디바이스
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7320695B2 (en) * 2003-12-31 2008-01-22 Biosense Webster, Inc. Safe septal needle and method for its use
US7133120B2 (en) 2004-05-04 2006-11-07 Asml Netherlands B.V. Lithographic apparatus, article support member, and method

Also Published As

Publication number Publication date
US7564536B2 (en) 2009-07-21
EP1783555A3 (en) 2007-05-30
CN1971430A (zh) 2007-05-30
KR100840749B1 (ko) 2008-06-23
JP4455568B2 (ja) 2010-04-21
US20070103666A1 (en) 2007-05-10
JP2007150288A (ja) 2007-06-14
TW200725162A (en) 2007-07-01
KR20070049593A (ko) 2007-05-11
EP1783555A2 (en) 2007-05-09

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