SG115785A1 - Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device - Google Patents

Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device

Info

Publication number
SG115785A1
SG115785A1 SG200501725A SG200501725A SG115785A1 SG 115785 A1 SG115785 A1 SG 115785A1 SG 200501725 A SG200501725 A SG 200501725A SG 200501725 A SG200501725 A SG 200501725A SG 115785 A1 SG115785 A1 SG 115785A1
Authority
SG
Singapore
Prior art keywords
sensitive adhesive
adhesive sheet
semiconductor
semiconductor device
hardenable pressure
Prior art date
Application number
SG200501725A
Other languages
English (en)
Inventor
Saiki Naoya
Yamazaki Osamu
Hamasaki Akie
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG115785A1 publication Critical patent/SG115785A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
SG200501725A 2004-03-19 2005-03-18 Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device SG115785A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004080701A JP4027332B2 (ja) 2004-03-19 2004-03-19 半導体用粘接着シートおよび半導体装置の製造方法

Publications (1)

Publication Number Publication Date
SG115785A1 true SG115785A1 (en) 2005-10-28

Family

ID=34979300

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200501725A SG115785A1 (en) 2004-03-19 2005-03-18 Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device

Country Status (7)

Country Link
US (1) US20050208296A1 (ko)
EP (1) EP1598864A3 (ko)
JP (1) JP4027332B2 (ko)
KR (1) KR20060043767A (ko)
MY (1) MY137601A (ko)
SG (1) SG115785A1 (ko)
TW (1) TW200534446A (ko)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
JP2006206697A (ja) * 2005-01-26 2006-08-10 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
US20070144653A1 (en) * 2005-12-22 2007-06-28 Padilla Kenneth A Methods and systems for debonding substrates
JP4984573B2 (ja) * 2006-02-28 2012-07-25 住友ベークライト株式会社 ダイアタッチペースト及びダイアタッチペーストを使用して作製した半導体装置
JP4846406B2 (ja) * 2006-03-28 2011-12-28 リンテック株式会社 チップ用保護膜形成用シート
JP4814000B2 (ja) * 2006-07-26 2011-11-09 リンテック株式会社 光学機能性フィルム貼合用粘着剤、光学機能性フィルム及びその製造方法
KR101040439B1 (ko) * 2006-10-24 2011-06-09 주식회사 엘지화학 다이싱-다이본딩 필름 및 이를 이용하는 반도체 패키징방법
JP5117708B2 (ja) * 2006-11-30 2013-01-16 電気化学工業株式会社 粘着剤、粘着テープ、ダイジング用粘着テープ、及び、電子部品の製造方法
US8114520B2 (en) * 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
JP5059559B2 (ja) * 2006-12-05 2012-10-24 リンテック株式会社 レーザーダイシングシートおよびチップ体の製造方法
CN101636462B (zh) * 2007-03-16 2013-03-13 3M创新有限公司 切片和晶片附连粘合剂
JP4778472B2 (ja) * 2007-05-08 2011-09-21 日東電工株式会社 粘着型光学フィルムおよび画像表示装置
KR101492629B1 (ko) * 2007-06-28 2015-02-12 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법
US8901207B2 (en) 2009-01-29 2014-12-02 Sekisui Chemical Co., Ltd. Adhesive for electronic components
JP2010248387A (ja) * 2009-04-16 2010-11-04 Sekisui Chem Co Ltd 光学部材用光硬化性樹脂組成物、接着剤、及び、タッチパネル
TWI449747B (zh) * 2009-10-01 2014-08-21 Thinflex Corp 導熱性覆金屬積層板、環氧樹脂組成物及其應用
KR101351622B1 (ko) * 2010-12-29 2014-01-15 제일모직주식회사 다이싱 다이 본딩 필름
JP5645678B2 (ja) * 2011-01-14 2014-12-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5841371B2 (ja) * 2011-07-29 2016-01-13 藤森工業株式会社 接着フィルム
US8696864B2 (en) * 2012-01-26 2014-04-15 Promerus, Llc Room temperature debonding composition, method and stack
KR101549735B1 (ko) * 2013-03-26 2015-09-02 제일모직주식회사 유기발광소자 충전제용 열경화형 조성물 및 이를 포함하는 유기발광소자 디스플레이 장치
JP6436681B2 (ja) * 2014-08-08 2018-12-12 キヤノン株式会社 遮光塗料、遮光塗料セット、遮光膜、光学素子、遮光膜の製造方法、光学素子の製造方法、及び光学機器
JP6721325B2 (ja) * 2015-12-14 2020-07-15 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP6332764B2 (ja) * 2016-11-17 2018-05-30 大日本印刷株式会社 接着剤組成物およびそれを用いた接着シート
KR102466644B1 (ko) * 2021-03-23 2022-11-16 주식회사 엘엠에스 점착제 조성물 및 광학 점착제
WO2022250133A1 (ja) * 2021-05-28 2022-12-01 三井化学東セロ株式会社 電子装置の製造方法
EP4349593A1 (en) * 2021-05-28 2024-04-10 Mitsui Chemicals Tohcello, Inc. Adhesive film for backgrinding and production method for electronic device
EP4350743A1 (en) * 2021-05-28 2024-04-10 Mitsui Chemicals Tohcello, Inc. Method for producing electronic device
CN113683980A (zh) * 2021-09-06 2021-11-23 芜湖徽氏新材料科技有限公司 一种半导体封装用耐高温胶带及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4612209A (en) * 1983-12-27 1986-09-16 Ciba-Geigy Corporation Process for the preparation of heat-curable adhesive films
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
WO1994028544A1 (fr) * 1993-05-24 1994-12-08 Tdk Corporation Support d'enregistrement magnetique
JP3405269B2 (ja) * 1999-04-26 2003-05-12 ソニーケミカル株式会社 実装方法
JP4703833B2 (ja) * 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP2002299378A (ja) * 2001-03-30 2002-10-11 Lintec Corp 導電体付接着シート、半導体装置製造方法および半導体装置
JP4869517B2 (ja) * 2001-08-21 2012-02-08 リンテック株式会社 粘接着テープ
JP4228582B2 (ja) * 2002-04-10 2009-02-25 日立化成工業株式会社 接着シートならびに半導体装置およびその製造方法

Also Published As

Publication number Publication date
US20050208296A1 (en) 2005-09-22
MY137601A (en) 2009-02-27
JP2005268613A (ja) 2005-09-29
KR20060043767A (ko) 2006-05-15
EP1598864A2 (en) 2005-11-23
TW200534446A (en) 2005-10-16
EP1598864A3 (en) 2006-06-21
JP4027332B2 (ja) 2007-12-26

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