SG114774A1 - Bga package vacuum pad - Google Patents

Bga package vacuum pad

Info

Publication number
SG114774A1
SG114774A1 SG200501234A SG200501234A SG114774A1 SG 114774 A1 SG114774 A1 SG 114774A1 SG 200501234 A SG200501234 A SG 200501234A SG 200501234 A SG200501234 A SG 200501234A SG 114774 A1 SG114774 A1 SG 114774A1
Authority
SG
Singapore
Prior art keywords
bga package
vacuum pad
package vacuum
pad
bga
Prior art date
Application number
SG200501234A
Other languages
English (en)
Inventor
Jae Hoon Seo
Original Assignee
Secron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Secron Co Ltd filed Critical Secron Co Ltd
Publication of SG114774A1 publication Critical patent/SG114774A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
SG200501234A 2004-03-04 2005-03-02 Bga package vacuum pad SG114774A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040014757A KR100498245B1 (ko) 2004-03-04 2004-03-04 비지에이 패키지 진공패드

Publications (1)

Publication Number Publication Date
SG114774A1 true SG114774A1 (en) 2005-09-28

Family

ID=35032398

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200501234A SG114774A1 (en) 2004-03-04 2005-03-02 Bga package vacuum pad

Country Status (5)

Country Link
JP (1) JP2005252259A (ko)
KR (1) KR100498245B1 (ko)
CN (1) CN1664986A (ko)
SG (1) SG114774A1 (ko)
TW (1) TW200532931A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105628068A (zh) * 2014-10-30 2016-06-01 宁波舜宇光电信息有限公司 一种防止测量偏差的治具及其制造方法
CN107685240A (zh) * 2017-09-29 2018-02-13 深圳市宇顺电子股份有限公司 一种fpc放置平台
CN110013931B (zh) * 2019-04-26 2020-09-22 长江存储科技有限责任公司 用于球栅阵列封装件喷涂的装置及喷涂方法

Also Published As

Publication number Publication date
KR100498245B1 (ko) 2005-07-01
JP2005252259A (ja) 2005-09-15
CN1664986A (zh) 2005-09-07
TW200532931A (en) 2005-10-01

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