SG114488A1 - Flexible ball grid array chip scale packages and methods of fabrication - Google Patents

Flexible ball grid array chip scale packages and methods of fabrication

Info

Publication number
SG114488A1
SG114488A1 SG200102580A SG200102580A SG114488A1 SG 114488 A1 SG114488 A1 SG 114488A1 SG 200102580 A SG200102580 A SG 200102580A SG 200102580 A SG200102580 A SG 200102580A SG 114488 A1 SG114488 A1 SG 114488A1
Authority
SG
Singapore
Prior art keywords
fabrication
methods
grid array
ball grid
array chip
Prior art date
Application number
SG200102580A
Inventor
Chee Moon Ow
Meow Koon Eng
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to US09/874,631 priority Critical patent/US7115986B2/en
Publication of SG114488A1 publication Critical patent/SG114488A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
SG200102580A 2000-06-28 2001-05-02 Flexible ball grid array chip scale packages and methods of fabrication SG114488A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/874,631 US7115986B2 (en) 2001-05-02 2001-06-05 Flexible ball grid array chip scale packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64320000P 2000-06-28 2000-06-28

Publications (1)

Publication Number Publication Date
SG114488A1 true SG114488A1 (en) 2005-09-28

Family

ID=35125831

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200102580A SG114488A1 (en) 2000-06-28 2001-05-02 Flexible ball grid array chip scale packages and methods of fabrication

Country Status (1)

Country Link
SG (1) SG114488A1 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US5805422A (en) * 1994-09-21 1998-09-08 Nec Corporation Semiconductor package with flexible board and method of fabricating the same
DE19758197A1 (en) * 1997-12-30 1999-07-22 Siemens Ag Semiconductor memory chip stacking arrangement for large memory capacity computer application
US5982030A (en) * 1998-02-27 1999-11-09 Macintrye; Donald Malcom Rigid package with low stress mounting of semiconductor die
WO1999065282A1 (en) * 1998-06-10 1999-12-16 Irvine Sensors Corporation Ic stack utilizing flexible circuits with bga contacts
US6028365A (en) * 1998-03-30 2000-02-22 Micron Technology, Inc. Integrated circuit package and method of fabrication
JP2001077294A (en) * 1999-09-02 2001-03-23 Nec Corp Semiconductor device
US6262895B1 (en) * 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
US6323060B1 (en) * 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
US5805422A (en) * 1994-09-21 1998-09-08 Nec Corporation Semiconductor package with flexible board and method of fabricating the same
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
DE19758197A1 (en) * 1997-12-30 1999-07-22 Siemens Ag Semiconductor memory chip stacking arrangement for large memory capacity computer application
US5982030A (en) * 1998-02-27 1999-11-09 Macintrye; Donald Malcom Rigid package with low stress mounting of semiconductor die
US6028365A (en) * 1998-03-30 2000-02-22 Micron Technology, Inc. Integrated circuit package and method of fabrication
WO1999065282A1 (en) * 1998-06-10 1999-12-16 Irvine Sensors Corporation Ic stack utilizing flexible circuits with bga contacts
US6323060B1 (en) * 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
JP2001077294A (en) * 1999-09-02 2001-03-23 Nec Corp Semiconductor device
US6262895B1 (en) * 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier

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