SG11202112284TA - Mask structure and fcva apparatus - Google Patents

Mask structure and fcva apparatus

Info

Publication number
SG11202112284TA
SG11202112284TA SG11202112284TA SG11202112284TA SG11202112284TA SG 11202112284T A SG11202112284T A SG 11202112284TA SG 11202112284T A SG11202112284T A SG 11202112284TA SG 11202112284T A SG11202112284T A SG 11202112284TA SG 11202112284T A SG11202112284T A SG 11202112284TA
Authority
SG
Singapore
Prior art keywords
mask structure
fcva apparatus
fcva
mask
Prior art date
Application number
SG11202112284TA
Inventor
Quanyu Shi
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of SG11202112284TA publication Critical patent/SG11202112284TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Electron Beam Exposure (AREA)
SG11202112284TA 2019-07-05 2020-06-30 Mask structure and fcva apparatus SG11202112284TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910605875.7A CN110158029B (en) 2019-07-05 2019-07-05 Mask structure and FCVA device
PCT/CN2020/099265 WO2021004331A1 (en) 2019-07-05 2020-06-30 Mask structure and fcva device

Publications (1)

Publication Number Publication Date
SG11202112284TA true SG11202112284TA (en) 2021-12-30

Family

ID=67637683

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112284TA SG11202112284TA (en) 2019-07-05 2020-06-30 Mask structure and fcva apparatus

Country Status (7)

Country Link
US (1) US11408064B2 (en)
JP (1) JP7159487B2 (en)
KR (1) KR102338681B1 (en)
CN (1) CN110158029B (en)
SG (1) SG11202112284TA (en)
TW (1) TWI731733B (en)
WO (1) WO2021004331A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110158029B (en) * 2019-07-05 2020-07-17 北京北方华创微电子装备有限公司 Mask structure and FCVA device
CN113388809B (en) * 2021-06-21 2022-07-29 京东方科技集团股份有限公司 Mask plate

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927454A (en) * 1995-07-13 1997-01-28 Fuji Electric Co Ltd Mask for selective evaporation
US5825607A (en) * 1996-05-08 1998-10-20 Applied Materials, Inc. Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
JPH1046339A (en) * 1996-07-29 1998-02-17 Matsushita Electric Ind Co Ltd Substrate handling method
JPH10233434A (en) * 1997-02-21 1998-09-02 Hitachi Ltd Electrostatic adsorbent and adsorber
US5903428A (en) * 1997-09-25 1999-05-11 Applied Materials, Inc. Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same
JP3859937B2 (en) * 2000-06-02 2006-12-20 住友大阪セメント株式会社 Electrostatic chuck
JP2004265991A (en) * 2003-02-28 2004-09-24 Toto Ltd Method of manufacturing electrostatic chuck
JP4648028B2 (en) * 2005-02-10 2011-03-09 三菱電機株式会社 Mask alignment device
JP5184643B2 (en) * 2008-10-21 2013-04-17 株式会社アルバック Mask and film forming method using mask
CN102080206B (en) * 2010-12-20 2012-11-14 东莞宏威数码机械有限公司 Mask plate bearing device
CN202231261U (en) * 2011-09-28 2012-05-23 普天新能源有限责任公司 Floating connecting device of power battery box of electric automobile
KR101726236B1 (en) * 2012-11-07 2017-04-13 아레바 엔피 Method for thermochemically treating a part while masking a portion and corresponding mask
TWI514463B (en) * 2012-11-30 2015-12-21 Global Material Science Co Ltd Method for manufacturing emboss surface of electric static chuck of dry etch apparatus
WO2015077590A1 (en) * 2013-11-22 2015-05-28 Applied Materials, Inc. Pad design for electrostatic chuck surface
KR20150102564A (en) * 2014-02-28 2015-09-07 하이디스 테크놀로지 주식회사 Sputtering apparatus having insulator for preventing deposition
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US20160348233A1 (en) * 2015-05-29 2016-12-01 Applied Materials, Inc. Grounding of conductive mask for deposition processes
CN105200370A (en) * 2015-10-27 2015-12-30 唐军 Recyclable mask plate frame and mask plate possessing same
CN105514692B (en) * 2015-12-15 2018-06-29 贵州航天电器股份有限公司 A kind of miniature electric connector floating mount mechanism
CN108603279A (en) * 2016-01-28 2018-09-28 应用材料公司 For the mask-placement of masking substrate and for by the method for mask and base plate alignment
CN205429010U (en) * 2016-03-21 2016-08-03 长安大学 Piezoceramics sample making electrode device
KR102455363B1 (en) * 2016-09-29 2022-10-18 다이니폰 인사츠 가부시키가이샤 Vapor deposition mask package and vapor deposition mask packaging method
CN108538776B (en) * 2018-03-29 2021-11-16 北京北方华创微电子装备有限公司 Electrostatic chuck and method of manufacturing the same
CN108711558B (en) * 2018-05-11 2021-07-23 北京华卓精科科技股份有限公司 Preparation method of electrostatic chuck surface morphology
CN108842133B (en) * 2018-05-31 2020-07-10 北京师范大学 Preparation method and equipment of graphical electrostatic chuck
CN110158029B (en) * 2019-07-05 2020-07-17 北京北方华创微电子装备有限公司 Mask structure and FCVA device

Also Published As

Publication number Publication date
US20220145440A1 (en) 2022-05-12
KR102338681B1 (en) 2021-12-13
TW202103234A (en) 2021-01-16
JP2022532321A (en) 2022-07-14
WO2021004331A1 (en) 2021-01-14
KR20210134812A (en) 2021-11-10
US11408064B2 (en) 2022-08-09
CN110158029B (en) 2020-07-17
CN110158029A (en) 2019-08-23
JP7159487B2 (en) 2022-10-24
TWI731733B (en) 2021-06-21

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