SG11202103629UA - Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such - Google Patents
Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using suchInfo
- Publication number
- SG11202103629UA SG11202103629UA SG11202103629UA SG11202103629UA SG11202103629UA SG 11202103629U A SG11202103629U A SG 11202103629UA SG 11202103629U A SG11202103629U A SG 11202103629UA SG 11202103629U A SG11202103629U A SG 11202103629UA SG 11202103629U A SG11202103629U A SG 11202103629UA
- Authority
- SG
- Singapore
- Prior art keywords
- mould
- electronic components
- support surface
- components mounted
- carrier including
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 230000009977 dual effect Effects 0.000 title 1
- 238000001721 transfer moulding Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/32—Moulds having several axially spaced mould cavities, i.e. for making several separated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/641—Clamping devices using means for straddling or interconnecting the mould halves, e.g. jaws, straps, latches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/80—Measuring, controlling or regulating of relative position of mould parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
- B29C2045/338—Mould parts with combined axial and transversal movements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C2045/378—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings built by a stack of modular elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76003—Measured parameter
- B29C2945/76083—Position
- B29C2945/76096—Distance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
- B29C2945/76—Measuring, controlling or regulating
- B29C2945/76177—Location of measurement
- B29C2945/76254—Mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2021845A NL2021845B1 (en) | 2018-10-22 | 2018-10-22 | Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such |
PCT/NL2019/050692 WO2020085899A1 (en) | 2018-10-22 | 2019-10-22 | Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202103629UA true SG11202103629UA (en) | 2021-05-28 |
Family
ID=64427170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202103629UA SG11202103629UA (en) | 2018-10-22 | 2019-10-22 | Mould half and mould method for transfer moulding encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such |
Country Status (8)
Country | Link |
---|---|
US (1) | US20210387389A1 (en) |
KR (1) | KR20210077737A (en) |
CN (1) | CN112912224B (en) |
DE (1) | DE112019005272T5 (en) |
NL (1) | NL2021845B1 (en) |
SG (1) | SG11202103629UA (en) |
TW (1) | TW202037473A (en) |
WO (1) | WO2020085899A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113910515B (en) * | 2021-10-29 | 2024-04-26 | 西安微电子技术研究所 | Device and method for reinforcing heat dissipation gasket in power module |
CN114633437A (en) * | 2022-04-06 | 2022-06-17 | 宁波保税区海天智胜金属成型设备有限公司 | Novel hydraulic adjusting two-plate sliding foot structure |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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US647151A (en) | 1899-05-17 | 1900-04-10 | Robert Hoe | Multicolor stop-cylider printing-machine. |
US5409362A (en) * | 1992-11-24 | 1995-04-25 | Neu Dynamics Corp. | Encapsulation molding equipment |
JPH0976319A (en) * | 1995-09-13 | 1997-03-25 | Apic Yamada Kk | Resin mold device |
CN1223011A (en) * | 1996-06-21 | 1999-07-14 | 先进自动化体系有限公司 | Wedge device for linear force amplification in press |
JP3137322B2 (en) * | 1996-07-12 | 2001-02-19 | 富士通株式会社 | Semiconductor device manufacturing method, semiconductor device manufacturing mold, and semiconductor device |
JP3490606B2 (en) * | 1998-03-20 | 2004-01-26 | 富士通株式会社 | Mold for semiconductor device manufacturing |
JP4077118B2 (en) * | 1999-06-25 | 2008-04-16 | 富士通株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing mold |
JP4549521B2 (en) * | 2000-12-14 | 2010-09-22 | フィーサ株式会社 | Insert molding method and mold |
JP2003053791A (en) * | 2001-08-22 | 2003-02-26 | Mitsubishi Electric Corp | Semiconductor manufacturing apparatus and semiconductor device manufactured thereby |
US7147447B1 (en) * | 2005-07-27 | 2006-12-12 | Texas Instruments Incorporated | Plastic semiconductor package having improved control of dimensions |
NL2000356C2 (en) * | 2006-12-05 | 2008-06-06 | Fico Bv | Method and device for encapsulating electronic components wherein the encapsulating material is cooled. |
MY172009A (en) * | 2009-10-16 | 2019-11-11 | Alcon Inc | Process for manufacturing an ophthalmic lens |
DE102010047454A1 (en) * | 2010-10-04 | 2012-04-05 | Osram Opto Semiconductors Gmbh | Process for producing a silicone film, silicone film and optoelectronic semiconductor component with a silicone film |
JP5906528B2 (en) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | Mold and resin molding apparatus using the same |
CN203198145U (en) * | 2012-11-19 | 2013-09-18 | 法国圣戈班玻璃厂 | Equipment for molding special-type band in die containing glass window component |
FR2999468B1 (en) * | 2012-12-14 | 2015-05-29 | Plastic Omnium Cie | COMPRESSION MOLDING BODY WITH IMPROVED SEALING |
CN105283294B (en) * | 2013-05-29 | 2017-08-25 | 山田尖端科技株式会社 | Resin molding machine and resin molding method |
JP6062810B2 (en) * | 2013-06-14 | 2017-01-18 | アピックヤマダ株式会社 | Resin mold and resin mold apparatus |
KR20150089205A (en) * | 2014-01-27 | 2015-08-05 | 세메스 주식회사 | Apparatus for molding semiconductor devices |
US9427893B2 (en) * | 2014-09-18 | 2016-08-30 | Asm Technology Singapore Pte Ltd | Molding press and a platen for a molding press |
CN108025474A (en) * | 2015-09-25 | 2018-05-11 | 沙特基础工业全球技术有限公司 | The method molded using mold insert and the device for it |
NL2016011B1 (en) * | 2015-12-23 | 2017-07-03 | Besi Netherlands Bv | Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators. |
DE102016001698A1 (en) * | 2016-02-13 | 2017-08-17 | Henniges Automotive Gmbh & Co. Kg | Method for mass-producing plate elements and device for equipping a plate element with a molded component |
JP6236486B2 (en) * | 2016-03-07 | 2017-11-22 | Towa株式会社 | A position adjusting mechanism, a resin sealing device, a resin sealing method, and a resin sealing product manufacturing method. |
US20180117813A1 (en) * | 2016-11-02 | 2018-05-03 | Asm Technology Singapore Pte Ltd | Molding apparatus including a compressible structure |
-
2018
- 2018-10-22 NL NL2021845A patent/NL2021845B1/en active
-
2019
- 2019-10-22 KR KR1020217015049A patent/KR20210077737A/en unknown
- 2019-10-22 US US17/286,992 patent/US20210387389A1/en active Pending
- 2019-10-22 SG SG11202103629UA patent/SG11202103629UA/en unknown
- 2019-10-22 CN CN201980069382.4A patent/CN112912224B/en active Active
- 2019-10-22 TW TW108138096A patent/TW202037473A/en unknown
- 2019-10-22 WO PCT/NL2019/050692 patent/WO2020085899A1/en active Application Filing
- 2019-10-22 DE DE112019005272.1T patent/DE112019005272T5/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20210387389A1 (en) | 2021-12-16 |
DE112019005272T5 (en) | 2021-07-08 |
NL2021845B1 (en) | 2020-05-13 |
CN112912224B (en) | 2024-02-23 |
TW202037473A (en) | 2020-10-16 |
WO2020085899A1 (en) | 2020-04-30 |
CN112912224A (en) | 2021-06-04 |
KR20210077737A (en) | 2021-06-25 |
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