SG11202010886VA - Scanning differential interference contrast in an imaging system design - Google Patents
Scanning differential interference contrast in an imaging system designInfo
- Publication number
- SG11202010886VA SG11202010886VA SG11202010886VA SG11202010886VA SG11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA
- Authority
- SG
- Singapore
- Prior art keywords
- imaging system
- system design
- differential interference
- interference contrast
- scanning differential
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4795—Scattering, i.e. diffuse reflection spatially resolved investigating of object in scattering medium
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8848—Polarisation of light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862751472P | 2018-10-26 | 2018-10-26 | |
US16/584,370 US10705026B2 (en) | 2018-10-26 | 2019-09-26 | Scanning differential interference contrast in an imaging system design |
PCT/US2019/057971 WO2020086920A1 (en) | 2018-10-26 | 2019-10-25 | Scanning differential interference contrast in an imaging system design |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202010886VA true SG11202010886VA (en) | 2020-11-27 |
Family
ID=70328550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202010886VA SG11202010886VA (en) | 2018-10-26 | 2019-10-25 | Scanning differential interference contrast in an imaging system design |
Country Status (8)
Country | Link |
---|---|
US (1) | US10705026B2 (en) |
JP (1) | JP7344225B2 (en) |
KR (1) | KR102580562B1 (en) |
CN (1) | CN112136037B (en) |
IL (1) | IL278807B2 (en) |
SG (1) | SG11202010886VA (en) |
TW (1) | TWI797390B (en) |
WO (1) | WO2020086920A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021159285A1 (en) * | 2020-02-12 | 2021-08-19 | 深圳华大智造科技股份有限公司 | Optical imaging system and biochemical substance detection system using same |
WO2023135681A1 (en) * | 2022-01-12 | 2023-07-20 | 株式会社日立ハイテク | Surface inspecting device |
CN115166062B (en) * | 2022-08-22 | 2024-06-11 | 天津大学 | All-optical ultrasonic detector based on differential interference and detection method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5232384A (en) * | 1975-09-08 | 1977-03-11 | Fuji Photo Film Co Ltd | Densitometer |
JPH05232384A (en) * | 1992-02-18 | 1993-09-10 | Olympus Optical Co Ltd | Interference microscope |
GB9610471D0 (en) * | 1996-05-18 | 1996-07-24 | Univ Nottingham | Optical measurement |
US6404544B1 (en) * | 1999-06-01 | 2002-06-11 | Optical Perspectives Group, Llc | Wavelength multiplexed quantitative differential interference contrast microscopy |
US6741356B1 (en) * | 1999-09-20 | 2004-05-25 | Olympus Corporation | Method for detecting physical amount of object and optical apparatus using the same |
JP2001242382A (en) * | 1999-12-24 | 2001-09-07 | Olympus Optical Co Ltd | Differential interference optical system |
US20050254065A1 (en) | 2004-05-12 | 2005-11-17 | Stokowski Stanley E | Method and apparatus for detecting surface characteristics on a mask blank |
JP5132982B2 (en) | 2007-05-02 | 2013-01-30 | 株式会社日立ハイテクノロジーズ | Pattern defect inspection apparatus and method |
US8143600B2 (en) | 2008-02-18 | 2012-03-27 | Visiongate, Inc. | 3D imaging of live cells with ultraviolet radiation |
JP2011525713A (en) | 2008-06-26 | 2011-09-22 | エーエスエムエル ネザーランズ ビー.ブイ. | Overlay measuring apparatus, lithographic apparatus, and device manufacturing method using such an overlay measuring apparatus |
JP5171744B2 (en) | 2009-07-01 | 2013-03-27 | 株式会社日立ハイテクノロジーズ | Defect inspection method and apparatus |
JP5553635B2 (en) * | 2009-10-23 | 2014-07-16 | キヤノン株式会社 | Compensating optical device, imaging device, compensating optical method, and imaging method |
JP4716148B1 (en) | 2010-03-30 | 2011-07-06 | レーザーテック株式会社 | Inspection apparatus, defect classification method, and defect detection method |
US20110242312A1 (en) * | 2010-03-30 | 2011-10-06 | Lasertec Corporation | Inspection system and inspection method |
CN103852458B (en) * | 2014-02-28 | 2016-02-03 | 浙江大学 | A kind of microscopic method based on wide field stimulated emission difference and device |
US9726615B2 (en) * | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
US9860466B2 (en) | 2015-05-14 | 2018-01-02 | Kla-Tencor Corporation | Sensor with electrically controllable aperture for inspection and metrology systems |
US11061233B2 (en) * | 2015-06-30 | 2021-07-13 | 3M Innovative Properties Company | Polarizing beam splitter and illuminator including same |
WO2018003359A1 (en) * | 2016-07-01 | 2018-01-04 | 富士フイルム株式会社 | Laminate color filter, kit, laminate color filter manufacturing method and optical sensor |
JP6738254B2 (en) | 2016-09-26 | 2020-08-12 | 株式会社日立ハイテク | Defect detection device and defect observation device |
JP2020503535A (en) * | 2016-12-02 | 2020-01-30 | ルムス エルティーディー. | Optical system with compact collimating image projector |
-
2019
- 2019-09-26 US US16/584,370 patent/US10705026B2/en active Active
- 2019-10-24 TW TW108138339A patent/TWI797390B/en active
- 2019-10-25 IL IL278807A patent/IL278807B2/en unknown
- 2019-10-25 KR KR1020217016057A patent/KR102580562B1/en active IP Right Grant
- 2019-10-25 JP JP2020564897A patent/JP7344225B2/en active Active
- 2019-10-25 CN CN201980033378.2A patent/CN112136037B/en active Active
- 2019-10-25 SG SG11202010886VA patent/SG11202010886VA/en unknown
- 2019-10-25 WO PCT/US2019/057971 patent/WO2020086920A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20200132608A1 (en) | 2020-04-30 |
KR102580562B1 (en) | 2023-09-19 |
IL278807A (en) | 2021-01-31 |
IL278807B1 (en) | 2023-08-01 |
CN112136037A (en) | 2020-12-25 |
IL278807B2 (en) | 2023-12-01 |
JP7344225B2 (en) | 2023-09-13 |
WO2020086920A1 (en) | 2020-04-30 |
TW202022687A (en) | 2020-06-16 |
KR20210069730A (en) | 2021-06-11 |
JP2022503371A (en) | 2022-01-12 |
US10705026B2 (en) | 2020-07-07 |
CN112136037B (en) | 2022-03-29 |
TWI797390B (en) | 2023-04-01 |
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