SG11202010886VA - Scanning differential interference contrast in an imaging system design - Google Patents

Scanning differential interference contrast in an imaging system design

Info

Publication number
SG11202010886VA
SG11202010886VA SG11202010886VA SG11202010886VA SG11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA SG 11202010886V A SG11202010886V A SG 11202010886VA
Authority
SG
Singapore
Prior art keywords
imaging system
system design
differential interference
interference contrast
scanning differential
Prior art date
Application number
SG11202010886VA
Inventor
Raymond Chu
Andrew Zeng
Donald Pettibone
Chunsheng Huang
Bret Whiteside
Fabrice Paccoret
Xuan Wang
Chuanyong Huang
Steve Xu
Anatoly Romanovsky
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of SG11202010886VA publication Critical patent/SG11202010886VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4795—Scattering, i.e. diffuse reflection spatially resolved investigating of object in scattering medium
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30—Collimators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
SG11202010886VA 2018-10-26 2019-10-25 Scanning differential interference contrast in an imaging system design SG11202010886VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862751472P 2018-10-26 2018-10-26
US16/584,370 US10705026B2 (en) 2018-10-26 2019-09-26 Scanning differential interference contrast in an imaging system design
PCT/US2019/057971 WO2020086920A1 (en) 2018-10-26 2019-10-25 Scanning differential interference contrast in an imaging system design

Publications (1)

Publication Number Publication Date
SG11202010886VA true SG11202010886VA (en) 2020-11-27

Family

ID=70328550

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202010886VA SG11202010886VA (en) 2018-10-26 2019-10-25 Scanning differential interference contrast in an imaging system design

Country Status (8)

Country Link
US (1) US10705026B2 (en)
JP (1) JP7344225B2 (en)
KR (1) KR102580562B1 (en)
CN (1) CN112136037B (en)
IL (1) IL278807B2 (en)
SG (1) SG11202010886VA (en)
TW (1) TWI797390B (en)
WO (1) WO2020086920A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021159285A1 (en) * 2020-02-12 2021-08-19 深圳华大智造科技股份有限公司 Optical imaging system and biochemical substance detection system using same
WO2023135681A1 (en) * 2022-01-12 2023-07-20 株式会社日立ハイテク Surface inspecting device
CN115166062B (en) * 2022-08-22 2024-06-11 天津大学 All-optical ultrasonic detector based on differential interference and detection method

Family Cites Families (21)

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JPS5232384A (en) * 1975-09-08 1977-03-11 Fuji Photo Film Co Ltd Densitometer
JPH05232384A (en) * 1992-02-18 1993-09-10 Olympus Optical Co Ltd Interference microscope
GB9610471D0 (en) * 1996-05-18 1996-07-24 Univ Nottingham Optical measurement
US6404544B1 (en) * 1999-06-01 2002-06-11 Optical Perspectives Group, Llc Wavelength multiplexed quantitative differential interference contrast microscopy
US6741356B1 (en) * 1999-09-20 2004-05-25 Olympus Corporation Method for detecting physical amount of object and optical apparatus using the same
JP2001242382A (en) * 1999-12-24 2001-09-07 Olympus Optical Co Ltd Differential interference optical system
US20050254065A1 (en) 2004-05-12 2005-11-17 Stokowski Stanley E Method and apparatus for detecting surface characteristics on a mask blank
JP5132982B2 (en) 2007-05-02 2013-01-30 株式会社日立ハイテクノロジーズ Pattern defect inspection apparatus and method
US8143600B2 (en) 2008-02-18 2012-03-27 Visiongate, Inc. 3D imaging of live cells with ultraviolet radiation
JP2011525713A (en) 2008-06-26 2011-09-22 エーエスエムエル ネザーランズ ビー．ブイ． Overlay measuring apparatus, lithographic apparatus, and device manufacturing method using such an overlay measuring apparatus
JP5171744B2 (en) 2009-07-01 2013-03-27 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus
JP5553635B2 (en) * 2009-10-23 2014-07-16 キヤノン株式会社 Compensating optical device, imaging device, compensating optical method, and imaging method
JP4716148B1 (en) 2010-03-30 2011-07-06 レーザーテック株式会社 Inspection apparatus, defect classification method, and defect detection method
US20110242312A1 (en) * 2010-03-30 2011-10-06 Lasertec Corporation Inspection system and inspection method
CN103852458B (en) * 2014-02-28 2016-02-03 浙江大学 A kind of microscopic method based on wide field stimulated emission difference and device
US9726615B2 (en) * 2014-07-22 2017-08-08 Kla-Tencor Corporation System and method for simultaneous dark field and phase contrast inspection
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US11061233B2 (en) * 2015-06-30 2021-07-13 3M Innovative Properties Company Polarizing beam splitter and illuminator including same
WO2018003359A1 (en) * 2016-07-01 2018-01-04 富士フイルム株式会社 Laminate color filter, kit, laminate color filter manufacturing method and optical sensor
JP6738254B2 (en) 2016-09-26 2020-08-12 株式会社日立ハイテク Defect detection device and defect observation device
JP2020503535A (en) * 2016-12-02 2020-01-30 ルムス エルティーディー． Optical system with compact collimating image projector

Also Published As

Publication number Publication date
US20200132608A1 (en) 2020-04-30
KR102580562B1 (en) 2023-09-19
IL278807A (en) 2021-01-31
IL278807B1 (en) 2023-08-01
CN112136037A (en) 2020-12-25
IL278807B2 (en) 2023-12-01
JP7344225B2 (en) 2023-09-13
WO2020086920A1 (en) 2020-04-30
TW202022687A (en) 2020-06-16
KR20210069730A (en) 2021-06-11
JP2022503371A (en) 2022-01-12
US10705026B2 (en) 2020-07-07
CN112136037B (en) 2022-03-29
TWI797390B (en) 2023-04-01

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