SG11202009322QA - Methods and apparatus for microwave leakage reduction for semiconductor process chambers - Google Patents
Methods and apparatus for microwave leakage reduction for semiconductor process chambersInfo
- Publication number
- SG11202009322QA SG11202009322QA SG11202009322QA SG11202009322QA SG11202009322QA SG 11202009322Q A SG11202009322Q A SG 11202009322QA SG 11202009322Q A SG11202009322Q A SG 11202009322QA SG 11202009322Q A SG11202009322Q A SG 11202009322QA SG 11202009322Q A SG11202009322Q A SG 11202009322QA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- semiconductor process
- process chambers
- microwave leakage
- leakage reduction
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/6408—Supports or covers specially adapted for use in microwave heating apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/76—Prevention of microwave leakage, e.g. door sealings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Details Of Valves (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862660415P | 2018-04-20 | 2018-04-20 | |
| US16/363,537 US11670525B2 (en) | 2018-04-20 | 2019-03-25 | Methods and apparatus for microwave leakage reduction for semiconductor process chambers |
| PCT/US2019/026929 WO2019204110A1 (en) | 2018-04-20 | 2019-04-11 | Methods and apparatus for microwave leakage reduction for semiconductor process chambers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202009322QA true SG11202009322QA (en) | 2020-11-27 |
Family
ID=68238252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202009322QA SG11202009322QA (en) | 2018-04-20 | 2019-04-11 | Methods and apparatus for microwave leakage reduction for semiconductor process chambers |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11670525B2 (en) |
| JP (1) | JP7032566B2 (en) |
| KR (1) | KR102533888B1 (en) |
| CN (1) | CN112005335B (en) |
| SG (1) | SG11202009322QA (en) |
| TW (1) | TWI734096B (en) |
| WO (1) | WO2019204110A1 (en) |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2106360B (en) * | 1981-09-25 | 1985-02-20 | Hitachi Heating Appl | Microwave heating apparatus |
| JPS61224289A (en) | 1985-03-27 | 1986-10-04 | 松下電器産業株式会社 | Radio wave leakage preventor for electronic oven range |
| KR0171337B1 (en) | 1995-09-18 | 1999-05-01 | 배순훈 | Microwave shielding structure for microwave oven door |
| KR100212856B1 (en) * | 1996-02-23 | 1999-08-02 | 윤종용 | Microwave oven |
| JP2001077088A (en) | 1999-09-02 | 2001-03-23 | Tokyo Electron Ltd | Plasma processing device |
| KR20030065728A (en) | 2002-01-30 | 2003-08-09 | 엘지전자 주식회사 | Mwo door having attenuating filter |
| JP2005032805A (en) | 2003-07-08 | 2005-02-03 | Future Vision:Kk | Microwave plasma processing method, microwave plasma processing equipment, and its plasma head |
| KR100652599B1 (en) * | 2005-07-13 | 2006-12-01 | 엘지전자 주식회사 | Cooking apparatus using microwave |
| JP5283835B2 (en) * | 2006-07-06 | 2013-09-04 | 東京エレクトロン株式会社 | Microwave plasma processing apparatus and gate valve for microwave plasma processing apparatus |
| US7502123B2 (en) | 2007-02-05 | 2009-03-10 | Palo Alto Research Center Incorporated | Obtaining information from optical cavity output light |
| US9179506B2 (en) | 2010-05-26 | 2015-11-03 | Lg Electronics Inc. | Door choke and cooking apparatus including the same |
| WO2012007842A2 (en) * | 2010-07-15 | 2012-01-19 | Goji Ltd. | A choke for an oven |
| JP2013073947A (en) | 2011-09-26 | 2013-04-22 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| US20130228568A1 (en) * | 2012-03-02 | 2013-09-05 | Illinois Tool Works Inc. | Multiple choke system for containing wide frequency band rf leakage |
| JP5955394B2 (en) | 2012-09-06 | 2016-07-20 | 株式会社日立国際電気 | Substrate processing apparatus, semiconductor device manufacturing method, and program |
| CN203112924U (en) * | 2012-09-28 | 2013-08-07 | 无锡元坤新材料科技有限公司 | Novel structure capable of preventing microwave leakage |
| JP6005549B2 (en) | 2013-02-27 | 2016-10-12 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
| US10912166B2 (en) * | 2016-11-30 | 2021-02-02 | Illinois Tool Works, Inc. | RF choke and interface structures for employment with an RF oven |
-
2019
- 2019-03-25 US US16/363,537 patent/US11670525B2/en active Active
- 2019-04-11 CN CN201980026308.4A patent/CN112005335B/en active Active
- 2019-04-11 JP JP2020557226A patent/JP7032566B2/en active Active
- 2019-04-11 WO PCT/US2019/026929 patent/WO2019204110A1/en active Application Filing
- 2019-04-11 KR KR1020207033518A patent/KR102533888B1/en active IP Right Grant
- 2019-04-11 SG SG11202009322QA patent/SG11202009322QA/en unknown
- 2019-04-17 TW TW108113332A patent/TWI734096B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US11670525B2 (en) | 2023-06-06 |
| KR102533888B1 (en) | 2023-05-18 |
| TWI734096B (en) | 2021-07-21 |
| JP7032566B2 (en) | 2022-03-08 |
| US20190326141A1 (en) | 2019-10-24 |
| KR20200135558A (en) | 2020-12-02 |
| WO2019204110A1 (en) | 2019-10-24 |
| JP2021521598A (en) | 2021-08-26 |
| TW201944516A (en) | 2019-11-16 |
| CN112005335B (en) | 2024-04-19 |
| CN112005335A (en) | 2020-11-27 |
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