SG11202006936RA - Cleaning components and methods in a plating system - Google Patents

Cleaning components and methods in a plating system

Info

Publication number
SG11202006936RA
SG11202006936RA SG11202006936RA SG11202006936RA SG11202006936RA SG 11202006936R A SG11202006936R A SG 11202006936RA SG 11202006936R A SG11202006936R A SG 11202006936RA SG 11202006936R A SG11202006936R A SG 11202006936RA SG 11202006936R A SG11202006936R A SG 11202006936RA
Authority
SG
Singapore
Prior art keywords
methods
plating system
cleaning components
cleaning
components
Prior art date
Application number
SG11202006936RA
Other languages
English (en)
Inventor
Kyle M Hanson
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202006936RA publication Critical patent/SG11202006936RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • B08B9/0936—Cleaning containers, e.g. tanks by the force of jets or sprays using rotating jets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
SG11202006936RA 2018-02-01 2019-01-30 Cleaning components and methods in a plating system SG11202006936RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862625277P 2018-02-01 2018-02-01
PCT/US2019/015910 WO2019152555A1 (en) 2018-02-01 2019-01-30 Cleaning components and methods in a plating system

Publications (1)

Publication Number Publication Date
SG11202006936RA true SG11202006936RA (en) 2020-08-28

Family

ID=67391903

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006936RA SG11202006936RA (en) 2018-02-01 2019-01-30 Cleaning components and methods in a plating system

Country Status (6)

Country Link
US (1) US11214890B2 (ko)
KR (1) KR102454873B1 (ko)
CN (1) CN111655910B (ko)
SG (1) SG11202006936RA (ko)
TW (1) TWI723337B (ko)
WO (1) WO2019152555A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022195756A1 (ja) * 2021-03-17 2022-09-22 株式会社荏原製作所 めっき装置及びめっき装置のコンタクト部材洗浄方法
CN113930835A (zh) * 2021-11-25 2022-01-14 博罗县环贸精密电镀有限公司 一种用于电镀槽自动化的清洗装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6186873B1 (en) * 2000-04-14 2001-02-13 International Business Machines Corporation Wafer edge cleaning
JP3284496B2 (ja) * 2000-08-09 2002-05-20 株式会社荏原製作所 めっき装置及びめっき液除去方法
US7029567B2 (en) * 2001-12-21 2006-04-18 Asm Nutool, Inc. Electrochemical edge and bevel cleaning process and system
JP4931605B2 (ja) * 2004-01-26 2012-05-16 アプライド マテリアルズ インコーポレイテッド 半導体基板上へ金属を無電解堆積するための装置
CN101389415A (zh) * 2006-02-22 2009-03-18 赛迈有限公司 单侧工件处理
US8371316B2 (en) * 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
US9309603B2 (en) * 2011-09-14 2016-04-12 Applied Materials, Inc Component cleaning in a metal plating apparatus
WO2013148890A1 (en) * 2012-03-28 2013-10-03 Novellus Systems, Inc. Methods and apparatuses for cleaning electroplating substrate holders
KR102092416B1 (ko) * 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
JP2015062956A (ja) * 2012-09-19 2015-04-09 株式会社荏原製作所 研磨装置
US10416092B2 (en) * 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US9399827B2 (en) * 2013-04-29 2016-07-26 Applied Materials, Inc. Microelectronic substrate electro processing system
KR101620420B1 (ko) * 2014-09-16 2016-05-12 주식회사 포스코 롤 세정장치 및 세정방법
US10047453B2 (en) * 2015-05-26 2018-08-14 Applied Materials, Inc. Electroplating apparatus
US10307798B2 (en) * 2015-08-28 2019-06-04 Taiwan Semiconducter Manufacturing Company Limited Cleaning device for cleaning electroplating substrate holder

Also Published As

Publication number Publication date
KR102454873B1 (ko) 2022-10-13
KR20200104944A (ko) 2020-09-04
TW201941837A (zh) 2019-11-01
WO2019152555A1 (en) 2019-08-08
US20190233966A1 (en) 2019-08-01
CN111655910A (zh) 2020-09-11
US11214890B2 (en) 2022-01-04
CN111655910B (zh) 2022-07-22
TWI723337B (zh) 2021-04-01

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