SG11202006034WA - Handler device for handling substrates - Google Patents
Handler device for handling substratesInfo
- Publication number
- SG11202006034WA SG11202006034WA SG11202006034WA SG11202006034WA SG11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA SG 11202006034W A SG11202006034W A SG 11202006034WA
- Authority
- SG
- Singapore
- Prior art keywords
- handler device
- handling substrates
- substrates
- handling
- handler
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Seal Device For Vehicle (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2020360A NL2020360B1 (en) | 2018-01-31 | 2018-01-31 | Handler device for handling substrates |
PCT/NL2019/050020 WO2019151851A1 (en) | 2018-01-31 | 2019-01-16 | Handler device for handling substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202006034WA true SG11202006034WA (en) | 2020-07-29 |
Family
ID=61628429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202006034WA SG11202006034WA (en) | 2018-01-31 | 2019-01-16 | Handler device for handling substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US11450550B2 (en) |
CN (1) | CN111656509A (en) |
DE (1) | DE112019000622T5 (en) |
NL (1) | NL2020360B1 (en) |
SG (1) | SG11202006034WA (en) |
TW (1) | TWI808124B (en) |
WO (1) | WO2019151851A1 (en) |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4813732A (en) * | 1985-03-07 | 1989-03-21 | Epsilon Technology, Inc. | Apparatus and method for automated wafer handling |
US5235995A (en) * | 1989-03-27 | 1993-08-17 | Semitool, Inc. | Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization |
KR20030016060A (en) * | 2001-08-20 | 2003-02-26 | 미래산업 주식회사 | Picker of Handler for testing Module IC |
US6932558B2 (en) * | 2002-07-03 | 2005-08-23 | Kung Chris Wu | Wafer aligner |
JP2005044882A (en) | 2003-07-24 | 2005-02-17 | Nikon Corp | Transporting device and aligner |
US20050112279A1 (en) * | 2003-11-24 | 2005-05-26 | International Business Machines Corporation | Dynamic release wafer grip and method of use |
JP4502199B2 (en) * | 2004-10-21 | 2010-07-14 | ルネサスエレクトロニクス株式会社 | Etching apparatus and etching method |
TWI447840B (en) * | 2004-11-15 | 2014-08-01 | 尼康股份有限公司 | Substrate transport device, substrate transport method and exposure device |
NL1036025A1 (en) * | 2007-10-10 | 2009-04-15 | Asml Netherlands Bv | Method of transferring a substrate, transfer system and lithographic projection apparatus. |
US20110064545A1 (en) * | 2009-09-16 | 2011-03-17 | Applied Materials, Inc. | Substrate transfer mechanism with preheating features |
US8941968B2 (en) * | 2010-06-08 | 2015-01-27 | Axcelis Technologies, Inc. | Heated electrostatic chuck including mechanical clamp capability at high temperature |
US9401296B2 (en) * | 2011-11-29 | 2016-07-26 | Persimmon Technologies Corporation | Vacuum robot adapted to grip and transport a substrate and method thereof with passive bias |
JP5983080B2 (en) * | 2012-06-20 | 2016-08-31 | セイコーエプソン株式会社 | Robot hand, robot, and gripping mechanism |
US20140107953A1 (en) * | 2012-10-16 | 2014-04-17 | Beckman Coulter, Inc. | Container fill level detection |
US9947572B2 (en) * | 2014-03-26 | 2018-04-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
JP6335103B2 (en) * | 2014-11-14 | 2018-05-30 | 株式会社荏原製作所 | Substrate holding device |
KR101703904B1 (en) | 2015-08-28 | 2017-02-22 | (주)오로스 테크놀로지 | Wafer gripping apparatus and dual wafer stress inspection apparatus having the same |
JP6660628B2 (en) * | 2015-09-29 | 2020-03-11 | 株式会社Screenホールディングス | Substrate holding / rotating apparatus, substrate processing apparatus having the same, and substrate processing method |
US10464218B2 (en) * | 2016-05-15 | 2019-11-05 | B.G. Negev Technologies And Applications Ltd., At Ben-Gurion University | Convertible frictionless to frictional fingertips for a gripper to improve robotic grasp robustness |
JP6964989B2 (en) * | 2017-02-09 | 2021-11-10 | キヤノン株式会社 | Control methods, robot systems, article manufacturing methods, programs, and recording media |
JP6847770B2 (en) * | 2017-05-31 | 2021-03-24 | 株式会社Screenホールディングス | Substrate processing equipment and substrate processing method |
US10759062B2 (en) * | 2017-12-08 | 2020-09-01 | Dishcraft Robotics, Inc. | Article of dishware gripping systems |
JP6995602B2 (en) * | 2017-12-14 | 2022-01-14 | キヤノン株式会社 | Robot hand, robot hand control method, robot device, article manufacturing method, control program and recording medium |
-
2018
- 2018-01-31 NL NL2020360A patent/NL2020360B1/en active
-
2019
- 2019-01-16 SG SG11202006034WA patent/SG11202006034WA/en unknown
- 2019-01-16 US US16/966,097 patent/US11450550B2/en active Active
- 2019-01-16 WO PCT/NL2019/050020 patent/WO2019151851A1/en active Application Filing
- 2019-01-16 CN CN201980009866.XA patent/CN111656509A/en active Pending
- 2019-01-16 DE DE112019000622.3T patent/DE112019000622T5/en active Pending
- 2019-01-30 TW TW108103631A patent/TWI808124B/en active
Also Published As
Publication number | Publication date |
---|---|
US20210028050A1 (en) | 2021-01-28 |
TWI808124B (en) | 2023-07-11 |
US11450550B2 (en) | 2022-09-20 |
WO2019151851A1 (en) | 2019-08-08 |
KR20200111796A (en) | 2020-09-29 |
NL2020360B1 (en) | 2019-08-07 |
DE112019000622T5 (en) | 2020-10-08 |
TW201935607A (en) | 2019-09-01 |
CN111656509A (en) | 2020-09-11 |
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