SG11202005907YA - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- SG11202005907YA SG11202005907YA SG11202005907YA SG11202005907YA SG11202005907YA SG 11202005907Y A SG11202005907Y A SG 11202005907YA SG 11202005907Y A SG11202005907Y A SG 11202005907YA SG 11202005907Y A SG11202005907Y A SG 11202005907YA SG 11202005907Y A SG11202005907Y A SG 11202005907YA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- thermosetting resin
- thermosetting
- composition
- resin
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/09—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
- C08G18/095—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to carbodiimide or uretone-imine groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
- C08K5/357—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017246968 | 2017-12-22 | ||
PCT/JP2018/047382 WO2019124558A1 (en) | 2017-12-22 | 2018-12-21 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202005907YA true SG11202005907YA (en) | 2020-07-29 |
Family
ID=66993416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202005907YA SG11202005907YA (en) | 2017-12-22 | 2018-12-21 | Thermosetting resin composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US20200317913A1 (en) |
EP (1) | EP3730552A4 (en) |
JP (1) | JP6949141B2 (en) |
KR (1) | KR102386167B1 (en) |
CN (1) | CN111511839B (en) |
SG (1) | SG11202005907YA (en) |
TW (1) | TWI796409B (en) |
WO (1) | WO2019124558A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7316551B2 (en) * | 2018-08-09 | 2023-07-28 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board and multilayer printed wiring board |
TWI803069B (en) * | 2021-11-26 | 2023-05-21 | 南亞塑膠工業股份有限公司 | Resin composition |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4110364A (en) * | 1974-03-19 | 1978-08-29 | Mitsubishi Gas Chemical Company, Inc. | Curable resin compositions of cyanate esters |
JP2842152B2 (en) * | 1993-06-11 | 1998-12-24 | 松下電工株式会社 | Thermosetting resin composition, method for producing prepreg, and method for producing laminate |
JP4784066B2 (en) | 2004-10-28 | 2011-09-28 | 三菱瓦斯化学株式会社 | Resin composition and copper clad laminate |
AU2009327883A1 (en) | 2008-12-15 | 2011-06-30 | Teijin Limited | Resin composition containing cyclic carbodimide |
KR101089305B1 (en) | 2008-12-19 | 2011-12-02 | 주식회사 포스코 | Non-directional Electrical Steel Sheets having Low Anisotropy and Manufacturing Method thereof |
CN102558858B (en) * | 2011-12-22 | 2014-03-26 | 云南云天化股份有限公司 | Resin compound for copper-coated laminated boards and prepreg |
JP2015017158A (en) * | 2013-07-09 | 2015-01-29 | 三菱瓦斯化学株式会社 | Curable resin composition, and cured product thereof |
JP6196531B2 (en) | 2013-11-05 | 2017-09-13 | 株式会社日本触媒 | Thermosetting resin composition |
SG11201701852VA (en) * | 2014-09-11 | 2017-04-27 | Teijin Ltd | Thermosetting resin composition |
JP6460693B2 (en) * | 2014-09-19 | 2019-01-30 | 帝人株式会社 | Method for producing cyclic carbodiimide composition |
KR20160039486A (en) | 2014-10-01 | 2016-04-11 | 에스케이하이닉스 주식회사 | Semiconductor apparatus |
JP6602016B2 (en) * | 2015-01-30 | 2019-11-06 | 三菱瓦斯化学株式会社 | Cyanate ester compound, curable resin composition containing the compound, and cured product thereof |
JP6856317B2 (en) * | 2015-02-20 | 2021-04-07 | 株式会社日本触媒 | Curable resin composition and encapsulant made from it |
WO2016132889A1 (en) * | 2015-02-20 | 2016-08-25 | 株式会社日本触媒 | Curable resin composition and sealing material using same |
JP6624445B2 (en) * | 2015-03-27 | 2019-12-25 | 国立大学法人大阪大学 | Semiconductor device |
CN104910621B (en) * | 2015-06-10 | 2017-10-13 | 苏州生益科技有限公司 | Compositions of thermosetting resin and the prepreg and laminate made using it |
JP2017031402A (en) * | 2015-08-04 | 2017-02-09 | 信越化学工業株式会社 | Thermosetting epoxy resin composition |
JP6766360B2 (en) * | 2016-01-15 | 2020-10-14 | 住友ベークライト株式会社 | Resin composition |
JP6423117B2 (en) * | 2017-01-17 | 2018-11-14 | ユニチカ株式会社 | Method for producing bismaleimide |
JP7316551B2 (en) * | 2018-08-09 | 2023-07-28 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board and multilayer printed wiring board |
-
2018
- 2018-12-21 EP EP18891904.7A patent/EP3730552A4/en active Pending
- 2018-12-21 CN CN201880082428.1A patent/CN111511839B/en active Active
- 2018-12-21 SG SG11202005907YA patent/SG11202005907YA/en unknown
- 2018-12-21 US US16/955,148 patent/US20200317913A1/en not_active Abandoned
- 2018-12-21 JP JP2019560603A patent/JP6949141B2/en active Active
- 2018-12-21 KR KR1020207013130A patent/KR102386167B1/en active IP Right Grant
- 2018-12-21 TW TW107146434A patent/TWI796409B/en active
- 2018-12-21 WO PCT/JP2018/047382 patent/WO2019124558A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6949141B2 (en) | 2021-10-13 |
WO2019124558A1 (en) | 2019-06-27 |
KR102386167B1 (en) | 2022-04-12 |
CN111511839A (en) | 2020-08-07 |
TWI796409B (en) | 2023-03-21 |
EP3730552A1 (en) | 2020-10-28 |
US20200317913A1 (en) | 2020-10-08 |
KR20200055799A (en) | 2020-05-21 |
JPWO2019124558A1 (en) | 2020-11-19 |
CN111511839B (en) | 2023-03-31 |
EP3730552A4 (en) | 2021-08-25 |
TW201930384A (en) | 2019-08-01 |
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