SG11202005284WA - Techniques to access a self-selecting memory device - Google Patents

Techniques to access a self-selecting memory device

Info

Publication number
SG11202005284WA
SG11202005284WA SG11202005284WA SG11202005284WA SG11202005284WA SG 11202005284W A SG11202005284W A SG 11202005284WA SG 11202005284W A SG11202005284W A SG 11202005284WA SG 11202005284W A SG11202005284W A SG 11202005284WA SG 11202005284W A SG11202005284W A SG 11202005284WA
Authority
SG
Singapore
Prior art keywords
techniques
self
access
memory device
selecting memory
Prior art date
Application number
SG11202005284WA
Inventor
Innocenzo Tortorelli
Andrea Redaelli
Agostino Pirovano
Fabio Pellizzer
Mario Allegra
Paolo Fantini
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of SG11202005284WA publication Critical patent/SG11202005284WA/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/003Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5678Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0038Power supply circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0061Timing circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0026Bit-line or column circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0028Word-line or row circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • G11C2013/0052Read process characterized by the shape, e.g. form, length, amplitude of the read pulse
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0073Write using bi-directional cell biasing
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0078Write using current through the cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/0092Write characterized by the shape, e.g. form, length, amplitude of the write pulse
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30Resistive cell, memory material aspects
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/71Three dimensional array
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/841Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
SG11202005284WA 2017-12-14 2018-11-29 Techniques to access a self-selecting memory device SG11202005284WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/842,504 US10381075B2 (en) 2017-12-14 2017-12-14 Techniques to access a self-selecting memory device
PCT/US2018/063116 WO2019118192A1 (en) 2017-12-14 2018-11-29 Techniques to access a self-selecting memory device

Publications (1)

Publication Number Publication Date
SG11202005284WA true SG11202005284WA (en) 2020-07-29

Family

ID=66816216

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005284WA SG11202005284WA (en) 2017-12-14 2018-11-29 Techniques to access a self-selecting memory device

Country Status (8)

Country Link
US (4) US10381075B2 (en)
EP (1) EP3724880B1 (en)
JP (1) JP7027546B2 (en)
KR (1) KR102349351B1 (en)
CN (1) CN111465988B (en)
SG (1) SG11202005284WA (en)
TW (3) TWI783201B (en)
WO (1) WO2019118192A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10546632B2 (en) 2017-12-14 2020-01-28 Micron Technology, Inc. Multi-level self-selecting memory device
US10861539B1 (en) * 2019-08-21 2020-12-08 Micron Technology, Inc. Neural network memory
US11593624B2 (en) * 2019-08-23 2023-02-28 Micron Technology, Inc. Self select memory cell based artificial synapse
CN110707209B (en) * 2019-09-03 2022-03-18 华中科技大学 Three-dimensional stacked phase change memory and preparation method thereof
TWI760924B (en) * 2019-12-03 2022-04-11 美商美光科技公司 Methods and systems for accessing memory cells
US11139025B2 (en) 2020-01-22 2021-10-05 International Business Machines Corporation Multi-level cell threshold voltage operation of one-selector-one-resistor structure included in a crossbar array
US11107523B1 (en) * 2020-03-24 2021-08-31 Intel Corporation Multi-level cell (MLC) cross-point memory
US11043277B1 (en) 2020-05-07 2021-06-22 Micron Technology, Inc. Two multi-level memory cells sensed to determine multiple data values
US11133062B1 (en) 2020-05-07 2021-09-28 Micron Technology, Inc. Two memory cells sensed to determine one data value
US11295822B2 (en) 2020-08-14 2022-04-05 Micron Technology, Inc. Multi-state programming of memory cells
US11238945B1 (en) 2020-08-28 2022-02-01 Micron Technology, Inc. Techniques for programming self-selecting memory
KR20220041581A (en) 2020-09-25 2022-04-01 에스케이하이닉스 주식회사 Semiconductor device and operating method of semiconductor device
US11605418B2 (en) * 2020-10-26 2023-03-14 Micron Technology, Inc. Memory device architecture using multiple physical cells per bit to improve read margin and to alleviate the need for managing demarcation read voltages
CN112602152A (en) * 2020-11-09 2021-04-02 长江先进存储产业创新中心有限责任公司 Memory device having memory cells with multiple threshold voltages and methods of forming and operating the same
US11456036B1 (en) 2021-04-02 2022-09-27 Micron Technology, Inc. Predicting and compensating for degradation of memory cells
US11694747B2 (en) 2021-06-03 2023-07-04 Micron Technology, Inc. Self-selecting memory cells configured to store more than one bit per memory cell
US11562790B1 (en) * 2021-06-30 2023-01-24 Micron Technology, Inc. Systems and methods for adaptive self-referenced reads of memory devices
US11984191B2 (en) 2022-05-09 2024-05-14 Micron Technology, Inc. Pulse based multi-level cell programming

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001001161A1 (en) * 1999-06-24 2001-01-04 Sony Corporation Ferroelectric film property measuring device, measuring method therefor and measuring method for semiconductor memory units
ITMI20011812A1 (en) * 2001-08-24 2003-02-24 St Microelectronics Srl METHOD OF READING AND RESTORING DATA CONTAINED IN A FERROELECTRIC MEMORY CELL
US7180767B2 (en) * 2003-06-18 2007-02-20 Macronix International Co., Ltd. Multi-level memory device and methods for programming and reading the same
US7236394B2 (en) * 2003-06-18 2007-06-26 Macronix International Co., Ltd. Transistor-free random access memory
DE102004020575B3 (en) 2004-04-27 2005-08-25 Infineon Technologies Ag Semiconductor memory in crosspoint architecture, includes chalcogenide glass forming memory cell with pn junction to bit line and electrode forming memory cell with word line
US7272037B2 (en) * 2004-10-29 2007-09-18 Macronix International Co., Ltd. Method for programming a multilevel phase change memory device
JP4535439B2 (en) 2005-02-10 2010-09-01 ルネサスエレクトロニクス株式会社 Semiconductor integrated circuit device
US7626859B2 (en) * 2006-02-16 2009-12-01 Samsung Electronics Co., Ltd. Phase-change random access memory and programming method
US7414883B2 (en) * 2006-04-20 2008-08-19 Intel Corporation Programming a normally single phase chalcogenide material for use as a memory or FPLA
KR101374319B1 (en) * 2007-08-24 2014-03-17 삼성전자주식회사 Resistance variable memory device and operation method thereof
JP5159270B2 (en) 2007-11-22 2013-03-06 株式会社東芝 Nonvolatile semiconductor memory device and manufacturing method thereof
WO2009090731A1 (en) * 2008-01-16 2009-07-23 Fujitsu Limited Semiconductor storage device, controlling apparatus and controlling method
TWI517156B (en) * 2008-02-29 2016-01-11 Toshiba Kk Semiconductor memory device
US20090257275A1 (en) * 2008-04-09 2009-10-15 Karpov Ilya V Seasoning phase change memories
US7961495B2 (en) * 2008-10-15 2011-06-14 Ovonyx, Inc. Programmable resistance memory with feedback control
US8031516B2 (en) 2008-12-12 2011-10-04 Stephen Tang Writing memory cells exhibiting threshold switch behavior
US20100284211A1 (en) * 2009-05-05 2010-11-11 Michael Hennessey Multilevel Nonvolatile Memory via Dual Polarity Programming
KR101678886B1 (en) 2009-11-25 2016-11-23 삼성전자주식회사 Multi-level Phase-change Memory Device and Operation Method thereof
JP5708930B2 (en) * 2011-06-30 2015-04-30 ソニー株式会社 STORAGE ELEMENT, MANUFACTURING METHOD THEREOF, AND STORAGE DEVICE
JP2013114737A (en) * 2011-11-28 2013-06-10 Internatl Business Mach Corp <Ibm> Method, computer program and apparatus for programming phase-change memory cell, and phase-change memory device (programming of phase-change memory cells)
US9136307B2 (en) * 2012-02-09 2015-09-15 Micron Technology, Inc. Memory cells and memory cell formation methods using sealing material
US8934280B1 (en) * 2013-02-06 2015-01-13 Crossbar, Inc. Capacitive discharge programming for two-terminal memory cells
US8913425B2 (en) * 2013-03-12 2014-12-16 Intel Corporation Phase change memory mask
JP5868381B2 (en) 2013-12-03 2016-02-24 ウィンボンド エレクトロニクス コーポレーション Semiconductor memory device
US9324423B2 (en) * 2014-05-07 2016-04-26 Micron Technology, Inc. Apparatuses and methods for bi-directional access of cross-point arrays
US9691820B2 (en) 2015-04-24 2017-06-27 Sony Semiconductor Solutions Corporation Block architecture for vertical memory array
US10134470B2 (en) 2015-11-04 2018-11-20 Micron Technology, Inc. Apparatuses and methods including memory and operation of same
WO2017091778A1 (en) * 2015-11-24 2017-06-01 Fu-Chang Hsu 3d vertical memory array cell structures and processes
US20170338282A1 (en) * 2016-05-20 2017-11-23 Intel Corporation Memory module with unpatterned storage material
US9697913B1 (en) 2016-06-10 2017-07-04 Micron Technology, Inc. Ferroelectric memory cell recovery
US10446226B2 (en) 2016-08-08 2019-10-15 Micron Technology, Inc. Apparatuses including multi-level memory cells and methods of operation of same
US9799381B1 (en) * 2016-09-28 2017-10-24 Intel Corporation Double-polarity memory read
US10157670B2 (en) * 2016-10-28 2018-12-18 Micron Technology, Inc. Apparatuses including memory cells and methods of operation of same
US10008665B1 (en) * 2016-12-27 2018-06-26 Intel Corporation Doping of selector and storage materials of a memory cell
US10163982B2 (en) * 2017-03-30 2018-12-25 Intel Corporation Multi-deck memory device with inverted deck
US10424374B2 (en) * 2017-04-28 2019-09-24 Micron Technology, Inc. Programming enhancement in self-selecting memory
US10424728B2 (en) * 2017-08-25 2019-09-24 Micron Technology, Inc. Self-selecting memory cell with dielectric barrier
US10128437B1 (en) * 2017-08-31 2018-11-13 Micron Technology, Inc. Semiconductor structures including memory materials substantially encapsulated with dielectric materials, and related systems and methods

Also Published As

Publication number Publication date
US10381075B2 (en) 2019-08-13
JP7027546B2 (en) 2022-03-01
JP2021507441A (en) 2021-02-22
TW201931377A (en) 2019-08-01
TWI783201B (en) 2022-11-11
US11763886B2 (en) 2023-09-19
EP3724880A1 (en) 2020-10-21
US20190362789A1 (en) 2019-11-28
TWI828033B (en) 2024-01-01
CN111465988A (en) 2020-07-28
TW202030737A (en) 2020-08-16
US10665298B2 (en) 2020-05-26
CN111465988B (en) 2023-09-22
KR20200086383A (en) 2020-07-16
US20220115068A1 (en) 2022-04-14
US11152065B2 (en) 2021-10-19
KR102349351B1 (en) 2022-01-10
US20190189206A1 (en) 2019-06-20
EP3724880B1 (en) 2024-01-03
US20200327940A1 (en) 2020-10-15
EP3724880A4 (en) 2021-08-11
WO2019118192A1 (en) 2019-06-20
TWI743415B (en) 2021-10-21
TW202217826A (en) 2022-05-01

Similar Documents

Publication Publication Date Title
SG11202005284WA (en) Techniques to access a self-selecting memory device
SG11202005174PA (en) Multi-level self-selecting memory device
EP2953134A4 (en) Non-volatile memory device
SG2013069489A (en) Nonvolatile semiconductor memory device
EP3353626A4 (en) Techniques for entry to a lower power state for a memory device
GB201411023D0 (en) Read assist techniques in a memory device
GB201719588D0 (en) Holographic device
IL254101A0 (en) Semiconductor memory device
TWI560856B (en) Semiconductor memory device
SG11202006092XA (en) Memory device
GB201704292D0 (en) Energy storage device
GB2517584B (en) Memory access control in a memory device
GB201704295D0 (en) Energy storage device
GB201616757D0 (en) A dynamic refraction device
ZA201807416B (en) A storage device
GB201720298D0 (en) A storage device
PL2883831T3 (en) Small access device
GB201419992D0 (en) An associative memory learning device
GB2565257B (en) A memory unit
GB201711550D0 (en) Energy storage device
GB201704294D0 (en) Energy storage device
GB201704293D0 (en) Energy storage device
SG11201803277XA (en) Electroentropic memory device
GB201509351D0 (en) A storage device
SG11201503626VA (en) A memory device