SG11202004104PA - Method for producing a sealed electrical connection in a ceramic case and image-intensifier tube comprising such a case - Google Patents

Method for producing a sealed electrical connection in a ceramic case and image-intensifier tube comprising such a case

Info

Publication number
SG11202004104PA
SG11202004104PA SG11202004104PA SG11202004104PA SG11202004104PA SG 11202004104P A SG11202004104P A SG 11202004104PA SG 11202004104P A SG11202004104P A SG 11202004104PA SG 11202004104P A SG11202004104P A SG 11202004104PA SG 11202004104P A SG11202004104P A SG 11202004104PA
Authority
SG
Singapore
Prior art keywords
case
producing
image
electrical connection
intensifier tube
Prior art date
Application number
SG11202004104PA
Inventor
Stéphane Personne
Original Assignee
Photonis France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photonis France filed Critical Photonis France
Publication of SG11202004104PA publication Critical patent/SG11202004104PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/50—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output
    • H01J31/506—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output tubes using secondary emission effect
    • H01J31/507—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output tubes using secondary emission effect using a large number of channels, e.g. microchannel plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2231/00—Cathode ray tubes or electron beam tubes
    • H01J2231/50—Imaging and conversion tubes
    • H01J2231/501—Imaging and conversion tubes including multiplication stage
    • H01J2231/5013—Imaging and conversion tubes including multiplication stage with secondary emission electrodes
    • H01J2231/5016—Michrochannel plates [MCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
SG11202004104PA 2017-11-08 2018-11-06 Method for producing a sealed electrical connection in a ceramic case and image-intensifier tube comprising such a case SG11202004104PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1760475A FR3073320B1 (en) 2017-11-08 2017-11-08 METHOD FOR PRODUCING A SEALED ELECTRICAL CONNECTION IN A CERAMIC HOUSING AND INTENSIFYING IMAGE TUBE COMPRISING SUCH A HOUSING
PCT/FR2018/052732 WO2019092353A1 (en) 2017-11-08 2018-11-06 Method for producing a sealed electrical connection in a ceramic case and image-intensifier tube comprising such a case

Publications (1)

Publication Number Publication Date
SG11202004104PA true SG11202004104PA (en) 2020-06-29

Family

ID=61750226

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004104PA SG11202004104PA (en) 2017-11-08 2018-11-06 Method for producing a sealed electrical connection in a ceramic case and image-intensifier tube comprising such a case

Country Status (14)

Country Link
US (1) US11576258B2 (en)
EP (1) EP3692561A1 (en)
JP (1) JP7245243B2 (en)
KR (1) KR20200085311A (en)
CN (1) CN111316395B (en)
AU (1) AU2018363254B2 (en)
BR (1) BR112020008578A2 (en)
CA (1) CA3081403A1 (en)
FR (1) FR3073320B1 (en)
IL (1) IL274466A (en)
RU (1) RU2020118345A (en)
SG (1) SG11202004104PA (en)
TW (1) TWI798286B (en)
WO (1) WO2019092353A1 (en)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
JPS6333175A (en) * 1985-08-08 1988-02-12 Sony Tektronix Corp Joining method for metallic member
FR2677808B1 (en) * 1991-06-14 1997-06-27 Thomson Composants Militaires DEVICE FOR FIXING A CCD SENSOR ON AN IMAGE ENHANCER TUBE.
US6483231B1 (en) * 1999-05-07 2002-11-19 Litton Systems, Inc. Night vision device and method
US7482571B2 (en) * 2005-08-01 2009-01-27 Itt Manufacturing Enterprises, Inc. Low cost planar image intensifier tube structure
JP5014642B2 (en) * 2006-02-16 2012-08-29 株式会社トクヤマ Leaded metallized ceramic substrate and package
WO2009051178A1 (en) * 2007-10-19 2009-04-23 Nippon Tungsten Co., Ltd. Led package substrate and led package using the same
FR2925218B1 (en) * 2007-12-13 2010-03-12 Photonis France IMAGE INTENSIFIER TUBE WITH REDUCED SIZE AND NIGHT VISION SYSTEM EQUIPPED WITH SUCH A TUBE
TWI407534B (en) * 2008-06-03 2013-09-01 Unimicron Technology Corp Package substrate having double-sided circuits and fabrication method thereof
JP5409432B2 (en) * 2010-02-23 2014-02-05 京セラ株式会社 Electronic component mounting package and electronic device using the same
TWI397190B (en) * 2010-09-30 2013-05-21 Ind Tech Res Inst Method of manufacturing metal wrap through solar cell
JP2012084817A (en) * 2010-10-15 2012-04-26 Panasonic Corp Semiconductor device
US8383505B2 (en) * 2011-04-05 2013-02-26 International Business Machines Corporation Solder ball contact susceptible to lower stress
US9105628B1 (en) * 2012-03-29 2015-08-11 Valery Dubin Through substrate via (TSuV) structures and method of making the same
US20140264848A1 (en) * 2013-03-14 2014-09-18 SK Hynix Inc. Semiconductor package and method for fabricating the same
US10163644B2 (en) * 2014-02-07 2018-12-25 Taiwan Semiconductor Manufacturing Company Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same
US20170217767A1 (en) * 2016-01-29 2017-08-03 Innovative Micro Technology Through substrate vias using solder bumps
US10130302B2 (en) * 2016-06-29 2018-11-20 International Business Machines Corporation Via and trench filling using injection molded soldering

Also Published As

Publication number Publication date
RU2020118345A (en) 2021-12-08
CN111316395A (en) 2020-06-19
AU2018363254B2 (en) 2024-03-28
US11576258B2 (en) 2023-02-07
CN111316395B (en) 2024-01-02
AU2018363254A1 (en) 2020-05-21
TW201923997A (en) 2019-06-16
RU2020118345A3 (en) 2022-01-28
WO2019092353A1 (en) 2019-05-16
IL274466A (en) 2020-06-30
BR112020008578A2 (en) 2020-10-20
FR3073320A1 (en) 2019-05-10
CA3081403A1 (en) 2019-05-16
KR20200085311A (en) 2020-07-14
FR3073320B1 (en) 2019-11-22
EP3692561A1 (en) 2020-08-12
JP2021502668A (en) 2021-01-28
US20200275551A1 (en) 2020-08-27
TWI798286B (en) 2023-04-11
JP7245243B2 (en) 2023-03-23

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