SG11202001932UA - Substrate processing apparatus, method of monitoring abnormality of substrate processing apparatus, and program - Google Patents
Substrate processing apparatus, method of monitoring abnormality of substrate processing apparatus, and programInfo
- Publication number
- SG11202001932UA SG11202001932UA SG11202001932UA SG11202001932UA SG11202001932UA SG 11202001932U A SG11202001932U A SG 11202001932UA SG 11202001932U A SG11202001932U A SG 11202001932UA SG 11202001932U A SG11202001932U A SG 11202001932UA SG 11202001932U A SG11202001932U A SG 11202001932UA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- substrate processing
- program
- monitoring abnormality
- abnormality
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/0227—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions
- G05B23/0235—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions based on a comparison with predetermined threshold or range, e.g. "classical methods", carried out during normal operation; threshold adaptation or choice; when or how to compare with the threshold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31443—Keep track of nc program, recipe program
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32368—Quality control
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/031719 WO2019043934A1 (en) | 2017-09-04 | 2017-09-04 | Substrate processing device, method for monitoring for anomaly in substrate processing device, and program |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001932UA true SG11202001932UA (en) | 2020-04-29 |
Family
ID=65527238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001932UA SG11202001932UA (en) | 2017-09-04 | 2017-09-04 | Substrate processing apparatus, method of monitoring abnormality of substrate processing apparatus, and program |
Country Status (5)
Country | Link |
---|---|
US (1) | US11782425B2 (en) |
JP (1) | JP6833048B2 (en) |
KR (2) | KR102389689B1 (en) |
SG (1) | SG11202001932UA (en) |
WO (1) | WO2019043934A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7304692B2 (en) * | 2018-12-13 | 2023-07-07 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing apparatus |
WO2020194852A1 (en) * | 2019-03-27 | 2020-10-01 | 株式会社島津製作所 | Pump monitoring device, vacuum pump, and product-accumulation diagnosis data processing program |
KR102073789B1 (en) * | 2019-07-05 | 2020-02-05 | 김태화 | Pump back stream preventing structure for semiconductor manufacturing device |
JP7246576B2 (en) * | 2020-07-02 | 2023-03-27 | 東京エレクトロン株式会社 | Information processing method, model generation method, and information processing device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5855841B2 (en) | 1978-06-19 | 1983-12-12 | チエルヤビンスキ− ポリテクニチエスキ− インスチテユ−ト イメニ レニンスコゴ コムソモラ | Metal bar rolling method and rolling roll for it |
US5719796A (en) * | 1995-12-04 | 1998-02-17 | Advanced Micro Devices, Inc. | System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback |
JP2000283056A (en) * | 1999-03-26 | 2000-10-10 | Hitachi Ltd | Vacuum pump abnormality monitoring system |
US7477960B2 (en) * | 2005-02-16 | 2009-01-13 | Tokyo Electron Limited | Fault detection and classification (FDC) using a run-to-run controller |
JP4712462B2 (en) * | 2005-07-11 | 2011-06-29 | 東京エレクトロン株式会社 | Substrate processing monitoring device, substrate processing monitoring system, substrate processing monitoring program, and recording medium |
WO2007086458A1 (en) * | 2006-01-27 | 2007-08-02 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus |
JP5273697B2 (en) * | 2006-08-01 | 2013-08-28 | 東京エレクトロン株式会社 | Server apparatus and program |
CN101359965B (en) * | 2008-09-18 | 2011-04-20 | 中兴通讯股份有限公司 | Method and apparatus optimizing determination level of optical receiver |
US8618807B2 (en) * | 2009-06-30 | 2013-12-31 | Lam Research Corporation | Arrangement for identifying uncontrolled events at the process module level and methods thereof |
JP5490462B2 (en) * | 2009-08-17 | 2014-05-14 | 横河電機株式会社 | Film thickness measuring device |
JP5774331B2 (en) | 2011-03-03 | 2015-09-09 | 株式会社日立国際電気 | Substrate processing system, management apparatus, data analysis method, and data analysis program |
JP5855841B2 (en) | 2011-04-01 | 2016-02-09 | 株式会社日立国際電気 | Management device |
US9255578B2 (en) * | 2012-07-31 | 2016-02-09 | Fisher-Rosemount Systems, Inc. | Systems and methods to monitor pump cavitation |
JP6403577B2 (en) * | 2013-02-05 | 2018-10-10 | 株式会社Kokusai Electric | Cleaning method, semiconductor device manufacturing method, substrate processing apparatus and program, and cleaning end determination method |
JP2015115540A (en) * | 2013-12-13 | 2015-06-22 | 株式会社日立国際電気 | Management apparatus, management method of substrate processing device, substrate processing system and recording medium |
JP2016134585A (en) * | 2015-01-22 | 2016-07-25 | ルネサスエレクトロニクス株式会社 | Semiconductor manufacturing device, diagnosis system for the same, and method of manufacturing semiconductor device |
JP6454611B2 (en) * | 2015-06-19 | 2019-01-16 | 株式会社ジェイ・イー・ティ | Substrate processing system and substrate processing method |
US20200333777A1 (en) * | 2016-09-27 | 2020-10-22 | Tokyo Electron Limited | Abnormality detection method and abnormality detection apparatus |
-
2017
- 2017-09-04 SG SG11202001932UA patent/SG11202001932UA/en unknown
- 2017-09-04 KR KR1020207006145A patent/KR102389689B1/en active IP Right Grant
- 2017-09-04 KR KR1020227013031A patent/KR102519802B1/en active IP Right Grant
- 2017-09-04 WO PCT/JP2017/031719 patent/WO2019043934A1/en active Application Filing
- 2017-09-04 JP JP2019538899A patent/JP6833048B2/en active Active
-
2020
- 2020-03-03 US US16/807,601 patent/US11782425B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102519802B1 (en) | 2023-04-10 |
KR102389689B1 (en) | 2022-04-22 |
JP6833048B2 (en) | 2021-02-24 |
KR20220051437A (en) | 2022-04-26 |
US20200201305A1 (en) | 2020-06-25 |
JPWO2019043934A1 (en) | 2020-03-26 |
WO2019043934A1 (en) | 2019-03-07 |
US11782425B2 (en) | 2023-10-10 |
KR20200029598A (en) | 2020-03-18 |
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