SG11202000234PA - Underlayer film-forming composition, pattern-forming method, and copolymer for forming underlayer film used for pattern formation - Google Patents
Underlayer film-forming composition, pattern-forming method, and copolymer for forming underlayer film used for pattern formationInfo
- Publication number
- SG11202000234PA SG11202000234PA SG11202000234PA SG11202000234PA SG11202000234PA SG 11202000234P A SG11202000234P A SG 11202000234PA SG 11202000234P A SG11202000234P A SG 11202000234PA SG 11202000234P A SG11202000234P A SG 11202000234PA SG 11202000234P A SG11202000234P A SG 11202000234PA
- Authority
- SG
- Singapore
- Prior art keywords
- forming
- underlayer film
- pattern
- copolymer
- pattern formation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08B—POLYSACCHARIDES; DERIVATIVES THEREOF
- C08B37/00—Preparation of polysaccharides not provided for in groups C08B1/00 - C08B35/00; Derivatives thereof
- C08B37/0006—Homoglycans, i.e. polysaccharides having a main chain consisting of one single sugar, e.g. colominic acid
- C08B37/0009—Homoglycans, i.e. polysaccharides having a main chain consisting of one single sugar, e.g. colominic acid alpha-D-Glucans, e.g. polydextrose, alternan, glycogen; (alpha-1,4)(alpha-1,6)-D-Glucans; (alpha-1,3)(alpha-1,4)-D-Glucans, e.g. isolichenan or nigeran; (alpha-1,4)-D-Glucans; (alpha-1,3)-D-Glucans, e.g. pseudonigeran; Derivatives thereof
- C08B37/0012—Cyclodextrin [CD], e.g. cycle with 6 units (alpha), with 7 units (beta) and with 8 units (gamma), large-ring cyclodextrin or cycloamylose with 9 units or more; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F216/38—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an acetal or ketal radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L5/00—Compositions of polysaccharides or of their derivatives not provided for in groups C08L1/00 or C08L3/00
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Emergency Medicine (AREA)
- Metallurgy (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Biochemistry (AREA)
- Materials Engineering (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017137452 | 2017-07-13 | ||
PCT/JP2017/045804 WO2019012716A1 (en) | 2017-07-13 | 2017-12-20 | Underlayer film-forming composition, pattern-forming method, and copolymer for forming underlayer film used for pattern formation |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202000234PA true SG11202000234PA (en) | 2020-02-27 |
Family
ID=65002398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202000234PA SG11202000234PA (en) | 2017-07-13 | 2017-12-20 | Underlayer film-forming composition, pattern-forming method, and copolymer for forming underlayer film used for pattern formation |
Country Status (8)
Country | Link |
---|---|
US (1) | US20210149307A1 (en) |
EP (1) | EP3654102A4 (en) |
JP (1) | JP7184036B2 (en) |
KR (1) | KR20200030528A (en) |
CN (1) | CN110869851A (en) |
SG (1) | SG11202000234PA (en) |
TW (1) | TW201908350A (en) |
WO (1) | WO2019012716A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019163975A1 (en) * | 2018-02-26 | 2019-08-29 | 王子ホールディングス株式会社 | Lower layer film-forming composition, pattern forming method, copolymer, and monomer for lower layer film-forming composition |
TWI708124B (en) * | 2019-03-11 | 2020-10-21 | 日商東芝記憶體股份有限公司 | Pattern forming material, pattern forming composition, pattern forming method, and manufacturing method of semiconductor device |
WO2021002350A1 (en) * | 2019-07-02 | 2021-01-07 | 王子ホールディングス株式会社 | Resist material and method for forming pattern |
KR20220029663A (en) * | 2019-07-02 | 2022-03-08 | 오지 홀딩스 가부시키가이샤 | Pattern forming method, resist material, and pattern forming apparatus |
JP6801829B1 (en) * | 2019-07-02 | 2020-12-16 | 王子ホールディングス株式会社 | Resist material and pattern formation method |
JP7338271B2 (en) * | 2019-07-02 | 2023-09-05 | 王子ホールディングス株式会社 | Resist material and pattern forming method |
CN115917434A (en) * | 2020-06-12 | 2023-04-04 | 日产化学株式会社 | Protective film-forming composition containing diol structure |
US20220197141A1 (en) * | 2020-12-17 | 2022-06-23 | Rohm And Haas Electronic Materials Llc | Photoresist underlayer compositions and patterning methods |
US20220197142A1 (en) * | 2020-12-17 | 2022-06-23 | Rohm And Haas Electronic Materials Llc | Photoresist underlayer compositions and patterning methods |
JP7279091B2 (en) * | 2021-01-06 | 2023-05-22 | 株式会社事業革新パートナーズ | Container or flat plate molding, resin composition and method for producing resin pellets thereof |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2990284B2 (en) * | 1988-10-27 | 1999-12-13 | 日本精化株式会社 | Glycoside derivative, glycoside derivative-containing polymer and its production |
GB9900315D0 (en) * | 1999-01-07 | 1999-02-24 | Ici Plc | Coating compositions |
TWI358612B (en) * | 2003-08-28 | 2012-02-21 | Nissan Chemical Ind Ltd | Polyamic acid-containing composition for forming a |
TWI360726B (en) | 2003-10-30 | 2012-03-21 | Nissan Chemical Ind Ltd | Sublayer coating-forming composition containing de |
JP4832955B2 (en) * | 2005-06-07 | 2011-12-07 | 信越化学工業株式会社 | Resist underlayer film material and pattern forming method using the same |
JP4706851B2 (en) | 2006-03-24 | 2011-06-22 | 日産化学工業株式会社 | Lithographic underlayer film forming composition comprising cyclodextrin containing inclusion molecules |
JP4724072B2 (en) * | 2006-08-17 | 2011-07-13 | 富士通株式会社 | Resist pattern forming method, semiconductor device and manufacturing method thereof |
JP5545429B2 (en) * | 2008-02-20 | 2014-07-09 | 日産化学工業株式会社 | Photocured film forming composition and photocured film forming method |
WO2011021398A1 (en) * | 2009-08-21 | 2011-02-24 | 出光興産株式会社 | Sugar derivative having a polymerizable group, and resist material using said sugar derivative |
US8383319B2 (en) * | 2009-08-25 | 2013-02-26 | Eastman Kodak Company | Lithographic printing plate precursors and stacks |
US8871512B2 (en) * | 2010-10-27 | 2014-10-28 | Empire Technology Development Llc | Biocompatible polymerizable acrylate products and methods |
JP2012100546A (en) | 2010-11-08 | 2012-05-31 | Oji Paper Co Ltd | Method for producing xylooligosaccharide and acidic xylooligosaccharide |
JP2012180424A (en) | 2011-02-28 | 2012-09-20 | Univ Of Tokyo | Xylan derivative precursor, xylan derivative, xylan graft copolymer, method of producing these, and polymer molded product |
JP5910361B2 (en) * | 2011-07-14 | 2016-04-27 | 信越化学工業株式会社 | Pattern forming method and resist composition |
JP5776400B2 (en) * | 2011-07-20 | 2015-09-09 | Jsr株式会社 | Composition for forming metal oxide film |
JP6120590B2 (en) | 2013-02-01 | 2017-04-26 | 国立大学法人京都大学 | Modified nanocellulose and resin composition containing modified nanocellulose |
JP6497143B2 (en) | 2015-03-13 | 2019-04-10 | Jsr株式会社 | Resist underlayer film forming composition and pattern forming method using the composition |
US9958781B2 (en) | 2015-04-24 | 2018-05-01 | Jsr Corporation | Method for film formation, and pattern-forming method |
US10982032B2 (en) * | 2015-12-25 | 2021-04-20 | Oji Holdings Corporation | Self-assembly composition for pattern formation and pattern forming method |
EP3533524A4 (en) * | 2016-10-28 | 2020-07-15 | Oji Holdings Corporation | Pattern forming method, base agent and laminate |
-
2017
- 2017-12-20 SG SG11202000234PA patent/SG11202000234PA/en unknown
- 2017-12-20 WO PCT/JP2017/045804 patent/WO2019012716A1/en unknown
- 2017-12-20 JP JP2019529437A patent/JP7184036B2/en active Active
- 2017-12-20 CN CN201780092950.3A patent/CN110869851A/en active Pending
- 2017-12-20 TW TW106144862A patent/TW201908350A/en unknown
- 2017-12-20 KR KR1020207000436A patent/KR20200030528A/en not_active Application Discontinuation
- 2017-12-20 US US16/630,193 patent/US20210149307A1/en not_active Abandoned
- 2017-12-20 EP EP17917791.0A patent/EP3654102A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR20200030528A (en) | 2020-03-20 |
JPWO2019012716A1 (en) | 2020-05-21 |
CN110869851A (en) | 2020-03-06 |
WO2019012716A1 (en) | 2019-01-17 |
EP3654102A4 (en) | 2021-04-14 |
JP7184036B2 (en) | 2022-12-06 |
TW201908350A (en) | 2019-03-01 |
EP3654102A1 (en) | 2020-05-20 |
US20210149307A1 (en) | 2021-05-20 |
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