SG11201903413UA - Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates - Google Patents

Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates

Info

Publication number
SG11201903413UA
SG11201903413UA SG11201903413UA SG11201903413UA SG11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA
Authority
SG
Singapore
Prior art keywords
transport enclosure
tightness
semiconductor substrates
leak
monitoring
Prior art date
Application number
SG11201903413UA
Inventor
Bertrand Bellet
Julien Bounouar
Nicolas Chapel
Original Assignee
Pfeiffer Vacuum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pfeiffer Vacuum filed Critical Pfeiffer Vacuum
Publication of SG11201903413UA publication Critical patent/SG11201903413UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00—Investigating fluid-tightness of structures
    • G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
    • G01M3/32—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators
    • G01M3/3236—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators by monitoring the interior space of the containers
    • G01M3/3272—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators by monitoring the interior space of the containers for verifying the internal pressure of closed containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The invention relates to a device (1) for controlling the tightness of at least one transport enclosure (2) for the conveyance and atmospheric storage of semiconductor substrates (3), said transport enclosure (2) comprising a rigid 5 casing (4) having an opening (4), a removable door (6) enabling the opening (5) to be closed, and at least two ventilation ports (8, 9). The control device (1) comprises at least one interface (20) configured to be coupled to the transport enclosure (2), the interface (20) comprising: - at least two connecting heads (23, 24), at least one connecting 10 head being formed by a measurement head (23) configured to engage in a ventilation port (8) of the transport enclosure (2), the measurement head (23) comprising: - a projecting end piece (29), opening through at least one aperture (30), and 15 - a peripheral sealing element (31) surrounding the end piece (29), the peripheral sealing element (31) being arranged upstream of the at least one aperture (30), - all the ventilation ports (8, 9) of the transport enclosure (2) being coupled to a connecting head (23, 24) of the interface 20 (20). The present invention also relates to a method for controlling the tightness of at least one transport enclosure. Figure for the abstract: 1
SG11201903413UA 2016-11-07 2017-11-06 Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates SG11201903413UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1660750A FR3058562B1 (en) 2016-11-07 2016-11-07 DEVICE AND METHOD FOR CONTROLLING THE SEALING OF A TRANSPORT ENCLOSURE FOR CONVEYING AND ATMOSPHERIC STORAGE OF SEMICONDUCTOR SUBSTRATES
PCT/EP2017/078367 WO2018083312A1 (en) 2016-11-07 2017-11-06 Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates

Publications (1)

Publication Number Publication Date
SG11201903413UA true SG11201903413UA (en) 2019-05-30

Family

ID=57796603

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201903413UA SG11201903413UA (en) 2016-11-07 2017-11-06 Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates
SG10201913336YA SG10201913336YA (en) 2016-11-07 2017-11-06 Device and method for controlling the tightness of a transport enclosure for the conveyance and atmospheric storage of semiconductor substrates

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201913336YA SG10201913336YA (en) 2016-11-07 2017-11-06 Device and method for controlling the tightness of a transport enclosure for the conveyance and atmospheric storage of semiconductor substrates

Country Status (9)

Country Link
US (1) US11430681B2 (en)
EP (1) EP3535780B1 (en)
JP (1) JP7041144B2 (en)
KR (1) KR102436631B1 (en)
CN (1) CN109937473A (en)
FR (1) FR3058562B1 (en)
SG (2) SG11201903413UA (en)
TW (1) TWI753040B (en)
WO (1) WO2018083312A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7422577B2 (en) * 2020-03-23 2024-01-26 平田機工株式会社 Load port and control method
EP4356420A1 (en) * 2021-06-14 2024-04-24 Entegris, Inc. Substrate container with door gasket
US20230369087A1 (en) * 2022-05-10 2023-11-16 Entegris, Inc. Substrate container with door gasket

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003315197A (en) * 2002-04-26 2003-11-06 Trecenti Technologies Inc Inspection method and inspection device for wafer storage device, and manufacturing method of semiconductor device
FR2874744B1 (en) * 2004-08-30 2006-11-24 Cit Alcatel VACUUM INTERFACE BETWEEN A MINI-ENVIRONMENT BOX AND EQUIPMENT
US8074597B2 (en) * 2006-01-11 2011-12-13 Applied Materials, Inc. Methods and apparatus for purging a substrate carrier
JP2007227800A (en) 2006-02-24 2007-09-06 Hitachi Kokusai Electric Inc Substrate storage and transport container, and purge system of substrate storage and transport container
TW201010916A (en) * 2008-09-12 2010-03-16 Gudeng Prec Industral Co Ltd Wafer container with roller
JP5155848B2 (en) * 2008-12-18 2013-03-06 日本ケンブリッジフィルター株式会社 N2 purge device for FOUP
TWI585892B (en) * 2010-09-17 2017-06-01 昕芙旎雅股份有限公司 Cassette adapter
JP5815959B2 (en) 2011-02-08 2015-11-17 近藤工業株式会社 Nozzle unit in N2 gas purge device
JP6131534B2 (en) * 2012-06-11 2017-05-24 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port, mounting table, stocker
TWM456581U (en) * 2012-11-20 2013-07-01 Ming-Sheng Chen Inflatable cleanup system of wafer / mask sealed carrier
JP6132036B2 (en) 2014-02-07 2017-05-24 村田機械株式会社 Purge apparatus and purge method
JP6556148B2 (en) * 2014-09-05 2019-08-07 ローツェ株式会社 Load port and load port atmosphere replacement method
JP6459682B2 (en) * 2015-03-20 2019-01-30 Tdk株式会社 Gas purge device, load port device and gas purge method

Also Published As

Publication number Publication date
US11430681B2 (en) 2022-08-30
KR102436631B1 (en) 2022-08-25
FR3058562B1 (en) 2019-05-10
US20200051844A1 (en) 2020-02-13
FR3058562A1 (en) 2018-05-11
JP2019533907A (en) 2019-11-21
SG10201913336YA (en) 2020-02-27
KR20190073567A (en) 2019-06-26
JP7041144B2 (en) 2022-03-23
TWI753040B (en) 2022-01-21
EP3535780B1 (en) 2024-03-27
WO2018083312A1 (en) 2018-05-11
CN109937473A (en) 2019-06-25
EP3535780A1 (en) 2019-09-11
TW201834118A (en) 2018-09-16

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