SG11201903413UA - Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates - Google Patents
Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substratesInfo
- Publication number
- SG11201903413UA SG11201903413UA SG11201903413UA SG11201903413UA SG11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA SG 11201903413U A SG11201903413U A SG 11201903413UA
- Authority
- SG
- Singapore
- Prior art keywords
- transport enclosure
- tightness
- semiconductor substrates
- leak
- monitoring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/26—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
- G01M3/32—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators
- G01M3/3236—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators by monitoring the interior space of the containers
- G01M3/3272—Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators by monitoring the interior space of the containers for verifying the internal pressure of closed containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to a device (1) for controlling the tightness of at least one transport enclosure (2) for the conveyance and atmospheric storage of semiconductor substrates (3), said transport enclosure (2) comprising a rigid 5 casing (4) having an opening (4), a removable door (6) enabling the opening (5) to be closed, and at least two ventilation ports (8, 9). The control device (1) comprises at least one interface (20) configured to be coupled to the transport enclosure (2), the interface (20) comprising: - at least two connecting heads (23, 24), at least one connecting 10 head being formed by a measurement head (23) configured to engage in a ventilation port (8) of the transport enclosure (2), the measurement head (23) comprising: - a projecting end piece (29), opening through at least one aperture (30), and 15 - a peripheral sealing element (31) surrounding the end piece (29), the peripheral sealing element (31) being arranged upstream of the at least one aperture (30), - all the ventilation ports (8, 9) of the transport enclosure (2) being coupled to a connecting head (23, 24) of the interface 20 (20). The present invention also relates to a method for controlling the tightness of at least one transport enclosure. Figure for the abstract: 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1660750A FR3058562B1 (en) | 2016-11-07 | 2016-11-07 | DEVICE AND METHOD FOR CONTROLLING THE SEALING OF A TRANSPORT ENCLOSURE FOR CONVEYING AND ATMOSPHERIC STORAGE OF SEMICONDUCTOR SUBSTRATES |
PCT/EP2017/078367 WO2018083312A1 (en) | 2016-11-07 | 2017-11-06 | Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201903413UA true SG11201903413UA (en) | 2019-05-30 |
Family
ID=57796603
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201913336YA SG10201913336YA (en) | 2016-11-07 | 2017-11-06 | Device and method for controlling the tightness of a transport enclosure for the conveyance and atmospheric storage of semiconductor substrates |
SG11201903413UA SG11201903413UA (en) | 2016-11-07 | 2017-11-06 | Device and method for monitoring the leak-tightness of a transport enclosure for the atmospheric conveyance and storage of semiconductor substrates |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201913336YA SG10201913336YA (en) | 2016-11-07 | 2017-11-06 | Device and method for controlling the tightness of a transport enclosure for the conveyance and atmospheric storage of semiconductor substrates |
Country Status (9)
Country | Link |
---|---|
US (1) | US11430681B2 (en) |
EP (1) | EP3535780B1 (en) |
JP (1) | JP7041144B2 (en) |
KR (1) | KR102436631B1 (en) |
CN (1) | CN109937473A (en) |
FR (1) | FR3058562B1 (en) |
SG (2) | SG10201913336YA (en) |
TW (1) | TWI753040B (en) |
WO (1) | WO2018083312A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7422577B2 (en) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | Load port and control method |
EP4356420A1 (en) * | 2021-06-14 | 2024-04-24 | Entegris, Inc. | Substrate container with door gasket |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003315197A (en) * | 2002-04-26 | 2003-11-06 | Trecenti Technologies Inc | Inspection method and inspection device for wafer storage device, and manufacturing method of semiconductor device |
FR2874744B1 (en) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | VACUUM INTERFACE BETWEEN A MINI-ENVIRONMENT BOX AND EQUIPMENT |
CN101370616B (en) * | 2006-01-11 | 2011-04-27 | 应用材料股份有限公司 | Substrate carrier, loading port and methods for purging a substrate carrier |
JP2007227800A (en) * | 2006-02-24 | 2007-09-06 | Hitachi Kokusai Electric Inc | Substrate storage and transport container, and purge system of substrate storage and transport container |
TW201010916A (en) * | 2008-09-12 | 2010-03-16 | Gudeng Prec Industral Co Ltd | Wafer container with roller |
JP5155848B2 (en) * | 2008-12-18 | 2013-03-06 | 日本ケンブリッジフィルター株式会社 | N2 purge device for FOUP |
TWI585892B (en) * | 2010-09-17 | 2017-06-01 | 昕芙旎雅股份有限公司 | Cassette adapter |
JP5815959B2 (en) * | 2011-02-08 | 2015-11-17 | 近藤工業株式会社 | Nozzle unit in N2 gas purge device |
JP6131534B2 (en) * | 2012-06-11 | 2017-05-24 | シンフォニアテクノロジー株式会社 | Purge nozzle unit, load port, mounting table, stocker |
TWM456581U (en) * | 2012-11-20 | 2013-07-01 | Ming-Sheng Chen | Inflatable cleanup system of wafer / mask sealed carrier |
US10438829B2 (en) * | 2014-02-07 | 2019-10-08 | Murata Machinery, Ltd. | Purge device and purge method |
JP6556148B2 (en) * | 2014-09-05 | 2019-08-07 | ローツェ株式会社 | Load port and load port atmosphere replacement method |
JP6459682B2 (en) * | 2015-03-20 | 2019-01-30 | Tdk株式会社 | Gas purge device, load port device and gas purge method |
-
2016
- 2016-11-07 FR FR1660750A patent/FR3058562B1/en active Active
-
2017
- 2017-10-27 TW TW106137250A patent/TWI753040B/en active
- 2017-11-06 SG SG10201913336YA patent/SG10201913336YA/en unknown
- 2017-11-06 KR KR1020197016260A patent/KR102436631B1/en active IP Right Grant
- 2017-11-06 WO PCT/EP2017/078367 patent/WO2018083312A1/en unknown
- 2017-11-06 CN CN201780068496.8A patent/CN109937473A/en active Pending
- 2017-11-06 EP EP17797603.2A patent/EP3535780B1/en active Active
- 2017-11-06 JP JP2019522564A patent/JP7041144B2/en active Active
- 2017-11-06 SG SG11201903413UA patent/SG11201903413UA/en unknown
- 2017-11-06 US US16/338,783 patent/US11430681B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI753040B (en) | 2022-01-21 |
EP3535780A1 (en) | 2019-09-11 |
JP2019533907A (en) | 2019-11-21 |
US20200051844A1 (en) | 2020-02-13 |
US11430681B2 (en) | 2022-08-30 |
KR102436631B1 (en) | 2022-08-25 |
CN109937473A (en) | 2019-06-25 |
FR3058562B1 (en) | 2019-05-10 |
EP3535780B1 (en) | 2024-03-27 |
JP7041144B2 (en) | 2022-03-23 |
KR20190073567A (en) | 2019-06-26 |
FR3058562A1 (en) | 2018-05-11 |
WO2018083312A1 (en) | 2018-05-11 |
TW201834118A (en) | 2018-09-16 |
SG10201913336YA (en) | 2020-02-27 |
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