SG11201809359QA - Dispensing head having a nozzle heater device, system and method - Google Patents

Dispensing head having a nozzle heater device, system and method

Info

Publication number
SG11201809359QA
SG11201809359QA SG11201809359QA SG11201809359QA SG11201809359QA SG 11201809359Q A SG11201809359Q A SG 11201809359QA SG 11201809359Q A SG11201809359Q A SG 11201809359QA SG 11201809359Q A SG11201809359Q A SG 11201809359QA SG 11201809359Q A SG11201809359Q A SG 11201809359QA
Authority
SG
Singapore
Prior art keywords
international
nozzle
new york
heater device
pct
Prior art date
Application number
SG11201809359QA
Inventor
Koenraad Alexander Gieskes
Philip Michael Castoro
Kevin James O'reilly
Original Assignee
Universal Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Instruments Corp filed Critical Universal Instruments Corp
Publication of SG11201809359QA publication Critical patent/SG11201809359QA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/007—Heaters using a particular layout for the resistive material or resistive elements using multiple electrically connected resistive elements or resistive zones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Detergent Compositions (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 30 November 2017 (30.11.2017) WIPO I PCT (51) International Patent Classification: H05K 13/04 (2006.01) HOlL 21/02 (2006.01) B65G 47/91 (2006.01) H05K 3/30 (2006.01) (21) International Application Number: PCT/US2017/033227 (22) International Filing Date: 18 May 2017 (18.05.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/342,714 27 May 2016 (27.05.2016) US (71) Applicant: UNIVERSAL INSTRUMENTS CORPO- RATION [US/US]; 33 Broome Corporate Parkway, Con- klin, New York 13748 (US). (72) Inventors: GIESKES, Koenraad Alexander; 48 Hanson Road, Deposit, New York 13754 (US). CASTORO, Philip Michael; 46 Pembroke Dr., Endicott, New York 13760 (US). O'REILLY, Kevin James; 6 Bonita Dr., Bingham- ton, New York 13904 (US). (74) Agent: BARANOWSKI, Victor J.; Schmeiser, Olsen & Watts, LLP, 22 Century Hill Drive, Suite 302, Latham, New York 12110 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (54) Title: DISPENSING HEAD HAVING A NOZZLE HEATER DEVICE, SYSTEM AND METHOD (57) : Disclosed is a dispensing head that includes a first spindle 10 configured for movement in a vertical direction, a first nozzle operatively attached to the spindle, a heater device removably attachable to the dispens- 20 ing head. The heater device includes a heat source and an opening config- 42 46 ured to receive the first nozzle. The heat source is configured to heat the 44 a . first nozzle above an ambient temperature. An assembly system is further disclosed, along with a method of heating a nozzle. 0111111010 0111 inn III DID IIl Oil ioo Imo oimIE (10) International Publication Number WO 2017/205167 Al 32a Figure 1 [Continued on next page] WO 2017/205167 Al MIDEDIM01101 DIDIRMEM0010101g1111111111111111111111111111111111111 Published: — with international search report (Art. 21(3))
SG11201809359QA 2016-05-27 2017-05-18 Dispensing head having a nozzle heater device, system and method SG11201809359QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662342714P 2016-05-27 2016-05-27
PCT/US2017/033227 WO2017205167A1 (en) 2016-05-27 2017-05-18 Dispensing head having a nozzle heater device, system and method

Publications (1)

Publication Number Publication Date
SG11201809359QA true SG11201809359QA (en) 2018-12-28

Family

ID=60412922

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201809359QA SG11201809359QA (en) 2016-05-27 2017-05-18 Dispensing head having a nozzle heater device, system and method

Country Status (9)

Country Link
US (1) US10893638B2 (en)
JP (1) JP6933664B2 (en)
KR (1) KR102326610B1 (en)
CN (1) CN109076729B (en)
DE (1) DE112017002691T5 (en)
MY (1) MY201991A (en)
SE (1) SE545308C2 (en)
SG (1) SG11201809359QA (en)
WO (1) WO2017205167A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE545308C2 (en) 2016-05-27 2023-06-27 Universal Instruments Corp Dispensing head having a nozzle heater device, system and method
JP7406409B2 (en) * 2020-03-10 2023-12-27 株式会社Fuji component mounting machine

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810728A (en) * 1972-09-15 1974-05-14 A Jacobs Injection molding machine
US4189137A (en) 1978-04-14 1980-02-19 The Mccall Pattern Company Vacuum pickup device
US4611397A (en) 1984-10-09 1986-09-16 Universal Instruments Corporation Pick and place method and apparatus for handling electrical components
US4759124A (en) 1987-04-28 1988-07-26 Universal Instruments Corp. Method and apparatus for controlling component pickup and placement pressures
US4763941A (en) 1987-06-11 1988-08-16 Unisys Corporation Automatic vacuum gripper
US4799854A (en) 1987-07-20 1989-01-24 Hughes Aircraft Company Rotatable pick and place vacuum sense head for die bonding apparatus
US4872258A (en) 1988-09-22 1989-10-10 Universal Instruments Corporation Pick and place method and apparatus
USRE35027E (en) 1988-09-22 1995-08-29 Delaware Capital Formation, Inc. Pick and place method and apparatus
JPH07105637B2 (en) 1990-05-31 1995-11-13 三洋電機株式会社 Parts mounting device
US5029383A (en) 1990-06-07 1991-07-09 Universal Instruments Corporation Articulating tip for pick and place head
US5252807A (en) 1990-07-02 1993-10-12 George Chizinsky Heated plate rapid thermal processor
JPH05102383A (en) 1991-10-09 1993-04-23 Nec Corp Pin-erecting device
JPH05218689A (en) 1992-02-04 1993-08-27 Sanyo Electric Co Ltd Component mounter
US5581909A (en) 1992-08-05 1996-12-10 Toray Industries, Inc. Heat treatment apparatus for yarn
US5572785A (en) 1994-07-27 1996-11-12 Eastman Kodak Company Apparatus and method for automated assembly of precision components
US5747102A (en) * 1995-11-16 1998-05-05 Nordson Corporation Method and apparatus for dispensing small amounts of liquid material
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
US5909837A (en) 1997-05-09 1999-06-08 Quad Systems Corporation Contactless bonding tool heater
FR2782313B1 (en) 1998-08-13 2000-11-24 Opema GRIPPING DEVICE
JP4357651B2 (en) * 1999-07-19 2009-11-04 ヤマハ発動機株式会社 Surface mount machine
EP1260127B1 (en) 2000-02-22 2004-03-31 Matsushita Electric Industrial Co., Ltd. Suction nozzle for holding component by suction
US6260583B1 (en) * 2000-05-24 2001-07-17 Illinois Tool Works Inc. Segmented stackable head design
US6499631B2 (en) * 2001-01-26 2002-12-31 Illinois Tool Works Inc. Hot melt adhesive applicator
ES2224053T3 (en) 2001-02-20 2005-03-01 Pichler, Ernst PROCEDURE FOR REMOVING A CABLE SOUL FROM A CABLE COVER.
US6625878B2 (en) 2001-09-05 2003-09-30 Delaware Capital Formation Method and apparatus for improving component placement in a component pick up and place machine
US7374217B2 (en) 2001-09-28 2008-05-20 Parker-Hannifin Corporation Two way non leaking flow valve with full-open capability
US7617951B2 (en) * 2002-01-28 2009-11-17 Nordson Corporation Compact heated air manifolds for adhesive application
US6772813B2 (en) 2002-12-23 2004-08-10 Freescale Semiconductor, Inc. Removable heated end effector
KR100494441B1 (en) * 2003-03-14 2005-06-14 주식회사 프로텍 A dispenser head able to control a rotation and up-down of a poston in a high-speed, fixed-amount, precise discharge type
JP4239881B2 (en) * 2003-06-03 2009-03-18 パナソニック株式会社 Electronic component mounting apparatus and electronic component mounting method
US6837293B1 (en) 2003-06-16 2005-01-04 Mok Swee M Heated nozzle assembly
EP1654072A4 (en) * 2003-07-14 2007-10-03 Nordson Corp Apparatus and method for dispensing discrete amounts of viscous material
US7190891B2 (en) * 2004-01-17 2007-03-13 Brian Leonard Verrilli Heating-cooling system for a nozzle
JP4372605B2 (en) 2004-04-15 2009-11-25 パナソニック株式会社 Electronic component mounting apparatus and electronic component mounting method
KR101185794B1 (en) 2004-06-28 2012-10-02 쿄세라 코포레이션 Wafer heating equipment and semiconductor manufacturing equipment
JP4399869B2 (en) 2007-07-30 2010-01-20 Ｔｄｋ株式会社 Mounting device that mounts mounted components on mounted components using ultrasonic vibration
WO2009060560A1 (en) * 2007-11-06 2009-05-14 Panasonic Corporation Component mounting apparatus, component mounting head, and component mounting method
JP5235430B2 (en) * 2008-01-30 2013-07-10 三菱電機株式会社 Molten metal discharge device
JP5533480B2 (en) * 2010-09-15 2014-06-25 富士通株式会社 Electronic component mounting apparatus and mounting method
KR101613196B1 (en) 2010-11-17 2016-04-19 한화테크윈 주식회사 Method for flip chip mounting and flip chip mounting device
JP5875229B2 (en) * 2011-01-31 2016-03-02 富士機械製造株式会社 FIXED DEVICE FIXED BODY, PARTS HOLDING HEAD, PARTICEL FEEDER, AND DEVICE INSTALLED WITH THE FIXED DEVICE FIXED BODY, AND PRODUCTION WORKING MACHINE COMPRISING THE FIXED DEVICE FIXED BODY
CN202006331U (en) 2011-03-18 2011-10-12 杨凯 Heating and surface mounting integrated hot air head
JP2013074240A (en) * 2011-09-29 2013-04-22 Tokyo Electron Ltd Three-dimensional mounting apparatus
US20130267062A1 (en) * 2012-04-05 2013-10-10 Infineon Technologies Ag Dispensing Tool
US9480996B2 (en) * 2012-09-18 2016-11-01 Ilinois Tool Works Inc. Fluid dispensing system with nozzle heater
US20150174824A1 (en) * 2013-12-19 2015-06-25 Karl Joseph Gifford Systems and methods for 3D printing with multiple exchangeable printheads
CN203912354U (en) 2014-04-10 2014-10-29 深圳市无疆科技有限公司 Multi-point heating and material-fetching manipulator
WO2017056291A1 (en) * 2015-10-01 2017-04-06 ヤマハ発動機株式会社 Rotary head, and surface mounting machine
SE545308C2 (en) 2016-05-27 2023-06-27 Universal Instruments Corp Dispensing head having a nozzle heater device, system and method
US10500604B2 (en) * 2018-02-09 2019-12-10 Nordson Corporation Liquid adhesive dispensing system

Also Published As

Publication number Publication date
JP2019520698A (en) 2019-07-18
WO2017205167A1 (en) 2017-11-30
SE1851350A1 (en) 2018-10-30
US20190141868A1 (en) 2019-05-09
CN109076729A (en) 2018-12-21
DE112017002691T5 (en) 2019-02-14
US10893638B2 (en) 2021-01-12
CN109076729B (en) 2021-06-15
KR20190012149A (en) 2019-02-08
JP6933664B2 (en) 2021-09-08
MY201991A (en) 2024-03-27
KR102326610B1 (en) 2021-11-15
SE545308C2 (en) 2023-06-27

Similar Documents

Publication Publication Date Title
SG11201810600WA (en) Fxr (nr1h4) modulating compounds
SG11201908719QA (en) Biomarkers and car t cell therapies with enhanced efficacy
SG11201900269XA (en) Channel sensing for independent links
SG11201808724SA (en) Anti-tim-3 antibodies and compositions
SG11201808708RA (en) Heterocyclic amides useful as protein modulators
SG11201805709RA (en) Anti-pro/latent myostatin antibodies and methods of use thereof
SG11201811468UA (en) Fluid control
SG11201805422WA (en) Multivalent and multispecific ox40-binding fusion proteins
SG11201805532XA (en) Multivalent and multispecific 41bb-binding fusion proteins
SG11201804086VA (en) Methods and compositions for nucleic acid analysis
SG11201804528YA (en) Multi-passenger ride vehicle
SG11201900746RA (en) Engineered antibodies and other fc-domain containing molecules with enhanced agonism and effector functions
SG11201908326YA (en) Methods of treating neurodegenerative diseases
SG11201803676PA (en) Site specific her2 antibody drug conjugates
SG11201810525XA (en) Anti-gitr antibodies and uses thereof
SG11201809782YA (en) A remotely piloted aircraft system
SG11201900904PA (en) Methods for cross coupling
SG11201810429UA (en) Anti-cd19 antibody formulations
SG11201901228QA (en) Chromatography method for quantifying a non-ionic surfactant in a composition comprising the non-ionic surfactant and a polypeptide
SG11201805769UA (en) Universal access to an electronic wallet
SG11201901873PA (en) Tablet compositions
SG11201903602RA (en) Use of beta-catenin as a biomarker for treating cancers using anti-dkk-1 antibody
SG11201906663VA (en) Bone-targeting antibodies
SG11201907369TA (en) Anti-factor d antibodies and uses thereof
SG11201901901VA (en) Techniques for new radio frame structures for data transmission