JPH05218689A - Component mounter - Google Patents

Abstract

PURPOSE:To eliminate the effect of a component absorbed state, and reduce the size of a component mounting device in an attempt to mount components on a board with a specified mounting pressure. CONSTITUTION:With regards to a board to which components are to be mounted, a cylinder-shaped spindle 12 is vertically supported and pivoted on a spindle housing 11 which rises and falls in a relative manner by means of a lifting device 3 and a rod 13 having an absorption hole on the lower end is installed, which is rotatively supported inside the spindle. This rod 13 is energized by means of a spring 5 at a descent stopper inside the spindle. An air intake passage, which communicates the absorption hole of the rod with the interior of the spindle from an opening on the side of the rod, is installed. A sealing means 14, which divides a pressure chamber which applies pressure to the upper end of the rod and a vacuum chamber which evacuates the air intake passage, is installed inside the spindle. A hollow rotary shaft of a motor 16 is connected to the top of the spindle. An air pressure control means 4, which supplies compressed air into the spindle by way of the hollow rotary shaft, is installed. The vacuum chamber of the spindle is connected to a vacuum air source, thereby numerically controlling the operations of the lifting device and the air pressure control means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for rotating a component by a predetermined angle .theta. And mounting it on a substrate with a desired pressure.

[0002]

2. Description of the Related Art Many proposals have already been made for a component mounting apparatus that rotates a suction-held component by a predetermined angle θ when mounting an electronic component on a substrate. The apparatus described in Japanese Patent Laid-Open No. 62-250696 also shows an example thereof. In this device, a rotary head unit is connected coaxially with a rotary shaft of a rotary drive unit, and a suction nozzle elastically supported on the lower surface of the rotary head unit is rotated by a predetermined angle. Also, many proposals have been made for a component mounting device that applies an appropriate pressure according to the type of component when mounting an electronic component on a substrate, and one example thereof is Japanese Patent Laid-Open No. 1-246899. There is a bulletin. In this device, the suction nozzle of the upper and lower shafts,
Furthermore, the air is driven in the mounting direction, and the air pressure is controlled by the electropneumatic regulator.

[0003]

In the component mounting apparatus, it is desirable to mount the component at a specified position on the substrate with high accuracy and with a pressing force according to the strength of the component. The above-mentioned conventional example solves these problems individually. The present invention attempts to solve these problems at the same time, and further addresses the following problem in the latter conventional example. Since the vacuum suction path for sucking the component is provided in the moving axis direction of the vertically moving suction nozzle, it sucks up the component and the suction nozzle itself, and the suction nozzle is lowered by the air pressure which opposes this. The point is that it is necessary. That is, it is also intended to solve the problem that the pressure applied to the suction nozzle becomes unstable depending on the vacuum suction state of the component.

[0004]

According to the present invention, a cylinder-shaped spindle having an air supply hole at an axial center of an upper end is rotated in a spindle housing which is vertically moved by an elevating device with respect to a substrate on which a component is mounted. A rod which is vertically supported as much as possible and which is supported in a vertically movable manner in the spindle and whose lower portion is pulled out from the lower portion of the spindle is urged by a spring toward a lowering stopper in the spindle. In addition, an adsorption hole is arranged on the lower surface of the rod, and an intake passage is provided inside which communicates the adsorption hole with the inside of the spindle. Then, inside the spindle, a sealing means is provided for dividing the pressurizing chamber for applying air pressure to the upper end surface of the rod and the vacuum chamber for evacuating the intake passage of the rod, and the hollow rotary shaft of the motor is connected to the air supply hole of the spindle. Air pressure adjusting means for supplying compressed air to the inside of the spindle via the hollow rotating shaft is provided. Further, the spindle housing, the exhaust hole of the spindle, the vacuum chamber of the spindle, and the intake passage of the rod are connected to a vacuum source to control the operations of the lifting device and the air pressure adjusting means.

[0005]

[Operation] The air is sucked from the side surface of the rod to generate a vacuum suction force in the rod, the parts are vacuum-sucked to the lower end of the rod having the suction hole, and the predetermined rotation amount of the motor is directly transmitted to the rod.
And by applying a desired pressure from the axial direction to the upper end surface of the rod,
Mount on the board.

[0006]

An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of an essential part of a component mounting apparatus according to an embodiment, where A is an electronic component, B is a substrate on which the electronic component A is mounted, and 1 is a component mounting head. The component mounting head 1 is supported by the arm 2 and moves three-dimensionally relative to the substrate B, but its mechanism is not the gist of the present invention, and therefore its explanation is omitted. 3 is a component mounting head 1 via an arm 2.
It is a lifting device that lifts and lowers.

The component mounting head 1 includes a spindle housing 11, a spindle 12, a rod 13, and a sealing means 1.
4, a spring 15, a motor 16 and the like. The spindle housing 11 is vertically supported by the arm 2, rotatably vertically supports the spindle 12, and has an exhaust hole 111 on a side surface.
Have. The spindle 12 has a cylindrical shape having an air supply hole 122 at the center of the upper end in the axial direction and an exhaust hole 123 on the side surface, and the lower part thereof projects from the lower surface of the spindle housing 11. Further, the exhaust hole 123 of the spindle and the exhaust hole 111 of the spindle housing are attached to the holder 112.
Are communicated with each other through a vacuum passage provided on an inner peripheral surface of the vacuum passage and a through hole in the centrifugal direction communicating with the vacuum passage.
Are connected.

The rod 13 is provided inside the spindle 12,
It is vertically movable and non-rotatably installed concentrically with the axial center, the lower end projects from the lower surface of the spindle 12, and the component suction nozzle C is attached. The component suction nozzle C can be replaced, but its method will not be described here. An intake path 131 communicating with the component suction nozzle C is provided at the center of the rod 13. The intake passage 131 communicates with the inside of the spindle 12 through a side opening 132 at the top of the rod.

The sealing means 14 is attached to the outer periphery of the rod 13 so as to be located above the side surface opening 132, seals between the inner peripheral surface of the spindle and the outer peripheral surface of the rod, and does not hinder the vertical movement of the rod 13. Therefore, rod 1
No air leakage occurs between the in-spindle pressurizing chamber 124 and the in-spindle vacuum chamber 125 below the position where the sealing means 3 is attached.

The spring 15 is inserted between the spindle 12 and the rod 13 as shown in FIG. 2 showing the lower part of the spindle in detail, and the rod 13 is lowered in the descending direction toward the descending stopper portion 121 provided at the lower end of the spindle 12. Push down. The spring pressure of the spring 15 is set to a value smaller than the pressing force of the component for which the mounting pressure should be minimized in the component group to be mounted.

The motor 16 is attached to the upper part of the spindle housing 11 so that its own rotation shaft 161 is concentric with the rotation shaft of the spindle 12. The rotating shaft 161 is hollow, and the bushing 16
It is connected to the spindle 12 via 2. Rotating shaft 161
At the upper end of the rotary joint 164 for air piping
Is attached, and an air pressure source 5 is connected thereto via the air pressure adjusting means 4. The rotary joint 164 supplies air from the inside of the rotary shaft 161 to the inside of the spindle without hindering the rotation of the rotary shaft 161.

The air pressure adjusting means 4 sets the air pressure according to a designated voltage or current value, like an electropneumatic conversion regulator, and is connected to the controller 7. When the component mounting head 1 is at the component supply position, the control unit 7 controls the elevating device 3 and the vacuum source 6 to lower the component mounting head 1 to suck the component A onto the lower end of the suction nozzle C. When the component mounting head 1 holds the component by suction and is in the component mounting position on the board, the motor 16,
By controlling the elevating device 3, the air pressure adjusting means 4, and the vacuum source 6, the components are lowered while being horizontally rotated by a designated angle, and the components A are mounted on the substrate B with a pressing force specified for each component.

The operation of this embodiment having such a configuration will be described. When the component mounting head 1 suction-holds the component A and reaches the component mounting position on the substrate, the control unit 7 controls the motor 1 based on the preset numerical data.
The suction nozzle C is lowered onto the substrate with a stroke slightly larger than the value obtained by subtracting the thickness of the component A while controlling the spindle 6 and the lifting device 3 to rotate the spindle 12 by a specified angle. When the part A reaches the board, the rod 13 moves the lowering stopper 12 of the spindle 12 by an extra stroke.
Moving upwards from 1, compresses the spring 15. In this state, the control unit 7 commands the air pressure adjusting means 4 to set a voltage value relating to the pressure level applied to the preset component A.

The air pressure adjusting means 4 regulates the compressed air from the air pressure source to the air pressure corresponding to the voltage value received from the control section 7 and supplies the compressed air to the rotary joint 164. Compressed air adjusted to a specified pressure is supplied from the rotary joint 164 to the rotary shaft 161 of the motor and the bush 1.
62, through the air supply hole 122 of the spindle 12, and flows into the spindle. Then, the upper surface of the rod 13 is pressed to try to move downward, and the specified pressure is applied to the upper surface of the component A. That is, the weight of the rod 13 and the suction nozzle C, the spring pressure of the spring 15, and the designated air pressure are applied to the upper surface of the component A.

The suction of the component A passes through the suction nozzle C, the suction passage 131 of the rod 13, the side opening 132 of the rod to the inner surface of the spindle 12, and the holder 11
The vacuum source 6 is reached from the exhaust hole 111 of the spindle housing 11 through the second vacuum passage. This is because the sealing means 14 attached to the rod 13 uses the inner space of the spindle 12 as a boundary, and the upper side is a pressurizing chamber 124 by air pressure, and the lower side is a vacuum chamber 1 for sucking components.
By setting 25, it is realized. Therefore, the vacuum suction force of the component A does not directly act in the moving axis direction of the rod 13, but only affects the slide resistance between the rod 13 and the inner surface of the spindle 12 from the side surface. Therefore, the numerical value of the command voltage to be input to the air pressure adjusting means 4 which is input to the control unit 7 in advance is a numerical value in consideration of the influence of the component suction on the slide resistance of the rod 13.

[0016]

According to the present invention, air is sucked from the side surface of the rod to generate a vacuum suction force in the rod, the component is vacuum-sucked to the lower end of the rod having the suction hole, and the desired pressure is axially applied to the upper end surface of the rod. In addition, it is possible to mount on the substrate, and it is possible to perform accurate mounting and pressing of each component without being affected by the vacuum suction state of the component. Further, since a predetermined amount of rotation of the motor is directly transmitted to the spindle and the rotation axis of the motor itself is used as a passage for pneumatic pressure application, it is effective in miniaturizing the component mounting head.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part showing an embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a sectional view of the component mounting apparatus, showing a part of FIG. 1 in detail.

[Explanation of symbols]

 A component B substrate C suction nozzle 1 component mounting head 11 spindle housing 12 spindle 13 rod 14 sealing means 15 spring 16 motor 3 lifting device 4 air pressure adjusting means 6 vacuum source 7 controller

Claims (1)

[Claims] 1. A component mounting apparatus having the following configuration. a. Spindle housing with exhaust holes on the side. b. An elevating device for elevating and lowering the spindle housing relative to a board on which components are mounted. c. Vertically supported rotatably on the spindle housing,
A cylindrical spindle that has an air supply hole in the axial center of the upper end and an exhaust hole on the side surface. d. The spindle is supported concentrically with the axial center and movable up and down, the upper end faces the air supply hole, the other penetrates the lower part of the spindle and extends downward, and communicates with the inside of the spindle through an adsorption hole provided at its lower end. A rod having an intake passage to operate. e. Sealing means that divides the inside of the spindle into a pressure chamber that applies air pressure to the upper end surface of the rod and a vacuum chamber that evacuates the intake passage of the rod. f. A spring for urging the rod in the descending direction toward the descending stopper in the spindle. g. A motor having a rotary shaft connected to the air supply hole of the spindle and having a through hole communicating with the air supply hole in the axial direction of the rotary shaft. h. Air pressure adjusting means for adjusting the air pressure supplied to the through hole of the rotating shaft of the motor. i. A vacuum source for adsorbing components through the exhaust hole of the spindle housing, the vacuum chamber of the spindle, and the intake passage of the rod. j. A control unit that controls the operations of the air pressure adjusting means and the lifting device so that the components are mounted at a specified pressure when the components are mounted.