SG11201808591RA - Heat-curing two-component epoxide resin - Google Patents

Heat-curing two-component epoxide resin

Info

Publication number
SG11201808591RA
SG11201808591RA SG11201808591RA SG11201808591RA SG11201808591RA SG 11201808591R A SG11201808591R A SG 11201808591RA SG 11201808591R A SG11201808591R A SG 11201808591RA SG 11201808591R A SG11201808591R A SG 11201808591RA SG 11201808591R A SG11201808591R A SG 11201808591RA
Authority
SG
Singapore
Prior art keywords
component
epoxide resin
curing
heat
component epoxide
Prior art date
Application number
SG11201808591RA
Other languages
English (en)
Inventor
Max Poxleitner
Peter Graeter
Original Assignee
Dr Neidlinger Holding Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dr Neidlinger Holding Gmbh filed Critical Dr Neidlinger Holding Gmbh
Publication of SG11201808591RA publication Critical patent/SG11201808591RA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/50—Organo-phosphines
    • C07F9/53—Organo-phosphine oxides; Organo-phosphine thioxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/30—Windings characterised by the insulating material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Artificial Filaments (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
SG11201808591RA 2016-04-01 2017-03-29 Heat-curing two-component epoxide resin SG11201808591RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016106031.3A DE102016106031A1 (de) 2016-04-01 2016-04-01 Heißhärtendes Zweikomponenten-Epoxidharz
PCT/EP2017/057452 WO2017167825A1 (de) 2016-04-01 2017-03-29 Heisshärtendes zweikomponenten-epoxidharz

Publications (1)

Publication Number Publication Date
SG11201808591RA true SG11201808591RA (en) 2018-10-30

Family

ID=58547476

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808591RA SG11201808591RA (en) 2016-04-01 2017-03-29 Heat-curing two-component epoxide resin

Country Status (13)

Country Link
US (1) US20190031819A1 (ru)
EP (1) EP3436466A1 (ru)
JP (1) JP6753947B2 (ru)
KR (1) KR102220274B1 (ru)
CN (1) CN109415395A (ru)
BR (1) BR112018069988A2 (ru)
CA (1) CA3019263C (ru)
DE (1) DE102016106031A1 (ru)
MX (1) MX2018011924A (ru)
RU (1) RU2710557C1 (ru)
SG (1) SG11201808591RA (ru)
WO (1) WO2017167825A1 (ru)
ZA (1) ZA201806573B (ru)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7252027B2 (ja) * 2019-03-26 2023-04-04 太陽インキ製造株式会社 穴埋め用硬化性樹脂組成物

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824251A1 (de) 1988-07-13 1990-01-18 Siemens Ag Reaktorkern mit steuerelementen
JP2980971B2 (ja) * 1989-12-01 1999-11-22 三井化学株式会社 二液型エポキシ樹脂組成物および塗料用組成物
JPH05289337A (ja) * 1992-04-10 1993-11-05 Nippon Soda Co Ltd 化学めっき用レジスト樹脂組成物
DE4227580A1 (de) 1992-08-20 1994-02-24 Basf Lacke & Farben Verfahren zur Herstellung von Pulverlacken und nach diesem Verfahren hergestellte Pulverlacke
JPH07316270A (ja) * 1994-05-26 1995-12-05 Yaskawa Electric Corp 含浸用樹脂組成物
JP2875479B2 (ja) * 1994-09-08 1999-03-31 日本ペルノックス株式会社 半導体の封止方法
JP2939576B2 (ja) * 1994-11-09 1999-08-25 大都産業株式会社 エポキシ樹脂硬化剤及び組成物
JPH08245765A (ja) * 1995-03-13 1996-09-24 Toshiba Chem Corp 化合物半導体装置
DE19726263C2 (de) * 1997-06-20 2003-02-27 Reaku Hobein Gmbh Zweikomponenten-Beschichtungsmittel auf Epoxidharz-Basis für zementgebundene Untergründe sowie dessen Verwendung
DE69913374T2 (de) * 1998-10-22 2004-10-28 Vantico Ag Härtbare epoxidharzzusammensetzungen
WO2002066485A2 (en) * 2001-02-15 2002-08-29 Pabu Services, Inc. Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom
US6617401B2 (en) 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
EP1881033A1 (en) * 2006-07-20 2008-01-23 Abb Research Ltd. Diluent free epoxy resin formulation
EP2283058A1 (en) 2008-05-22 2011-02-16 Dow Global Technologies Inc. Epoxy resins derived from seed oil based alkanolamides and a process for preparing the same
GB0817795D0 (en) * 2008-09-30 2008-11-05 3M Innovative Properties Co Fast curing oil-uptaking epozxy-based structural adhesives
HUE025447T2 (en) * 2010-12-23 2016-04-28 Sicpa Holding Sa Two-component reactive ink for inkjet printing
DE102011087834A1 (de) 2011-12-06 2013-06-06 Henkel Ag & Co. Kgaa Reaktive 2K-Schmelzklebstoffzusammensetzung
US9096759B2 (en) * 2011-12-21 2015-08-04 E I Du Pont De Nemours And Company Printing form and process for preparing the printing form with curable composition having solvent-free epoxy resin
EP2902441B1 (en) * 2012-09-28 2024-05-01 Mitsubishi Chemical Corporation Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound
EP3225644A1 (en) * 2012-10-15 2017-10-04 Daicel Corporation Curable resin composition, and cured product thereof
JP6219042B2 (ja) * 2013-03-14 2017-10-25 コスモ石油ルブリカンツ株式会社 高熱伝導性エポキシ樹脂系組成物
JP2016023219A (ja) * 2014-07-18 2016-02-08 積水化学工業株式会社 半導体素子保護用の２液混合型の第１，第２の液及び半導体装置

Also Published As

Publication number Publication date
EP3436466A1 (de) 2019-02-06
BR112018069988A2 (pt) 2019-04-30
WO2017167825A1 (de) 2017-10-05
ZA201806573B (en) 2021-02-24
CA3019263C (en) 2022-09-20
CA3019263A1 (en) 2017-10-05
KR102220274B1 (ko) 2021-02-24
US20190031819A1 (en) 2019-01-31
KR20190013726A (ko) 2019-02-11
JP6753947B2 (ja) 2020-09-09
JP2019516818A (ja) 2019-06-20
RU2710557C1 (ru) 2019-12-27
MX2018011924A (es) 2019-03-28
CN109415395A (zh) 2019-03-01
DE102016106031A1 (de) 2017-10-05

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അച്ചുതത്ത് വാസുദേവൻ മൂസ്സത് നിവാപാഞ്ജലി