SG11201808252VA - Method for manufacturing wire saw apparatus and wire saw apparatus - Google Patents
Method for manufacturing wire saw apparatus and wire saw apparatusInfo
- Publication number
- SG11201808252VA SG11201808252VA SG11201808252VA SG11201808252VA SG11201808252VA SG 11201808252V A SG11201808252V A SG 11201808252VA SG 11201808252V A SG11201808252V A SG 11201808252VA SG 11201808252V A SG11201808252V A SG 11201808252VA SG 11201808252V A SG11201808252V A SG 11201808252VA
- Authority
- SG
- Singapore
- Prior art keywords
- wire saw
- saw apparatus
- manufacturing
- manufacturing wire
- wire
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/363—Single-purpose machines or devices for grinding surfaces of revolution in situ
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/37—Single-purpose machines or devices for grinding rolls, e.g. barrel-shaped rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/36—Wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H54/00—Winding, coiling, or depositing filamentary material
- B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
- B65H54/28—Traversing devices; Package-shaping arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H59/00—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators
- B65H59/10—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by devices acting on running material and not associated with supply or take-up devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016085208A JP6589735B2 (en) | 2016-04-21 | 2016-04-21 | Manufacturing method of wire saw device |
PCT/JP2017/006980 WO2017183295A1 (en) | 2016-04-21 | 2017-02-24 | Method for manufacturing wire saw apparatus and wire saw apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201808252VA true SG11201808252VA (en) | 2018-10-30 |
Family
ID=60115941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201808252VA SG11201808252VA (en) | 2016-04-21 | 2017-02-24 | Method for manufacturing wire saw apparatus and wire saw apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US11806827B2 (en) |
JP (1) | JP6589735B2 (en) |
KR (1) | KR102644660B1 (en) |
CN (1) | CN108778623B (en) |
DE (1) | DE112017001555T5 (en) |
SG (1) | SG11201808252VA (en) |
TW (1) | TWI715735B (en) |
WO (1) | WO2017183295A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110253775A (en) * | 2019-07-26 | 2019-09-20 | 内蒙古中环光伏材料有限公司 | A kind of slicer tension arm measure and control device and slice process |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4369934A (en) * | 1981-02-03 | 1983-01-25 | Spies Henry J | Helical filament winding apparatus |
JPH02124253A (en) | 1988-10-28 | 1990-05-11 | Toray Ind Inc | Polishing method for roll surface of rubber roll |
JPH11156694A (en) | 1997-12-01 | 1999-06-15 | Hitachi Ltd | Wire saw cutting method and device |
JP2000061801A (en) * | 1998-08-18 | 2000-02-29 | Hitachi Ltd | Cutting method, cutting device and manufacture of semiconductor device |
TW383249B (en) * | 1998-09-01 | 2000-03-01 | Sumitomo Spec Metals | Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board |
JP2000308925A (en) * | 1999-04-28 | 2000-11-07 | Kyocera Corp | Wire guide member |
JP2001246545A (en) * | 1999-12-14 | 2001-09-11 | Sumitomo Special Metals Co Ltd | Cutting method and cutting device for rare earth alloy |
MY126994A (en) * | 1999-12-14 | 2006-11-30 | Hitachi Metals Ltd | Method and apparatus for cutting a rare earth alloy |
JP4411062B2 (en) * | 2003-12-25 | 2010-02-10 | 株式会社アライドマテリアル | Super abrasive wire saw winding structure, super abrasive wire saw cutting device, and super abrasive wire saw winding method |
US8075647B2 (en) * | 2006-10-20 | 2011-12-13 | Mitsubishi Electric Corporation | Slurry for slicing silicon ingot and method for slicing silicon ingot using the same |
DE102007016334B4 (en) | 2007-04-04 | 2011-04-21 | Siemens Ag | Wire saw and method of making a wire saw |
JP5003294B2 (en) * | 2007-06-08 | 2012-08-15 | 信越半導体株式会社 | Cutting method |
JP4998241B2 (en) * | 2007-12-11 | 2012-08-15 | 信越半導体株式会社 | Method of cutting workpiece by wire saw and wire saw |
CN201645272U (en) | 2010-03-25 | 2010-11-24 | 陕西汉江机床有限公司 | Numerical-control wire guiding roller grinder |
JP5155428B2 (en) * | 2011-07-15 | 2013-03-06 | コマツNtc株式会社 | Wire saw |
EP3081517B1 (en) * | 2015-04-17 | 2017-10-25 | Schleuniger Holding AG | Device for guiding and transporting products having the form of wire or elongated elements |
-
2016
- 2016-04-21 JP JP2016085208A patent/JP6589735B2/en active Active
-
2017
- 2017-02-24 SG SG11201808252VA patent/SG11201808252VA/en unknown
- 2017-02-24 WO PCT/JP2017/006980 patent/WO2017183295A1/en active Application Filing
- 2017-02-24 US US16/086,554 patent/US11806827B2/en active Active
- 2017-02-24 KR KR1020187029338A patent/KR102644660B1/en active IP Right Grant
- 2017-02-24 CN CN201780018553.1A patent/CN108778623B/en active Active
- 2017-02-24 DE DE112017001555.3T patent/DE112017001555T5/en active Pending
- 2017-03-01 TW TW106106620A patent/TWI715735B/en active
Also Published As
Publication number | Publication date |
---|---|
CN108778623B (en) | 2020-07-03 |
CN108778623A (en) | 2018-11-09 |
KR102644660B1 (en) | 2024-03-07 |
TWI715735B (en) | 2021-01-11 |
KR20180134891A (en) | 2018-12-19 |
US11806827B2 (en) | 2023-11-07 |
JP6589735B2 (en) | 2019-10-16 |
WO2017183295A1 (en) | 2017-10-26 |
TW201738022A (en) | 2017-11-01 |
JP2017193021A (en) | 2017-10-26 |
DE112017001555T5 (en) | 2018-12-13 |
US20190105750A1 (en) | 2019-04-11 |
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