SG11201808160PA - Shutter device used for exposure in lithography machine, and method for use thereof - Google Patents

Shutter device used for exposure in lithography machine, and method for use thereof

Info

Publication number
SG11201808160PA
SG11201808160PA SG11201808160PA SG11201808160PA SG11201808160PA SG 11201808160P A SG11201808160P A SG 11201808160PA SG 11201808160P A SG11201808160P A SG 11201808160PA SG 11201808160P A SG11201808160P A SG 11201808160PA SG 11201808160P A SG11201808160P A SG 11201808160PA
Authority
SG
Singapore
Prior art keywords
shutter
shutter blade
rotating motor
rotation center
blade
Prior art date
Application number
SG11201808160PA
Inventor
Menglai Chen
Fuping Zhang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201808160PA publication Critical patent/SG11201808160PA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G03F7/70366—Rotary scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shutters For Cameras (AREA)

Abstract

Provided are a shutter device used for exposure in a lithography machine, and a method thereof. The device comprises a shutter blade (), a rotating motor (2) for driving the shutter blade (1) to rotate, a controller electrically connected to the rotating motor (2), and a supporter (3) used for supporting the rotating motor (2); the shutter blade (1) comprises a rotation center (11) and at least one open portion (12) and shielding portion (13) arranged corresponding to the rotation center (11); the rotation center (11) is connected to the rotating motor (2), and the rotating motor (2) drives the shutter blade (1) to rotate and thus open and close the shutter, so as to form an exposed region and a non-exposed region. A hollow portion (131) is provided in the shielding portion (13), lightening the mass of the shutter blade (1) and improving control over the shutter blade (1) during rotation. By means of the control of the controller, the shutter is opened and closed during the uniform-speed stage of motion of the shutter blade (1). The processes of acceleration and deceleration of the shutter blade (1) are set to take place during a stage of the closing of the shutter in which time and travel distance are ample, decreasing the torque requirement of the rotating motor (2) and effectively shortening the time to open and close the shutter. 18
SG11201808160PA 2016-03-31 2017-03-31 Shutter device used for exposure in lithography machine, and method for use thereof SG11201808160PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610200735.8A CN107290938B (en) 2016-03-31 2016-03-31 A kind of shutter device and its application method for photo-etching machine exposal
PCT/CN2017/078936 WO2017167259A1 (en) 2016-03-31 2017-03-31 Shutter device used for exposure in lithography machine, and method for use thereof

Publications (1)

Publication Number Publication Date
SG11201808160PA true SG11201808160PA (en) 2018-10-30

Family

ID=59963550

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808160PA SG11201808160PA (en) 2016-03-31 2017-03-31 Shutter device used for exposure in lithography machine, and method for use thereof

Country Status (7)

Country Link
US (1) US10712668B2 (en)
JP (1) JP6649505B2 (en)
KR (1) KR102173216B1 (en)
CN (1) CN107290938B (en)
SG (1) SG11201808160PA (en)
TW (1) TWI630466B (en)
WO (1) WO2017167259A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110196532B (en) * 2018-02-27 2021-03-16 上海微电子装备（集团）股份有限公司 Safety shutter device of photoetching machine
JP7352332B2 (en) * 2018-05-14 2023-09-28 キヤノン株式会社 exposure equipment
JP2021139980A (en) * 2020-03-03 2021-09-16 キオクシア株式会社 Semiconductor production apparatus, and manufacturing method of semiconductor device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607870B2 (en) * 1978-05-16 1985-02-27 富士電機株式会社 Imaging method
JPS60241055A (en) * 1984-05-15 1985-11-29 Oak Seisakusho:Kk Device for opening and closing shutter
JPS6136719A (en) * 1984-07-30 1986-02-21 Nec Corp Synchronous optical path opening and closing device and its operation method
JP2745413B2 (en) * 1988-09-02 1998-04-28 キヤノン株式会社 Exposure equipment
JPH03114824U (en) * 1990-05-31 1991-11-26
JPH04317315A (en) * 1991-04-16 1992-11-09 Canon Inc Shutter system
US6476905B1 (en) * 2000-01-20 2002-11-05 Taiwan Semiconductor Manufacturing Co., Ltd. Step and scan exposure system equipped with a plurality of attenuator blades for exposure control
JP4346320B2 (en) * 2003-02-05 2009-10-21 大日本印刷株式会社 Exposure method and exposure apparatus
KR100598095B1 (en) * 2003-07-10 2006-07-07 삼성전자주식회사 lithography device
CN1673868A (en) * 2004-03-26 2005-09-28 力晶半导体股份有限公司 Exposure machine with variable shutter and exposure method thereof
JP2008141016A (en) 2006-12-01 2008-06-19 Canon Inc Shutter blade device, shutter unit, imaging apparatus, aligner, and device manufacturing method
CN102096325B (en) 2009-12-10 2013-01-16 上海微电子装备有限公司 Light intensity attenuation device and method
KR20120102387A (en) * 2011-03-08 2012-09-18 삼성전자주식회사 Display apparatus and fabrication method of the same
CN103293864B (en) * 2012-02-27 2015-05-13 上海微电子装备有限公司 Photoetching exposure dose control device and method
CN102707577B (en) * 2012-05-23 2013-11-27 哈尔滨工业大学 Servo-controlling system of macro-micro mechanism and control method thereof
CN103631066A (en) * 2012-08-21 2014-03-12 上海微电子装备有限公司 Shutter device used for lithographic exposure and application method of shutter device
CN203535380U (en) * 2013-10-29 2014-04-09 中芯国际集成电路制造(北京)有限公司 Shutter device and photoetching equipment
JP6415057B2 (en) * 2014-02-07 2018-10-31 キヤノン株式会社 Exposure apparatus and article manufacturing method
JP6313795B2 (en) * 2016-03-03 2018-04-18 キヤノン株式会社 Shutter unit, lithographic apparatus, imprint apparatus, and article manufacturing method

Also Published As

Publication number Publication date
TWI630466B (en) 2018-07-21
CN107290938B (en) 2019-05-31
JP6649505B2 (en) 2020-02-19
US10712668B2 (en) 2020-07-14
TW201736983A (en) 2017-10-16
KR20180124968A (en) 2018-11-21
WO2017167259A1 (en) 2017-10-05
US20190369501A1 (en) 2019-12-05
KR102173216B1 (en) 2020-11-03
CN107290938A (en) 2017-10-24
JP2019516125A (en) 2019-06-13

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