SG11201807703YA - Substrate heat treatment apparatus - Google Patents

Substrate heat treatment apparatus

Info

Publication number
SG11201807703YA
SG11201807703YA SG11201807703YA SG11201807703YA SG11201807703YA SG 11201807703Y A SG11201807703Y A SG 11201807703YA SG 11201807703Y A SG11201807703Y A SG 11201807703YA SG 11201807703Y A SG11201807703Y A SG 11201807703YA SG 11201807703Y A SG11201807703Y A SG 11201807703YA
Authority
SG
Singapore
Prior art keywords
shanghai
bld
substrate
road
zhangjiang
Prior art date
Application number
SG11201807703YA
Inventor
Hui Wang
Hongchao Yang
Jun Wu
Wenjun Wang
Fuping Chen
Zhiyou Fang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201807703YA publication Critical patent/SG11201807703YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Tunnel Furnaces (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property —, Organization 111111110111101110101011111010111110111011111011111111011101111101111011111 International Bureau ... ..51 jd ......... (10) International Publication Number (43) International Publication Date WO 2017/156758 Al 21 September 2017 (21.09.2017) WIP0 I PCT (51) (21) (22) (25) Filing Language: (26) Publication Language: (71) (72) International Patent Classification: (74) Agent: SHANGHAI PATENT & TRADEMARK LAW HO1L 21/67 (2006.01) OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (CN). International Application Number: PCT/CN2016/076681 (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, International Filing Date: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, 18 March 2016 (18.03.2016) BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, English DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, English KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, Applicant: ACM RESEARCH (SHANGHAI) INC. MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, High-Tech Park, Shanghai 201203 (CN). SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). (84) Designated States (unless otherwise indicated, for every YANG, Hongchao; Bld. 4, No. 1690 Cailun Road, kind of regional protection available): ARIPO (BW, GH, Zhangjiang High-Tech Park, Shanghai 201203 (CN). WU, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, Jun; Bld. 4, No. 1690 Cailun Road, Zhangjiang Hi Tech TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, Park, Shanghai 201203 (CN). WANG, Wenjun; Bld. 4, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, No. 1690 Cailun Road, Zhangjiang High-Tech Park, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, Shanghai 201203 (CN). CHEN, Fuping; Bld. 4, No. 1690 LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, Cailun Road, Zhangjiang High-Tech Park, Shanghai SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, 201203 (CN). FANG, Zhiyou; Bld. 4, No. 1690 Cailun GW, KM, ML, MR, NE, SN, TD, TG). Road, Zhangjiang High-Tech Park, Shanghai 201203 Published: (CN). — with international search report (Art. 21(3)) = = Title: (54) = 1041 SUBSTRATE HEAT TREATMENT APPARATUS 1042 1043 104 7 1044 \ (57) : A substrate heat treatment apparatus for heat treating a substrate, corn- prising a bake plate, a plurality of support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The plurality of support com- ponents support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the sub- strate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap for-med between the inner circumferen- tial wall of the baffle plate and the sub- strate. 114 _= — = - = $ 13 110 1021 110 115 1031 \ 3 7. , . i 108 = = = ° . . . , ''\7 - ' '\%\V ' .' / 111 , . . 1 11 102 101 112 1-1 kin IN kin ,—, IN ,—, © ei 109 106 FIG 1 O
SG11201807703YA 2016-03-18 2016-03-18 Substrate heat treatment apparatus SG11201807703YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/076681 WO2017156758A1 (en) 2016-03-18 2016-03-18 Substrate heat treatment apparatus

Publications (1)

Publication Number Publication Date
SG11201807703YA true SG11201807703YA (en) 2018-10-30

Family

ID=59850684

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807703YA SG11201807703YA (en) 2016-03-18 2016-03-18 Substrate heat treatment apparatus

Country Status (7)

Country Link
US (1) US11854842B2 (en)
JP (1) JP6697089B2 (en)
KR (1) KR102447723B1 (en)
CN (1) CN109075102B (en)
SG (1) SG11201807703YA (en)
TW (1) TWI731913B (en)
WO (1) WO2017156758A1 (en)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0341461Y2 (en) * 1986-10-22 1991-08-30
NL1003538C2 (en) * 1996-07-08 1998-01-12 Advanced Semiconductor Mat Method and device for contactless treatment of a disc-shaped semiconductor substrate.
JPH1055951A (en) * 1996-08-12 1998-02-24 Sony Corp Baking device and method
JP3585215B2 (en) * 1999-05-24 2004-11-04 東京エレクトロン株式会社 Substrate processing equipment
JP2001176764A (en) * 1999-12-17 2001-06-29 Tokyo Electron Ltd Heat treatment apparatus
JP4024980B2 (en) * 2000-02-21 2007-12-19 東京エレクトロン株式会社 Heat treatment method and heat treatment apparatus
JP3547724B2 (en) * 2001-09-25 2004-07-28 沖電気工業株式会社 Resist pattern baking apparatus and resist pattern forming method
JP3950424B2 (en) 2003-02-10 2007-08-01 東京エレクトロン株式会社 Heat treatment equipment
JP3718688B2 (en) * 2003-06-17 2005-11-24 東京エレクトロン株式会社 Heating device
US7993460B2 (en) * 2003-06-30 2011-08-09 Lam Research Corporation Substrate support having dynamic temperature control
KR101185794B1 (en) * 2004-06-28 2012-10-02 쿄세라 코포레이션 Wafer heating equipment and semiconductor manufacturing equipment
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
JP4666473B2 (en) * 2005-05-12 2011-04-06 大日本スクリーン製造株式会社 Substrate heat treatment equipment
KR20060122569A (en) * 2005-05-27 2006-11-30 삼성전자주식회사 Chemical vapor deposition equipment having temperature sensor in high temperature maintenance region adjacent to process chamber
JP4530933B2 (en) * 2005-07-21 2010-08-25 大日本スクリーン製造株式会社 Substrate heat treatment equipment
JP4666496B2 (en) * 2005-12-07 2011-04-06 大日本スクリーン製造株式会社 Substrate heat treatment equipment
JP4707593B2 (en) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 Heat treatment apparatus and substrate adsorption method
JP2008186934A (en) * 2007-01-29 2008-08-14 Dainippon Screen Mfg Co Ltd Heat treatment apparatus and heat treatment method
JP4288309B2 (en) * 2007-09-03 2009-07-01 キヤノンアネルバ株式会社 Substrate heat treatment apparatus and substrate heat treatment method
US8367981B2 (en) * 2008-05-15 2013-02-05 Macronix International Co., Ltd. Baking apparatus, baking method and method of reducing gap width
US9169562B2 (en) 2010-05-25 2015-10-27 Singulus Mocvd Gmbh I. Gr. Parallel batch chemical vapor deposition system
JP6107742B2 (en) 2014-05-09 2017-04-05 東京エレクトロン株式会社 Heat treatment apparatus, heat treatment method and storage medium
CN105280518B (en) 2014-05-30 2020-09-08 盛美半导体设备(上海)股份有限公司 Heat treatment device for semiconductor substrate

Also Published As

Publication number Publication date
KR20180127390A (en) 2018-11-28
KR102447723B1 (en) 2022-09-27
US11854842B2 (en) 2023-12-26
US20200294825A1 (en) 2020-09-17
CN109075102B (en) 2022-07-12
TWI731913B (en) 2021-07-01
JP6697089B2 (en) 2020-05-20
CN109075102A (en) 2018-12-21
WO2017156758A1 (en) 2017-09-21
JP2019510375A (en) 2019-04-11
TW201802983A (en) 2018-01-16

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