SG11201807503QA - System and method for temperature forcing with conductive thermal probes - Google Patents

System and method for temperature forcing with conductive thermal probes

Info

Publication number
SG11201807503QA
SG11201807503QA SG11201807503QA SG11201807503QA SG11201807503QA SG 11201807503Q A SG11201807503Q A SG 11201807503QA SG 11201807503Q A SG11201807503Q A SG 11201807503QA SG 11201807503Q A SG11201807503Q A SG 11201807503QA SG 11201807503Q A SG11201807503Q A SG 11201807503QA
Authority
SG
Singapore
Prior art keywords
international
thermally conductive
housing
temperature
massachusetts
Prior art date
Application number
SG11201807503QA
Inventor
Norbert Elsdoerfer
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of SG11201807503QA publication Critical patent/SG11201807503QA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1919—Control of temperature characterised by the use of electric means characterised by the type of controller
    • G05D23/192—Control of temperature characterised by the use of electric means characterised by the type of controller using a modification of the thermal impedance between a source and the load
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2200/00—Prediction; Simulation; Testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -, - Organization 1111111101111011101010111110101111101110111101111110111011111111101111011111 International Bureau ... .... ..Y' j ........,/ (10) International Publication Number (43) International Publication Date WO 2017/155707 Al 14 September 2017 (14.09.2017) WIP0 I PCT (51) International Patent Classification: (74) Agents: MILLS, Steven M. et al.; Burns & Levinson, G01R 1/04 (2006.01) GO5D 23/22 (2006.01) LLP, 125 Summer Street, Boston, Massachusetts 02110 G01R 31/28 (2006.01) F28D 15/00 (2006.01) (US). G05D 23/19 (2006.01) (81) Designated States (unless otherwise indicated, for every (21) International Application Number: kind of national protection available): AE, AG, AL, AM, PCT/US2017/019275 AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, (22) International Filing Date: DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, 24 February 2017 (24.02.2017) HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, (25) Filing Language: English KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, (26) Publication Language: English NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, (30) Priority Data: RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, 62/305,263 8 March 2016 (08.03.2016) US TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, 15/437,861 21 February 2017 (21.02.2017) US ZA, ZM, ZW. (71) Applicant: TEMPTRONIC CORPORATION [US/US]; (84) Designated States (unless otherwise indicated, for every 41 Hampden Road, Mansfield, Massachusetts 02048 (US). kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, (72) Inventor: ELSDOERFER, Norbert; c/o Temptronic Cor- TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, poration, 41 Hampden Road, Mansfield, Massachusetts TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, _ 02048 (US). DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, [Continued on next page] (54) Title: SYSTEM = = = 200A = = = = = = = = = 220 - = 233 11 235 222 232 Mr NIP \"..E. w . AND r 4 I , - OA LII -WI ll O n % IPA Illr LUP AP 1.1 METHOD FOR TEMPERATURE FORCING WITH CONDUCTIVE THERMAL PROBES fle ,_.N - 14 ii? • 11 _...-.-- ', .... ) I I II 4-3/10 (57) : A temperature-controlled fluid forcing system includes a tem- perature control system generating a stream of flowing temperature con- trolled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls define a shaped flow space. The stream of temperature-controlled fluid flows through the shaped flow space and is in thermal communication with the housing. A thermally conductive probe is in thermal communication with the exterior of the housing of the heat ex- changer, the thermally conductive probe comprising a thermally conductive protrusion in thermal communication with the exterior of the housing of the heat exchanger, such that, when the thermally conductive probe makes con- 214 tact with a device under test (DUT), heat is conducted to or from DUT. 252 218 230 224 IN EMMEN= 256 © 228 254 IN I 258 ir) N im —, - ir) Fig. 5 ,-, 19, 119 IN 11 ei O WO 2017/155707 Al MIDEDIM011111 111111110101311111111101111111111111111111111111111111 SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, Published: GW, KM, ML, MR, NE, SN, TD, TG). — with international search report (Art. 21(3)) Declarations under Rule 4.17: — as to applicant's entitlement to a patent (Rule 4.17(0) apply for and be granted
SG11201807503QA 2016-03-08 2017-02-24 System and method for temperature forcing with conductive thermal probes SG11201807503QA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662305263P 2016-03-08 2016-03-08
US15/437,861 US20170261547A1 (en) 2016-03-08 2017-02-21 Temperature Forcing System and Method with Conductive Thermal Probes
PCT/US2017/019275 WO2017155707A1 (en) 2016-03-08 2017-02-24 System and method for temperature forcing with conductive thermal probes

Publications (1)

Publication Number Publication Date
SG11201807503QA true SG11201807503QA (en) 2018-09-27

Family

ID=59787849

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807503QA SG11201807503QA (en) 2016-03-08 2017-02-24 System and method for temperature forcing with conductive thermal probes

Country Status (7)

Country Link
US (1) US20170261547A1 (en)
EP (1) EP3427071B1 (en)
JP (1) JP2019513978A (en)
CN (1) CN109073676A (en)
SG (1) SG11201807503QA (en)
TW (1) TW201800763A (en)
WO (1) WO2017155707A1 (en)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
WO2001006273A1 (en) * 1999-07-15 2001-01-25 Schlumberger Technologies, Inc. Apparatus and method for temperature control of ic device during test
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
EP1917839A4 (en) * 2005-06-24 2011-01-05 Carrier Corp A device for controlling a thermo-electric system
WO2007109027A1 (en) * 2006-03-20 2007-09-27 Temptronic Corporation Temperature-controlled enclosures and temperature control system using the same
US8424594B2 (en) * 2007-12-10 2013-04-23 Presto Engineering, Inc. Apparatus for thermal control in the analysis of electronic devices
KR20100055236A (en) * 2008-11-17 2010-05-26 삼성전자주식회사 Apparatus for testing semiconductor device and method for testing semiconductor device
US9383406B2 (en) * 2009-11-30 2016-07-05 Essai, Inc. Systems and methods for conforming device testers to integrated circuit device with pressure relief valve
US9736962B2 (en) * 2012-02-27 2017-08-15 M.D. Mechanical Devices Ltd. Efficient temperature forcing of semiconductor devices under test
CA2839884C (en) * 2013-02-19 2020-10-27 Scambia Holdings Cyprus Limited Plate heat exchanger including separating elements
TW201506420A (en) * 2013-03-15 2015-02-16 Sensata Tech Massachusetts Inc Direct injection phase change temperature control system
JP6331271B2 (en) * 2013-06-10 2018-05-30 セイコーエプソン株式会社 Electronic component pressing unit, electronic component transport device, and electronic component inspection device

Also Published As

Publication number Publication date
TW201800763A (en) 2018-01-01
JP2019513978A (en) 2019-05-30
CN109073676A (en) 2018-12-21
EP3427071A1 (en) 2019-01-16
EP3427071B1 (en) 2020-04-08
US20170261547A1 (en) 2017-09-14
WO2017155707A1 (en) 2017-09-14

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