SG11201807177VA - Apparatus for exhaust cooling - Google Patents

Apparatus for exhaust cooling

Info

Publication number
SG11201807177VA
SG11201807177VA SG11201807177VA SG11201807177VA SG11201807177VA SG 11201807177V A SG11201807177V A SG 11201807177VA SG 11201807177V A SG11201807177V A SG 11201807177VA SG 11201807177V A SG11201807177V A SG 11201807177VA SG 11201807177V A SG11201807177V A SG 11201807177VA
Authority
SG
Singapore
Prior art keywords
california
international
exhaust
exhaust cooling
cooling apparatus
Prior art date
Application number
SG11201807177VA
Inventor
S Cox Michael
T West Brian
W Ho Dustin
m johnson Roger
Rozenzon Yan
Somanna Dinkesh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201807177VA publication Critical patent/SG11201807177VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H01J37/32844—Treating effluent gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Exhaust Gas After Treatment (AREA)
  • Chemical Vapour Deposition (AREA)
  • Treating Waste Gases (AREA)
  • Tires In General (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property -, Organization 11111111011110111010101111101011111011101011101111100111111101111101111011111 International Bureau 0.. .... .. ..... ..,,,i (10) International Publication Number (43) International Publication Date WO 2017/177398 Al 19 October 2017(19.10.2017) WIPO I PCT (51) International Patent Classification: No. 48 Jia Zhichun Road, Haidian District, Beijing 100098 H01L 21/02 (2006.01) (CN). (21) International Application Number: (81) Designated States (unless otherwise indicated, for every PCT/CN2016/079153 kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, (22) International Filing Date: BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, 13 April 2016 (13.04.2016) DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, (25) Filing Language: English HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, (26) Publication Language: English MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, (71) Applicant: APPLIED MATERIALS, INC. [US/US]; PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, 3050 Bowers Avenue, Santa Clara, California 95054 (US). SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (72) Inventor; and (71) Applicant (for KP only): DUSTIN W., Ho [US/CN]; Rm (84) Designated States (unless otherwise indicated, for every 904, No. 2, Alley 99, FangLi Road, Shanghai 201802 kind of regional protection available): ARIPO (BW, GH, (CN). GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, (72) Inventors: MICHAEL S., Cox; 7090 Church, St.Gilroy, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, California 95020 (US). BRIAN T., West; 4780 Grimsby DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, Drive, San Jose, California 95130 (US). ROGER M., LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, _ Johnson; 1242 Deep Creek Road, Livermore, California SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, — 94550 (US). YAN, Rozenzon; 3383 Lubich Drive, Moun- GW, KM, ML, MR, NE, SN, TD, TG). _ taro View, California 94040 (US). DINKESH, Somanna; 400 East Remington Dr.Apt.D313, Sunnyvale, California Published: = 94087 (US). — with international search report (Art. 21(3)) (74) Agent: LECOME INTELLECTUAL PROPERTY _ — AGENT LTD.; Floor 16, Tower B of IN.DO Mansion, = = = = = = = = (54) Title: APPARATUS FOR EXHAUST COOLING = = — i ,— 170 = 190 117 I 193---„, 100 192 / 194 196 I I I 11 .4 -191 J r ----'- GC C:7 M Ir ... ' Ir...' 114 - ,-1 -115 -182 Fig. 1 IN 1-1 (57) : An exhaust cooling apparatus (117) includes at least one cooling plate (314,412,514,614,814,914) for introducing 0 turbulence to the exhaust flowing within the exhaust cooling apparatus (117). The device (318,518,618,818,918) may be a plurality \" of fins (320,322,324,326,328), a cylinder (518,618) with a curved top portion (544,644), or a diffuser (824,925) with angled blades C (826,926). The turbulent flow of the exhaust within the exhaust cooling apparatus (117) causes particles to drop out of the exhaust, minimizing particles forming in equipment downstream of the exhaust cooling apparatus (117).
SG11201807177VA 2016-04-13 2016-04-13 Apparatus for exhaust cooling SG11201807177VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/079153 WO2017177398A1 (en) 2016-04-13 2016-04-13 Apparatus for exhaust cooling

Publications (1)

Publication Number Publication Date
SG11201807177VA true SG11201807177VA (en) 2018-10-30

Family

ID=60039529

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807177VA SG11201807177VA (en) 2016-04-13 2016-04-13 Apparatus for exhaust cooling

Country Status (7)

Country Link
US (1) US11114285B2 (en)
JP (1) JP2019514222A (en)
KR (1) KR102520578B1 (en)
CN (1) CN108701583B (en)
SG (1) SG11201807177VA (en)
TW (1) TWI679698B (en)
WO (1) WO2017177398A1 (en)

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* Cited by examiner, † Cited by third party
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US11221182B2 (en) 2018-07-31 2022-01-11 Applied Materials, Inc. Apparatus with multistaged cooling
US11306971B2 (en) 2018-12-13 2022-04-19 Applied Materials, Inc. Heat exchanger with multistaged cooling
FR3102680B1 (en) * 2019-11-06 2021-11-12 Pfeiffer Vacuum Trap for vacuum line, installation and use
CN113990730B (en) * 2020-07-27 2023-10-31 中微半导体设备(上海)股份有限公司 Plasma processing apparatus, gas flow regulating cover and gas flow regulating method thereof
CN115050623A (en) * 2021-03-08 2022-09-13 中微半导体设备(上海)股份有限公司 Plasma processing device

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Also Published As

Publication number Publication date
JP2019514222A (en) 2019-05-30
WO2017177398A1 (en) 2017-10-19
TWI679698B (en) 2019-12-11
KR102520578B1 (en) 2023-04-10
KR20180134986A (en) 2018-12-19
US20170301524A1 (en) 2017-10-19
TW201743379A (en) 2017-12-16
CN108701583B (en) 2023-12-01
CN108701583A (en) 2018-10-23
US11114285B2 (en) 2021-09-07

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