SG11201702467QA - Support substrate for display, color filter employing same and method for manufacturing same, organic led element and method for manufacturing same, and flexible organic el display - Google Patents

Support substrate for display, color filter employing same and method for manufacturing same, organic led element and method for manufacturing same, and flexible organic el display

Info

Publication number
SG11201702467QA
SG11201702467QA SG11201702467QA SG11201702467QA SG11201702467QA SG 11201702467Q A SG11201702467Q A SG 11201702467QA SG 11201702467Q A SG11201702467Q A SG 11201702467QA SG 11201702467Q A SG11201702467Q A SG 11201702467QA SG 11201702467Q A SG11201702467Q A SG 11201702467QA
Authority
SG
Singapore
Prior art keywords
display
same
manufacturing same
organic
color filter
Prior art date
Application number
SG11201702467QA
Inventor
Akinori Saeki
Junji Wakita
Harushi Nonaka
Yoshinori Matoba
Masahito Nishiyama
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014200266A external-priority patent/JP6503674B2/en
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201702467QA publication Critical patent/SG11201702467QA/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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    • G—PHYSICS
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    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
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SG11201702467QA 2014-09-30 2015-09-25 Support substrate for display, color filter employing same and method for manufacturing same, organic led element and method for manufacturing same, and flexible organic el display SG11201702467QA (en)

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Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101730537B1 (en) * 2015-11-30 2017-04-26 엘지디스플레이 주식회사 Display device and method for manufacturing the same
DE112017001717B4 (en) * 2016-03-31 2019-12-24 Sony Corporation DISPLAY DEVICE AND ELECTRONIC DEVICE
JP7003914B2 (en) * 2016-05-02 2022-02-10 三菱瓦斯化学株式会社 Polyimide resin, polyimide resin composition, and polyimide film
JP6917187B2 (en) * 2016-05-10 2021-08-11 住友化学株式会社 Optical film and flexible devices using it
WO2017221776A1 (en) * 2016-06-24 2017-12-28 東レ株式会社 Polyimide resin, polyimide resin composition, touch panel using same, method for producing said touch panel, color filter, method for producing color filter, liquid crystal element, method for producing liquid crystal element, organic el element, and method for producing organic el element
KR102554183B1 (en) 2016-07-29 2023-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Separation method, display device, display module, and electronic device
US10930710B2 (en) * 2017-05-04 2021-02-23 Apple Inc. Display with nanostructure angle-of-view adjustment structures
KR102070942B1 (en) * 2017-06-30 2020-01-29 주식회사 엘지화학 Polyimide-based block copolymers and polyimide-based film comprising the same
CN110945079B (en) 2017-08-02 2022-10-28 旭化成株式会社 Polyimide varnish and method for producing same
EP3702377A4 (en) * 2017-10-26 2021-08-25 Mitsui Chemicals, Inc. Curable composition
CN111279230B (en) * 2017-12-04 2022-07-01 东丽株式会社 Substrate, resin composition for preventing light diffusion, and image display device
KR102198801B1 (en) * 2017-12-07 2021-01-05 삼성에스디아이 주식회사 Color conversion panel and manufacturing method thereof
CN108107639B (en) * 2017-12-29 2020-05-19 南京优写智能科技有限公司 Preparation method of high-conductivity liquid crystal dimming film
JP2019121734A (en) 2018-01-10 2019-07-22 株式会社Ｊｏｌｅｄ Semiconductor device and display device
CN108365119A (en) * 2018-02-07 2018-08-03 上海瀚莅电子科技有限公司 Microdisplay on silicon and preparation method thereof
KR102223837B1 (en) * 2018-06-21 2021-03-04 주식회사 엘지화학 Branched copolymer, and photosensitive resin composition, photosensitive resin film, optical device using the same
WO2020024181A1 (en) * 2018-08-01 2020-02-06 深圳市柔宇科技有限公司 Display device and preparation method therefor
CN110112192B (en) * 2019-04-29 2021-07-13 云谷（固安）科技有限公司 Organic light-emitting display module and electronic equipment
WO2020262419A1 (en) * 2019-06-26 2020-12-30 日産化学株式会社 Charge-transporting varnish
CN114144467B (en) * 2019-06-28 2023-05-23 三菱瓦斯化学株式会社 Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate, and semiconductor device
CN112631005B (en) * 2019-10-08 2024-06-11 群创光电股份有限公司 Display device
JP7398934B2 (en) * 2019-11-22 2023-12-15 エルジー・ケム・リミテッド Support substrate for display device, organic EL display device, and method for manufacturing organic EL display device
CN111403335A (en) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 Display device and manufacturing method thereof
CN111430428B (en) * 2020-04-10 2023-02-07 京东方科技集团股份有限公司 Flexible display panel, manufacturing method thereof and display device
CN118175896A (en) 2020-07-31 2024-06-11 群创光电股份有限公司 Electronic device
CN115210320A (en) * 2020-09-21 2022-10-18 株式会社Lg化学 Composite substrate for manufacturing flexible display device, method for manufacturing flexible display device using same, and laminate for flexible display device
CN116348296B (en) * 2020-10-22 2024-10-29 株式会社钟化 Polyamic acid, polyamic acid solution, polyimide film, laminate, electronic device, and method for producing polyimide film
CN112859517A (en) * 2020-12-25 2021-05-28 吉林奥来德光电材料股份有限公司 Photosensitive resin composition and application thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000292635A (en) * 1999-04-02 2000-10-20 Reiko Udagawa Fluorinated polyimide resin and light waveguide using these
JP4525903B2 (en) 2004-05-26 2010-08-18 三菱瓦斯化学株式会社 Color filter substrate
JP4629367B2 (en) * 2004-05-31 2011-02-09 東レ・ダウコーニング株式会社 Active energy ray-curable organopolysiloxane resin composition, optical transmission member and method for producing the same
JP2006063133A (en) 2004-08-25 2006-03-09 Fuji Photo Film Co Ltd Optical film and image display device
JP5092426B2 (en) 2006-07-21 2012-12-05 東レ株式会社 RESIN COMPOSITION FOR retardation film, color filter substrate for liquid crystal display device, liquid crystal display device, and method for producing color filter substrate for liquid crystal display device with retardation film
JP4802934B2 (en) * 2006-08-18 2011-10-26 新日本理化株式会社 Alicyclic polyimide copolymer and method for producing the same
JP5298760B2 (en) 2008-10-21 2013-09-25 日立化成株式会社 Insulator film, resin composition, and display device
KR20120059512A (en) * 2009-08-27 2012-06-08 아사히 가라스 가부시키가이샤 Multilayer structure with flexible base material and support, panel for use in electronic device provided with support and production method for panel for use in electronic device
JP2011111596A (en) 2009-11-30 2011-06-09 Kaneka Corp Manufacturing method of polyimide film, and polyimide film
JP2011205177A (en) * 2010-03-24 2011-10-13 Sumitomo Electric Ind Ltd Base station device
KR102229681B1 (en) * 2010-07-22 2021-03-18 우베 고산 가부시키가이샤 Polyimide precursor, polyimide, and materials to be used in producing same
JP2012146905A (en) * 2011-01-14 2012-08-02 Kaneka Corp Utilization of soluble polyimide resin film
CN103732391B (en) * 2011-08-09 2015-10-21 三菱树脂株式会社 transparent laminated film
JP2013157228A (en) 2012-01-31 2013-08-15 Mitsui Chemicals Inc Organic el device, and manufacturing method therefor
US9403947B2 (en) 2012-06-19 2016-08-02 Nippon Steel & Sumikin Chemical Co., Ltd. Display device, method for manufacturing same, polyimide film for display device supporting bases, and method for producing polyimide film for display device supporting bases
JP6580808B2 (en) * 2012-06-19 2019-09-25 日鉄ケミカル＆マテリアル株式会社 Display device and manufacturing method thereof
JP5980019B2 (en) * 2012-07-09 2016-08-31 キヤノン株式会社 Image forming apparatus
JP6017890B2 (en) * 2012-08-29 2016-11-02 三菱樹脂株式会社 Transparent laminated film
JP2014151496A (en) * 2013-02-06 2014-08-25 Mitsubishi Plastics Inc Transparent laminated film and transparent substrate

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